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  1. Home
  2. Product Ranking
  3. Weekly views ranking by Molding Equipment

Molding Equipment Weekly Product Rankings

Last Updated:08 01, 2026 Aggregation Period:31 12, 2025〜06 01, 2026
This ranking is based on the number of page views on our site.

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Semiconductor encapsulation resin "Mold Laser Cleaner" サマック

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Semiconductor Encapsulation Resin Mold Dedicated "Mold Laser Cleaner"

  • Molding Equipment
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Hot melt dedicated low-pressure molding machine 'MK600' 松本加工

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"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for sealing electrical components against water.

  • Molding Equipment
  • Other electronic parts
  • Coating Agent
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2-component dispenser (2-component resin automatic measuring, mixing, and dispensing device) MAK series エムアンドケー 本社・工場

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This device enables vacuum degassing, temperature control, automatic measuring, mixing, and precise dispensing of two-component resins such as polyurethane, epoxy, and silicone!

  • Mixer/agitator
  • Molding Equipment
  • dispenser
4
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Automolding device "Across R2-140" エヌ.エフ.ティ

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All view & easy access! Servo clamp 140 ton automatic molding device.

  • Other semiconductor manufacturing equipment
  • Molding Equipment
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Semiconductor Auto-Mold Device "Across2byX" エヌ.エフ.ティ

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Molding machine that maximizes productivity to the limit.

  • Molding Equipment
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Hot melt dedicated shuttle stage low-pressure molding machine 'MK520' 松本加工

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"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.

  • Molding Equipment
  • Other electronic parts
  • Coating Agent
4
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Hot melt dedicated low-pressure molding machine 'MK700H' 松本加工

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Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! Hot melt molding is gaining attention for the waterproof sealing of electrical components.

  • Coating Agent
  • Other electronic parts
  • Molding Equipment
4
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Innovative hot melt molding technology ノードソン

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Achieving high-speed and low-cost encapsulation and molding of electrical components and electronic substrates.

  • Molding Equipment
9
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Automolding device "Across R2-60" エヌ.エフ.ティ

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All view & easy access! Servo clamp 60 ton automatic molding device.

  • Other semiconductor manufacturing equipment
  • Molding Equipment
9
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Automatic Molding Device "Across R2-100" エヌ.エフ.ティ

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All-view & easy access! 100-ton servo clamp automatic molding device.

  • Other semiconductor manufacturing equipment
  • Molding Equipment
9
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Juuou Corporation - Company and Product Information 十王

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365 days a year, 24 hours a day service system! We will rush to you whenever you need us.

  • Molding Equipment
  • Heating device
9
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Packaging Process System Woyton Technologies

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We will provide suitable proposals for the packaging process design that you desire!

  • Wafer processing/polishing equipment
  • Molding Equipment
  • Other semiconductor manufacturing equipment
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Hot melt molding mold ■■Matsumoto Processing■■ 松本加工

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"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.

  • Other polymer materials
  • Coating Agent
  • Molding Equipment
9
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Hot melt molding machine for waterproofing and dustproofing of circuit boards - Matsumoto Processing 松本加工

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【Hot Melt Molding Machine】 ▼From low-cost tabletop devices to mass production machines▼ ▼Many actual machines on display at the prototype lab (Fuji City)▼

  • Other polymer materials
  • Molding Equipment
  • Coating Agent
9
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Hot melt dedicated low-pressure molding machine 'MK10' 松本加工

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Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! Hot melt molding is gaining attention for the waterproof sealing of electrical components.

  • Coating Agent
  • Other electronic parts
  • Molding Equipment
9
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Hot Melt Melter 'MK-MELTER' 松本加工

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Choose tank capacity according to usage conditions! Introducing a low-cost hot melt melter.

  • Molding Equipment
  • Other electronic parts
  • Coating Agent
9
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Reactive Hot Melt Applicator PS20 Nonstop Plus ファスト

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PUR hot melt applicator

  • Molding Equipment
  • glue
  • Other packaging machines
9
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High-frequency preheater 富士電波工機 第1機器部

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High-frequency preheater

  • Resin processing machine
  • Other heaters
  • Molding Equipment
9
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Atmospheric Pressure Plasma Device MyPL Series ウェル

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High-density plasma is generated over a large area by the unique reactor head!

  • Plasma surface treatment equipment
  • Molding Equipment
  • Circuit board processing machine
9
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Atmospheric Pressure Plasma Device MyPL-Auto Series ウェル

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High-density plasma is generated over a large area by a unique reactor head!

  • Plasma surface treatment equipment
  • Molding Equipment
  • Circuit board processing machine
9
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Atmospheric Pressure Plasma Device ILP-Inline Series ウェル

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High-density plasma is generated over a large area by the unique reactor head!

  • Molding Equipment
  • Circuit board processing machine
  • Plasma surface treatment equipment
9
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Semiconductor Tester Laser Cleaning System サマック

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Logic laser cleaning system! Probe card cleaning available.

  • Molding Equipment
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Damper rubber [Boushin rubber] エスケー

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Control of vibrations for all devices. Stable vibration support can be provided as vibration-damping rubber. Manufacturing of vibration-damping component molded products.

  • Rubber
  • Other semiconductor manufacturing equipment
  • Molding Equipment
9
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High-thrust air cylinder "Power Pack Cylinder" ヒロタカ精機

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A high-thrust air cylinder that integrates a hydraulic cylinder and an air-hydraulic conversion booster device in a compact form.

  • Hydraulic Equipment
  • Molding Equipment
  • Other machine elements
9
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Molding System "Hot Melt Molding" ノードソン

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Hot melt application system for protecting and waterproofing electrical components and electronic circuit boards.

  • Molding Equipment
9
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Precision parts for semiconductor manufacturing equipment, Osaka, machining processing. フィリール 本社

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Precision parts for semiconductor manufacturing equipment in Osaka - Stainless steel processing [Leave cost reduction to Philir Co., Ltd.]

  • Other semiconductor manufacturing equipment
  • Etching Equipment
  • Molding Equipment
9
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Fry pocket processing - S45C plate material フィリール 本社

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Machining / Polishing

  • CMP Equipment
  • Molding Equipment
9
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For temporary bonding and adhesive applications: Small hot melt applicator. サンツール 本社

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Used for temporary fixing and bonding with hot melt adhesive!

  • Molding Equipment

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