Concept of connector flatness (coplanarity) inspection
The flatness (coplanarity) of the connector is an inspection that checks how well the tips of all terminals align on the same plane, requiring 3D measurements of the tip heights. In 2D images, you can only see bending, chipping, and dirt. The terminals are small and shiny due to plating, so the basic approach is to change the lighting angle when taking pictures to compensate for any deficiencies. [Key Points] - Flatness is assessed by checking if the tip heights of all terminals align on the same plane. - In 2D, you can see bending and chipping, while the amount of lifting is measured in 3D. - The small, shiny tips are photographed with increased lighting angles. *For detailed explanations, please refer to the technical notes and downloadable materials in the related links.*
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basic information
【Contents of this Technical Note】 ■ The flatness (coplanarity) of connectors refers to how well the heights of the terminal tips are aligned. ■ It is difficult to measure terminal lift because the tips are small, shiny, and cast shadows. ■ Terminal bending and chipping are viewed in 2D, while the amount of lift is assessed in 3D. ■ There are two approaches to capturing the height of the tips: viewing from the side and measuring in 3D from above. ■ Situations where flatness inspection is likely to reach its limits. ■ Separate the terminals that can be measured from those that cannot using the actual connector. 【Consultation】 We will confirm whether it can be measured or captured with the work at hand using the actual item. Please consult us with a photo.
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The technical notes can be read by anyone from the related links. We will discuss the costs of development and testing based on the details you provide.
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Applications/Examples of results
【Frequently Asked Questions】 Q. Can flatness be inspected using only 2D images? A. While bending or chipping of terminals can be seen in 2D, the amount of warping cannot be determined without measuring height. It is necessary to add height information, including methods that capture images from the side. Q. If we measure all units, will we meet the takt time? A. It depends on the range and method of measurement. We can reduce time by targeting only the tips of the terminals or measuring only suspicious items in 3D. We will determine the configuration by calculating backward from the takt time. Q. How should the reference plane be determined? A. It is common to choose a method that is close to the state when mounted on the circuit board. If there are drawings or agreements from the client, we will align with those. Measuring without a predetermined reference will lead to discrepancies in the numbers.
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We specialize in 2D and 3D inspection and measurement technologies using cameras. We possess a wide range of knowledge in optics, mechanics, electronics, and software, enabling us to provide technical support for both hardware and software. Not only do we have personnel with experience working as researchers at image inspection device manufacturers, major electronic component manufacturers, and universities, but we also have numerous successful implementations of developed products in actual production environments, making our ability to adapt advanced technology to on-site needs a strong point. Additionally, we are skilled not only in developing proprietary algorithms but also in using off-the-shelf products such as image processing controllers from Keyence and Omron, allowing us to excel in selecting and utilizing the most suitable equipment for specific needs. In recent years, while AI technology has garnered attention, there are cases where utilizing 2D and 3D technologies can be implemented more easily than AI, and cases where optical devices and mechanical jigs can improve performance and reduce software load. We offer services related to image systems, including "equipment selection," "implementation support," "performance improvement of existing equipment," "technology development," and "joint development," so please feel free to consult with us first.
