High-performance laser lithography equipment for research and development.
High-speed high-resolution laser exposure device
Maximum 50W ultra-high output. LED irradiator as a replacement for mercury lamps. Usable for UV curing, semiconductor inspection equipment, and more.
High-speed maskless aligner capable of fine drawing at 0.6μm.
We specialize in processing sizes from 500 to 1200 mm and can guarantee precision in the 1000s range. Please feel free to consult with us first.
A two-phase motor driver that rotates very smoothly up to a maximum of 1/200.
We provide service for Canon FPA3000 and Nikon NSR.
High-speed semiconductor mask laser drawing device 'ULTRA'
Manual exposure machine compatible with up to 4-inch square substrates.
Maximum processing size φ1000×500, short delivery time through process consolidation, high-precision machining of complex shapes using multi-surface approaches.
Before cutting is the key factor. We focus on specification confirmation, proposal of construction methods, process and jig design, tool selection, program creation, and machining simulation.
We can perform excavations up to a maximum diameter of 1000 mm and a depth of 600 mm. We are committed to providing products that prioritize not only precision but also aesthetics.
We handle all types of casting processing, including sand casting, mold casting, die casting, and gypsum casting, with a maximum size of 900×900×1000 mm.
Coating equipment for manufacturing functional films for Flexible Displays.
Leave the technical services for semiconductor manufacturing equipment to us.
Wafer size post-process projection exposure equipment MRS adopts UV-LED light source as the standard light source (enabling reduction of running costs without sacrificing productivity!)
LED/LD hybrid wave lens: high speed, high production capacity, and high cost performance.
A five-phase stepper motor driver with good high-speed torque characteristics.
2-phase bipolar micro-stepping driver "PMB212C"
5-phase AC power micro-stepping motor driver "5D1AM"
We can provide a wide range of proposals tailored to your needs.
Single-phase/three-phase specifications, compatible with high currents. Used for high-frequency noise countermeasures (up to 1GHz).
High-output, high-stability LED light source device. High-power UV output up to 30W, mercury-free, with selectable built-in LEDs.
High-output and high-stability LED light source device. High-power UV output up to 30W, mercury-free, with selectable built-in LEDs!
High-output, high-stability LED light source device. High-power UV output up to 15W, mercury-free, with selectable built-in LEDs.
A high-output, high-stability LED light source device capable of mounting multiple modules of the same wavelength. Maximum high-power UV output of 80W, mercury-free.
This is an introduction to various lamps that showcase the culmination of development and application capabilities in light sources and optical system technology.
Both-side alignment and the ability for proximity and soft contact exposure are possible.
Device for forming circuits on flexible printed circuit boards (FPC).
Equipped with an image processing automatic alignment system using a CCD camera.
It is a high-precision exposure device equipped with a Fresnel lens.
A highly productive and user-friendly aligner, such as a microscope auto-move.
Low-vibration stepping driver integrated from single axis to three axes.
Non-contact transport of ultra-thin glass substrates with a thickness of 50μm - Non-contact transport device "50μm Thick Ultra-Thin Glass Non-Contact Transport Device LNAS Type"
Prolonging use, maintenance improvement, and system maintenance of semiconductor manufacturing equipment that are no longer supported. Control device life-prolonging treatment of aging, and expensive semiconductor manufacturing equipment.
Compatible with substrates up to 8 inches and supports semi-auto alignment exposure equipment.