Amkor Technology Portugal SA Portugal/／Electronic Components and Semiconductors
This is an introduction to Amkor Technology.
Wafer Level Packaging (WLP): Advanced packaging technology that supports high density and thinness MEMS and Sensor Technology: Assembly of various MEMS and sensors for automotive and IoT devices Wafer Bumping: Connection technology through fine bump formation Test Engineering: Providing reliability evaluation and testing solutions
Volkswagen Autoeuropa Portugal/／Automobiles and Transportation Equipment
Introducing Volkswagen Autoeuropa.
Automobile manufacturing