Low elasticity makes bending of FPC easy. Contributes to thinner, lighter designs and increased design flexibility.
Compatible with low to high viscosity resists! We can manufacture equipment for any wafer size, from small diameter to large diameter!
A wide range of products from general ion-exchange type metal removal membranes to metal removal membranes specialized for semiconductor applications.
Proven results with a variety of chemical solutions! The reason for our low prices is that we handle everything in-house, from design to sales.
Compact & Resonable for Highend Process !
Polyethylene filters with a wide range of pore sizes suitable for various applications (including fine pore sizes equivalent to 1nm) and high purity.
From high pressure to mist-like soft pressure, it's all under control! A two-fluid spray resist development device. It is effective in shortening the development time for thick films and more.
We have a proven track record with a variety of chemical solutions! The reason for our low prices is that we handle everything in-house, from design to sales.
It is a semi-automatic lift-off device that is cheaper than an automatic machine and easier to use than a manual device.
Short-time peeling! With our unique special nozzle, we have achieved high-speed processing, high peeling power, and low chemical consumption for lift-off using high-pressure jets!
"Removal of metal and resist with ultra-high pressure jet" Achieve lift-off with high-speed processing, high stripping power, and low chemical consumption using the ASAP dedicated nozzle!
A large amount of developer dissolution (increased liquid lifespan)! Neo developer solution.
Excellent effectiveness for all water treatment issues! Gaining attention as a new water treatment agent for the 21st century! Simultaneously solving water quality purification and equipment maintenance!
Resist coater for cover glass integrated touch panel (OGS)
We explain our latest know-how, such as atomization methods and thin film formation methods, in an easy-to-understand manner for beginners.
The paint loss is extremely low, and it is compatible with the manufacturing lines for battery panels and glass.
After a thorough meeting, we will create a drying device that meets the customer's needs.
Meeting the high cleanliness standards required in the semiconductor and medical device fields. We carry out everything from precision cleaning to packaging and assembly in a consistent clean environment.
Comprehensive catalog of electronic component production systems, cold forging automotive parts, and coolant-related machinery.
Maximum processing size φ1000×500, short delivery time through process consolidation, high-precision machining of complex shapes using multi-surface approaches.
Contributing to the reduction of accounting tasks for clinics and pharmacies! *IT introduction subsidies (digitalization introduction type) available.
Total engineering partner in the semiconductor industry with over 2,000 achievements in the semiconductor field.
Multi-purpose fully automatic screen printing machine
Amazing peeling ability with high-pressure jets! Our unique special nozzle enables high-speed processing, high peeling power, and lift-off with low chemical consumption using sheet materials!
From silicon to compound semiconductors, from manual machines to mass production machines! Here is an introduction to our products!
Due to the sheet-type design, the reproducibility of the process is high, and the amount of chemical solution used is minimal. This is a resist development device that meets the needs for quality improvement and process stability!
It is a semi-automatic developer for customers who do not have a high enough production volume to purchase a fully automated machine but seek process reproducibility.
It is a compact resist development system for small-lot, multi-variety production and development applications. Unlike DIP, it can stabilize quality due to its sheet-fed design.
Keep the negative taper angle constant! This is an automatic resist development system compatible with post-exposure bake (PEB) required for negative resist and image reversal resist.
It is a single-fluid developing device that is effective in reducing the development and processing time of thick films. You can freely choose the spray shape (circular, fan, etc.), pressure, and flow rate.
Achieving swelling and high-pressure jet lift-off with high temperature, high peeling force, and low chemical consumption through a recycling-type circulation heater with a sheet-type design comparable to DIP!
Process multiple sizes of wafers without changing setups! The multi-size compatible device achieves high productivity with minimal downtime for lift-off operations!
Easy-to-operate CtoC robot transportable development/etching equipment. Both developer and etcher can be manufactured according to application.
A small tabletop type spin developer that can perform spray and paddle development.
Pursuing high quality, low price, and space-saving; a developer that supports both swing spray and paddle methods.
High-precision single-sided exposure equipment for flexible printed circuit boards (FPC).
High-precision double-sided exposure device for flexible printed circuit boards (FPC)
Semi-automatic exposure device with alignment for film that demonstrates its power in FPD manufacturing processes.
A highly productive and user-friendly aligner, such as a microscope auto-move.
The material width supports 35mm to 160mm for TAB/CSP/COF and 250mm to 300mm for FPC!
PowerCEP GEM300-compatible equipment control software development package
"Best Washing" does not discriminate against dirt. It is a powerful detergent that is gentle on the environment, versatile in use, and a completely new high-performance detergent.