Maintenance can be performed in a short time! This is a reflow oven that also takes environmental harmony into consideration.
Compact lead-free compatible machine. Suitable not only for mass production but also for cell production, evaluation, and research and development purposes!
It can be used for various applications, from solder formation on the wafer to soldering of semiconductor chips, and even large-area soldering for power devices.
Smooth transfer from conveyor to conveyor! Height adjustment available.
Compact lead-free compatible device. Number of heating zones: 6. Device length: 2,900mm.
[Heat Resistant 260℃] Reusable adhesive jig! Improves efficiency in the transport process of thin substrates and small components, contributing to SDGs! Samples available now!
Compact lead-free compatible machine. Number of heating zones: 6. Device length: 1,590mm.
Solving issues such as storage and supply stability, wettability, and heat resistance! Next-generation environmental compatibility!
Top and bottom heating, supports heating up to 400℃, tabletop reflow furnace (heating furnace).
Finally on sale! ~Ultra-compact vacuum reflow oven~
Solve it with the Unitemp reflow device! Achieve rapid heating! No more worries about damage from unexpected temperatures!
Compact lead-free compatible device. Number of heating zones: 8. Device length: 3,650mm.
Weighing 390g, it is compact and lightweight, and can measure wind speed and temperature at a low cost! Analog wind speed and temperature converter.
High-capacity, high-efficiency flux recovery! N2 reflow equipment with precise and high-quality heating performance.
Supports both formic acid reduction and hydrogen reduction! A compact tabletop reflow device that achieves flux-free and void-free results is featured in many listings.
Formic acid and hydrogen reduction compatible! Desktop type that can accommodate substrates up to 200mm x 200mm.
Presenting case studies on problem-solving! Achieving high-reliability implementation with zero voids and zero flux residue through formic acid reduction. Suitable for mass production with rapid heating and cooling!
Supports both formic acid gas and hydrogen gas reduction! Achieves lead-free, voidless, and flux-free!
Multi-functional with a touch panel! One unit can handle various reflows such as air, nitrogen, vacuum, formic acid, and hydrogen!
Compatible with 100V power supply! A compact model that is among the smallest in the industry, compatible with Φ4 inch and 100mm square!
Dual support for formic acid gas and hydrogen gas reduction! A multifunctional solder reflow device equipped with a touch panel!
Solve it with the Unitemp reflow device! Vacuum (decompression) is possible even when the chamber is at high temperature after reaching the melting point!
Solve it with the Unitemp reflow device! Reducing gas works by reacting with the oxygen on the metal surface to restore it to its original state without an oxide film!
Solved with the Unitemp reflow device! Significant high-speed cooling! A cooling rate of nearly 3°C per second from solder melting to solidification!
N2 reflow device N2 reflow - SMT REFLOW
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Shortest half-day estimate / Aluminum / A5052 (general-purpose aluminum) / Flange / Composite lathe processing + black anodizing
We will repair and extend the life of electronic devices whose manufacturer's warranty has expired, based on the experience and know-how cultivated over many years in power supply manufacturing and industrial computer manufacturing.
Adopting a heating method using near-infrared! It allows for the observation of the reflow state while measuring oxygen concentration.
Achieves performance equivalent to that of large conveyor-type reflow ovens while being a space-saving tabletop type.
Automating the processes that have had to be done manually until now! Revamping the image of the factory line!
Introduction of Aitec's new implementation equipment lineup.
Introducing the production equipment of VEMS Co., Ltd. compatible with a substrate size of L500×W400!
Strongly supporting the implementation line! We create necessary printed backup boards, transport carriers, and splitting jigs from design to processing in a short delivery time!
Lead-free small-sized mounting board compatible compact N2 reflow device
M size (W260) PCB compatible lead-free nitrogen reflow oven
N2 reflow system for solder bump formation compatible with 6.8-inch wafers
N2 reflow system for forming solder bumps compatible with 200-300mm wafers
Void processing for power module metal substrate reflow is possible!
It is possible to observe and preserve the state of the sample in a heated condition.
Compact lead-free compatible furnace. Number of heating zones: 3. Device length: 780mm.
A high-performance eco machine that pursues the coexistence of reflow performance and eco-friendliness. *Free distribution of the handbook "Characteristics of Far Infrared Reflow" is ongoing!
Compact lead-free compatible machine. Number of heating zones: 8. Equipment length: 3,650mm.
Opportunity to introduce a new reflow oven at the same price as a used reflow oven!
Attention implementation engineers!! "Characteristics of far-infrared reflow" is available for free!!
Adopts a heating method that combines hot air circulation and far infrared rays. It is an energy-saving, lead-free compatible device.
Germany's ERSA company presents the world-recognized high-quality reflow equipment 'HOTFLOW 3 Series' that maximizes cost-effectiveness to the limit.
Improving line productivity with masking protection for flux residues from soldering equipment, compatible with aqueous environments.
[Heat Resistant 260℃] Reusable adhesive carrier! Contributes to improving efficiency in the transport process of thin products and small parts, as well as reducing defects! Samples are currently available!
A large-capacity preheating unit that supports extremely thick large PCBs. Are you having trouble with insufficient thermal capacity in your current preheater?
Tabletop reflow furnace (heating furnace) compatible with heating up to 400℃.
The unique reverse flow method and high-performance filter technology reliably capture harmful substances.
With technical data included, significantly reduces void ratio under a maximum pressure of 0.4 MPa. Improves process efficiency with rapid cooling. Compatible with fluxless soldering.
Attention quality control and production management departments! We will introduce the verification results of vacuum pressure reflow, which is effective in reducing voids.
Heating settings up to 450℃, compatible with formic acid reduction processes, standard equipped with substrate cooling function.
RoHS2 compliant, high-power heater 1,000W. Comes with a dedicated stand that automatically turns off the heater to prevent forgetting to turn it off.
A service to evaluate and verify stable solder connection conditions through experimentation.
Simple experimental device with single head specification IH spot reflow system!
Since it is pallet transport, it can reduce substrate warping. It can be used on the back side with a flexible pin.
Aiming to improve reliability! Providing proposals that enhance added value and total services.
The world's smallest class reflow oven (TRF-95) is finally on sale! ~ A compact reflow oven for easy and convenient use in labs or at home ~
Our factory line supports prototype, small quantity, and high-difficulty products! Introducing the pre-process and post-process of component mounting!
Our company will fully support your needs with our high level of equipment technology!
Simple height adjustment for the labyrinth! Low-power N2 reflow device designed with consideration for the environment and your wallet.
Standard equipped with a large air-cooled cooling recovery unit! Ultra-low power consumption N2 reflow device.
Ultra-low power consumption that promotes energy saving! Lightweight and compact air flow device.
High insulation for low-temperature coverage! Low-cost, low-power air flow device.