A light curing device that can dry and bake only the surface area without damaging substrates with low heat resistance!
Due to its modular embedded design, it is possible to flexibly assemble dedicated machines according to the required film formation methods. A compact thin-film experimental device that can accommodate various research applications.
Hot Wall Type Thermal CVD Equipment: A compact, high-performance CVD device ideal for fundamental research.
Max 1000℃, MFC maximum 3 systems, APC pressure control, compatible with 4" or 6" substrates, high vacuum annealing equipment (<5 × 10^-7 mbar)
Tabletop small-sized experimental furnace - space-saving with a maximum operating temperature of 2000℃! We also manufacture metal furnaces for reducing atmospheres.
The heat source uses a SiC heater! A high-purity annealing furnace that achieves high clean performance.
We provide total services from the design to maintenance of tungsten-molybdenum hot zones.
Rapid cooling mechanism after annealing! Introducing the high-speed heat treatment equipment from Annealsys.
300mm wafer-compatible polyimide cure, baking, low-temperature annealing, compatible with multilayer substrates. Thermal processing equipment for mass production of advanced electronic devices.
No warm-up/cool-down time. High-quality continuous annealing processing is possible.
Maximum substrate heating temperature of 1000℃! Reduces element loss specific to the substrate surface heating process!
Celebrating 97 years of excellence, Made in Germany electric welding machines!! Loved by heavy users and with numerous achievements in Japan!!
A Made in Germany electric welder boasting 97 years of establishment!! Loved by heavy users and has numerous achievements in Japan!!
Heat recovery type, low running cost, paint drying oven.
CVD, PVD (evaporation, sputtering, etc.) high vacuum, ultra-high temperature plate heater for wafer and small chip heating with excellent uniformity and reproducibility.
Providing total services from design to maintenance of tungsten-molybdenum hot zones.
Supports a maximum substrate size of 156mm x 156mm! Compatible with vacuum or atmospheric transport systems and can be equipped with a load lock.
Due to lamp heating, RTP and RTCVD processing is possible! Quartz tube-type chamber.
Supports tray transport! Achieves excellent substrate temperature distribution and gas flow method.
Super Tarl HT (high-temperature semi-cylindrical type, maximum furnace temperature 1675°C)
Processed products of high-temperature rare metals such as tungsten, molybdenum, and tantalum.
Heat recovery type, low running cost, hot air dryer for painting.
We will introduce a case where "Eco Keeper" was applied to an annealing furnace that was experiencing severe heat release and environmental deterioration!
Know-how in designing and manufacturing various devices! Powerful support with abundant knowledge and experience.
A lineup tailored to your needs! Film deposition equipment and annealing equipment using lamp heating.
A Comprehensive Explanation of the Benefits and Applications of Formic Acid Reduction (Manufactured by Unitec Japan)
You can achieve improved production efficiency and reduced cycle time.
Annealing of various materials is possible with far infrared rays! It can accommodate complex shapes and different material compositions.
Compact and space-saving! Ideal for research and development. Flexible configuration for purposes such as deposition, sputtering, and annealing.
6 to 8 inch ultra-high temperature wafer annealing equipment, a high-performance machine that widely accommodates various purposes from research and development to small-scale production.
Max 1000℃, maximum 3 systems for MFC, APC pressure control, compatible with 4" or 6" substrates, high vacuum annealing equipment (<5 × 10^-7 mbar)
Sputter Cathode and Co-evaporation Source Mixed Thin Film Experimental Device: Metal deposition, organic deposition, and sputter cathode installed in a compact frame.
Compact, space-saving, energy-efficient! High-performance ultra-high temperature experimental furnace for R&D.
Introduction of various experimental devices for research and development in semiconductors, electronic devices, fuel cells, displays, and thin film experiments.
Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace
6 to 8 inch ultra-high temperature wafer annealing equipment, a high-performance machine that widely supports various purposes from research and development to small-scale production.
A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as sputtering, EB (electron beam), and annealing.
Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.
Compact and space-saving! Ideal for research and development, flexible configuration for purposes such as deposition, sputtering, and annealing.
Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace
By achieving ultra-high temperature treatment and excellent temperature uniformity, batch processing of boule ingots and wafers is possible, minimizing defects and dislocations.
Why introduce the insulation material "Silsaam"? Here are its benefits explained.
We provide total services from the design to maintenance of tungsten-molybdenum hot zones.
We provide total services from the design to maintenance of tungsten-molybdenum hot zones.
Usable from R&D to mass production! Vertical furnace with automatic transport compatible with 3 to 6-inch wafers.
Turbo pump compatible! Low temperature (1100°C) / high temperature (1300°C) pyrometer.
Use case; EV battery development (online measurement of generated hydrogen) hydrogen jet turbine, ships. FC evaluation equipment, insulating oil, forklifts, nuclear power.
The metal retort external heat method improves sealability and reproducibility of the furnace atmosphere!
Utilizing hydrogen gas, stainless steel bright treatment is possible!
Wafer process-compatible full-scale production system for annealing, sintering, and polyimide curing, supporting high throughput with mini-batch and rapid cooling mechanism.
Uniform heating in atmospheric pressure hydrogen atmosphere. Providing flexible hard support and sample testing with abundant experience and track record for thin films, wafers, compound, and ceramic substrates.
Uniform heating and stable heating under high vacuum or atmospheric pressure; drying, degassing, baking, annealing; multipurpose mass-production vacuum oven.
Standard device for voidless soldering. Proven and reliable hardware and software supporting automotive power device modules.
A quartz tube type annealing device commonly used for alloying and reducing resistance of electrode films in compound semiconductors. It is a high-temperature processing type equipped with a rapid cooling mechanism. It is also compatible with transparent electrode films.
A compact heat treatment device characterized by rapid temperature rise and fall. It is an ideal compact vacuum heat treatment device for low-temperature heat treatment such as drying, degassing, and baking of organic substrates.
Supports small-diameter wafers (4 inches) and niche processes for compound semiconductors. Compatible with both crystal processes and wafer processes (alloying and electrode annealing).
A bestselling type with a wealth of achievements, supporting high-temperature soldering, paste sintering, and metal particle sintering processes with reliable software and highly dependable hardware.
A new model of Shinko Precision's vacuum soldering device has arrived, enhancing the quality of metal sintering joints with excellent thermal uniformity, temperature rise characteristics, and atmosphere control. This is a next-generation high-reliability sintering bonding device.
Expansion to advanced packages: Processing is possible on a 510×515mm substrate.
Ideal for research institutes and the electronics industry! High-temperature heating elements for clean processes.
Heater module for manufacturing a single wafer in the electronics and semiconductor industry!
Continuous conveyor type annealing furnace using far infrared heaters and uniform heating method.
Significantly reduce annealing time by effectively utilizing the radiant heat of far infrared heaters.
Continuous heating furnace ideal for annealing small parts such as mobile phone components and automotive parts.
Heating multiple wafers in a clean environment of Class 1 at a maximum temperature of 450°C with high temperature stability.
This is a tabletop electric furnace that can be used for research and experiments under vacuum or inert gas atmosphere. The sample stage is a lift-type with excellent operability, making sample exchange easy.
To remove residual stress, heat it at a constant temperature for a certain period of time, and then gradually lower the temperature to room temperature!
Introduction to anisotropic rare earth iron-based sintered magnets that achieve excellent magnetic properties while being free.
The furnace dimensions are 3.5m wide, 3.5m high, and 7.0m deep. It is capable of heat treatment for large workpieces!