Compact lead-free compatible machine. Number of heating zones: 6. Device length: 1,590mm.
Compact lead-free compatible machine. Suitable not only for mass production but also for cell production, evaluation, and research and development purposes!
Smooth transfer from conveyor to conveyor! Height adjustment available.
300mm square compatible model. Can be linked with loaders and unloaders for mass production. Made by Unitec Japan.
Finally on sale! ~Ultra-compact vacuum reflow oven~
Formic acid and hydrogen reduction compatible! Desktop type that can accommodate substrates up to 200mm x 200mm.
This product is a portable tabletop size. Since prototype boards can be made without outsourcing, the lead time is effectively zero! It is capable of producing single-sided and double-sided boards!
Germany's ERSA company presents the world-recognized high-quality reflow equipment 'HOTFLOW 3 Series' that maximizes cost-effectiveness to the limit.
A high-performance eco machine that pursues the coexistence of reflow performance and eco-friendliness. *Free distribution of the handbook "Characteristics of Far Infrared Reflow" is ongoing!
Compact lead-free compatible device. Number of heating zones: 6. Device length: 2,995mm.
Compact lead-free compatible device. Number of heating zones: 6. Device length: 2,900mm.
Top and bottom heating, supports heating up to 400℃, tabletop reflow furnace (heating furnace).
Standard device for voidless soldering. Proven and reliable hardware and software supporting automotive power device modules.
Solving issues such as storage and supply stability, wettability, and heat resistance! Next-generation environmental compatibility!
The world's smallest class reflow oven (TRF-95) is finally on sale! ~ A compact reflow oven for easy and convenient use in labs or at home ~
High-capacity, high-efficiency flux recovery! N2 reflow equipment with precise and high-quality heating performance.
Presenting case studies on problem-solving! Achieving high-reliability implementation with zero voids and zero flux residue through formic acid reduction. Suitable for mass production with rapid heating and cooling!
Supports both formic acid gas and hydrogen gas reduction! Achieves lead-free, voidless, and flux-free!
Multi-functional with a touch panel! One unit can handle various reflows such as air, nitrogen, vacuum, formic acid, and hydrogen!
Compatible with 100V power supply! A compact model that is among the smallest in the industry, compatible with Φ4 inch and 100mm square!
Dual support for formic acid gas and hydrogen gas reduction! A multifunctional solder reflow device equipped with a touch panel!
Standard model that achieves high-reliability mounting such as fluxless, void-free, and lead-free. Made by Unitec Japan.
Standard model achieving high-reliability assembly such as fluxless, void-free, and lead-free. Manufactured by Unitec Japan.
N2 reflow device N2 reflow - SMT REFLOW
Strongly supporting the implementation line! We create necessary printed backup boards, transport carriers, and splitting jigs from design to processing in a short delivery time!
N2 reflow system for solder bump formation compatible with 6.8-inch wafers
Introducing the production equipment of VEMS Co., Ltd. compatible with a substrate size of L500×W400!
Formic acid molecules approach the work surface and actively remove (reduce) the oxide film.
A reflow device with high uniformity and low running costs.
[Heat Resistant 260℃] Reusable adhesive jig! Improves efficiency in the transport process of thin substrates and small components, contributing to SDGs! Samples available now!
It is possible to observe and preserve the state of the sample in a heated condition.
Compact lead-free compatible device. Number of heating zones: 8. Device length: 3,650mm.
Compact lead-free compatible machine. Number of heating zones: 8. Equipment length: 3,650mm.
Opportunity to introduce a new reflow oven at the same price as a used reflow oven!
Compact lead-free compatible device. Ideal for mass production of consumer electronics, industrial equipment, and EMS applications in diverse manufacturing environments!
Adopts a heating method that combines hot air circulation and far infrared rays. It is an energy-saving, lead-free compatible device.
A high-performance eco machine that pursues the coexistence of reflow performance and eco-friendliness. *Free handbook "Characteristics of Far Infrared Reflow" available now!
Tabletop reflow furnace (heating furnace) compatible with heating up to 400℃.
Attention quality control and production management departments! We will introduce the verification results of vacuum pressure reflow, which is effective in reducing voids.
The standard vacuum reflow device with the number one domestic track record! <Sample tests now accepting applications>
A bestselling type with a wealth of achievements, supporting high-temperature soldering, paste sintering, and metal particle sintering processes with reliable software and highly dependable hardware.
Achieve easy maintenance with a special filter! You can switch between hot air, warm air, and warm air + far infrared!
Decomposing flux with a special far-infrared panel heater to prevent sticking inside the furnace!
Durable, low evaporation, long-lasting, minimal sludge generation, long-selling high-temperature synthetic lubricant.
Maintenance can be performed in a short time! This is a reflow oven that also takes environmental harmony into consideration.
N2 flow management performance is improved! Capable of supporting specifications beyond the basics with high performance and low cost.
Aiming to improve reliability! Providing proposals that enhance added value and total services.
Stainless steel / SUS304 / lathe processing / CNC lathe
Since it is pallet transport, it can reduce substrate warping. It can be used on the back side with a flexible pin.
Adopting a heating method using near-infrared! It allows for the observation of the reflow state while measuring oxygen concentration.
RoHS compliant lead-free solder compatible reflow oven
Supports both formic acid reduction and hydrogen reduction! A compact tabletop reflow device that achieves flux-free and void-free results is featured in many listings.
Solve it with the Unitemp reflow device! Vacuum (decompression) is possible even when the chamber is at high temperature after reaching the melting point!
Solve it with the Unitemp reflow device! Reducing gas works by reacting with the oxygen on the metal surface to restore it to its original state without an oxide film!
Solved with the Unitemp reflow device! Significant high-speed cooling! A cooling rate of nearly 3°C per second from solder melting to solidification!
Solve it with the Unitemp reflow device! Achieve rapid heating! No more worries about damage from unexpected temperatures!
We can accommodate from BGA packages to 12” wafers!
A super high-speed heating model capable of a maximum heating rate of 600 K/min, suitable for metal sintering. Manufactured by Unitemp Japan.
Standard model that achieves high-reliability implementation such as fluxless, void-free, and lead-free. Manufactured by Unitec Japan.
We will repair and extend the life of electronic devices whose manufacturer's warranty has expired, based on the experience and know-how cultivated over many years in power supply manufacturing and industrial computer manufacturing.
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Shortest half-day estimate / Aluminum / A5052 (general-purpose aluminum) / Flange / Composite lathe processing + black anodizing
Implementation without flux is possible through formic acid reduction. There is the advantage of not having to worry about future risks associated with the use of flux.
Lead-free small-sized mounting board compatible compact N2 reflow device
M size (W260) PCB compatible lead-free nitrogen reflow oven
N2 reflow system for forming solder bumps compatible with 200-300mm wafers
Void processing for power module metal substrate reflow is possible!
This is a batch-type vacuum reflow furnace compatible with voidless and fluxless reflow. We offer a variety of lineups that support everything from development to mass production.
Introduction of Aitec's new implementation equipment lineup.
Equipped with our unique decomposition processing unit! Completely neutralizes formic acid in exhaust.
No need to transfer formic acid to a dedicated tank! You can use the bottles or tanks prepared by the customer as they are.
For lead-free soldering compliant with RoHS regulations, including flow soldering and reflow soldering, as well as assembly of electronic machinery, [catalog available].
Simple experimental device with single head specification IH spot reflow system!
Heater chips and heater tools compatible with major manufacturer pulse heat power supplies.
Batch-type vacuum pressure reflow that supports next-generation processes and achieves voidless results.
We handle a variety of reflow devices that can achieve stable temperature processes.
[Heat Resistant 260℃] Reusable adhesive carrier! Contributes to improving efficiency in the transport process of thin products and small parts, as well as reducing defects! Samples are currently available!
The furnace length is short and the temperature can be adjusted up and down, making it suitable for data collection before mass production!
Improving line productivity with masking protection for flux residues from soldering equipment, compatible with aqueous environments.
Compact lead-free compatible furnace. Number of heating zones: 3. Device length: 780mm.
Compact lead-free compatible machine. Number of heating zones: 6. Equipment length: 3,250mm.
Attention implementation engineers!! "Characteristics of far-infrared reflow" is available for free!!
"I want to know the recent profile trends!" "I want to see examples of solder evaluation!" We will directly solve your problems related to soldering!
A large-capacity preheating unit that supports extremely thick large PCBs. Are you having trouble with insufficient thermal capacity in your current preheater?
With technical data included, significantly reduces void ratio under a maximum pressure of 0.4 MPa. Improves process efficiency with rapid cooling. Compatible with fluxless soldering.
Heating settings up to 450℃, compatible with formic acid reduction processes, standard equipped with substrate cooling function.
Achieving fluxless, voidless reflow from power modules to wafer bumps. New model launched for upgraded quality! *Currently supporting sample testing.
A new model of Shinko Precision's vacuum soldering device has arrived, enhancing the quality of metal sintering joints with excellent thermal uniformity, temperature rise characteristics, and atmosphere control. This is a next-generation high-reliability sintering bonding device.
Exhibiting at Internepcon! Introducing new products that accommodate large-scale products. <Sample testing now available>
Large substrate-compatible vacuum and reducing atmosphere sintering furnace │ Capable of multi-purpose processing such as soldering, sintering bonding, and Cu via firing.
High-efficiency insulation structure (inner jacket)! Prevents chip standing by balancing far infrared rays and warm air!
Held from June 4 (Wednesday) to June 6 (Friday), 2025! We plan to showcase new products at the exhibition venue.
Basic knowledge of high-temperature lubricants and a wealth of practical information. Recommended lubricants for each specific issue will also be introduced.
RoHS2 compliant, high-power heater 1,000W. Comes with a dedicated stand that automatically turns off the heater to prevent forgetting to turn it off.
It can be used for various applications, from solder formation on the wafer to soldering of semiconductor chips, and even large-area soldering for power devices.