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  4. Semiconductor Manufacturing Equipment
  5. Other semiconductor manufacturing equipment
  6. ME-1000 Leaf-Type Spin Cleaning Device

ME-1000 Leaf-Type Spin Cleaning Device

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last updated:May 28, 2013

マック産業機器 テクノロジーセンター
マック産業機器 テクノロジーセンター
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This is a device that performs brush cleaning, ultrasonic cleaning, rinse cleaning, and N2 blow drying processes!

This is a space-saving, double-sided washable mechanism for a sheet-type spin cleaning device. It is easy to maintain and features high-speed spin drying and N2 drying, which reduces water marks. (Patent No. 3558543)

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ME-1000 Leaf-Type Spin Cleaning Device

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  • Related Link - http://www7.ocn.ne.jp/~mac/19422.html

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【Features】 Space-saving, easy maintenance High-speed, spin drying, and N2 drying reduce watermarks Mechanism with dual-side cleaning capability (Patent No. 3558543) Supported sample size: Ф225 or smaller - wafers, LCD glass, ceramic substrates, and others Work: (Ф225 Wafer, Liquid, Crystal, Ceramic) Cup diameter: Ф350 SUS316 Main body size: W900 × D950 × H1750

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Features Space-saving, easy maintenance High speed, spin drying, N2 drying, reducing watermarks Dual-sided cleaning mechanism (Patent No. 3558543) Device Specifications This device manually sets the target workpiece and performs brush cleaning, ultrasonic cleaning, rinse cleaning, and N2 blow drying through spin rotation. Compatible sample size: Φ225 or smaller - wafers, LCD glass, ceramic substrates, and others Work: (Φ225 Wafer, Liquid, Crystal, Ceramic) Cup size: Φ350 SUS316 Main body size: W900×D950×H1750

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ME-1000 Leaf-type Spin Cleaning Device

ME-1000 Leaf-type Spin Cleaning Device

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マック産業機器

マック産業機器 テクノロジーセンター

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July 2009: Received certification for a research and development plan related to the advancement of manufacturing infrastructure technology for small and medium-sized enterprises from the Ministry of Economy, Trade and Industry. June 2010: Began joint development with the National Institute of Advanced Industrial Science and Technology on glass etching for solar cells. February 2011: Ordered and received an 8-inch chemical cleaning system for the 3D semiconductor research center. July 2011: Contracted by Saitama Prefecture for the next-generation industry entry support project. November 2011: Developed an alkaline spin etching system. Specifications: For large substrates (300 mm square). February 2012: Completion of the next-generation industry entry support project in Saitama Prefecture. April 2012: Newly developed silicon wafer separator for solar cells.

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