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3D circuit board [MID wiring (Molded Interconnect Device)] / substrate with embedded electronic components

Countermeasures for malfunction in high humidity environments. Waterproof measures in environments with water. For any issues related to circuit board design to circuit board assembly, please leave it to Time Giken.

High-temperature ion implantation suitable for the fabrication of devices such as SiC, as well as high-temperature annealing processes for dopant activation, are available!

Are you having trouble with COB and SMD on separate lines? Optimize costs and processes with consolidated mixed loading! *One-stop support from prototypes.

Combining specialized design, next-generation materials, and the latest wiring technology to create new added value.

It is a flexible circuit board that can be repeatedly stretched and contracted, and can follow deformation. FPC

Achieves high heat dissipation! A lightweight substrate with a highly thermally conductive copper plate embedded beneath the heat dissipation component.

Reverse engineering that reveals the information engineers want through accurate circuit restoration.