See Contract Services's detailed category ranking
[Free demo processing currently available] We mix the main agent and hardener under vacuum and apply it to prevent curing failure. We look forward to your requests for urethane resin potting!
High-temperature ion implantation suitable for the fabrication of devices such as SiC, as well as high-temperature annealing processes for dopant activation, are available!
We propose an extremely thin and highly flexible FPC.
More than 30 engineers! Experts in the design field will respond to your needs.
Mass production of copper coin printed circuit boards is possible for high-speed, high-frequency applications and high multilayer substrates. The unique copper coin structure achieves high heat dissipation.
Supporting the stable operation of communication equipment! Protecting electronic circuit boards from corrosion.
As a professional in custom power supplies, we respond to our customers' specifications and handle design and manufacturing.
We accept processing and production of steel materials for fences, regardless of whether they are iron or stainless steel.
We can accommodate the production of printed circuit boards with various specifications! FPC
Combining specialized design, next-generation materials, and the latest wiring technology to create new added value.
We provide consistent support from design to final product release! *We have a track record of adoption for the supercomputer "K".
Achieves high heat dissipation! A lightweight substrate with a highly thermally conductive copper plate embedded beneath the heat dissipation component.












![JSB_logo[上下に黒色文字の社名入り]_fix_0227.jpg](https://image.mono.ipros.com/public/company/pr/image/385/2072246/IPROS13985264989204152169.jpg?w=280&h=280)



























































































































