Introducing our substrate specifications, including MCL-E-67 and R-1766!
Renewal! The world's first hybrid laser printed circuit board processing machine.
Domestic ultra-compact pen-type atmospheric plasma device suitable for fine processing and laboratory applications! It can be easily used at an affordable price.
For cutting a wide range of materials such as ceramics, metals, electronic components, and composites. Increased work efficiency with open-type doors! Adjustable cutting length with a movable table.
Ideal for HC sheet replacement.
The industry's top model for prototype printed circuit board processing machines! From complex circuits to RF and high-frequency applications.
LPKF's UV laser circuit board processing machine that accommodates the most diverse materials.
Professional multilayer board creation in-house and in the lab.
We offer contract processing of hard and brittle materials (Si, quartz glass, ceramics) and propose, design, and manufacture specialized processing machines tailored to your needs!
Batch-type plasma ashing device for 50 wafers at once.
High-speed, high-precision drilling and routing machine that meets all processing needs.
USB camera functionality improved! The board-splitting robot has become easier to use.
High-density plasma is generated over a large area by the unique reactor head!
Significantly shorten production takt time with high-speed, three-axis drive! It can safely cut without putting stress on the mounted circuit board! *Test cutting currently accepted.
Specialist in difficult-to-process materials: LPKF's picosecond laser circuit board processing machine.
[Parts Repair/Repair/Reimplementation] Stable and safe rework operations! Rework system compatible with lead-free solder.
A new microball system that meets individual piece needs! Reduces ball consumption.
High-quality fine printing compatible with a wide range of materials! Printing in limited spaces becomes possible, enhancing the freedom of PCB design.
Low stress with a sandwiching method from above and below! Compatible with large element-mounted substrates.
It is a fiber laser oscillator that achieves high peak power! It flexibly accommodates applications such as precision welding and precision cutting processing.
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Reduce transportation costs with the 'Magazine Stick' that can implement and transport automotive and electronic components! Proven to improve component storage efficiency by 100 times!
Tabletop semi-automatic machine for cell production with automatic ACF attachment.
High-density plasma is generated over a large area by a unique reactor head!
Leave the manufacturing of long FPC to us! Standard: Capable of producing sizes up to 2000×500mm. *For lengths beyond that, please consult us (we have experience with lengths up to 20M).
Leave the substrate cutting device to TME.
We handle the installation and manufacturing of gas supply equipment, as well as special material gas piping work.
Even those who are not familiar with the work can insert parts without mistakes and without waste. We also promise improved productivity through the use of CAM data.
The substrate will undergo various cleaning and drying processes through horizontal transport.
A compact, tabletop circuit board separator suitable for cell production. Achieved cost reduction by making positioning manual! *Test cutting currently accepted.
Holes in ceramic substrates and FPC substrates can be transferred non-contact regardless of the position of the holes.
■ The densification of package substrates is progressing, and there is a demand for miniaturization using CO2 lasers. ■ Introducing examples of miniaturization processing using our VELA machine.
It is a versatile machine capable of uniformly heating and pressurizing large areas in a vacuum. It is used for applications such as bonding, laminating, and sealing without voids.
Single-sided or double-sided cleaning is available! Introducing the versatile web cleaner!
A full-scale electroplating tank for PCB through-holes on your desktop!
Easy printed circuit board prototyping in-house and in the lab!
Laser substrate cutting machine - carbonization-free also possible
Compatible models for the auto program software "α PRO 3D"! It is equipped with a reverse circuit board insertion prevention feature.
Various moisture-proof agent coating line systems and various software to eliminate bottlenecks! Introducing examples of implemented systems.
Moisture-proof agent with fluorescent paint! Space-saving and capable of management through data accumulation of inspection results!
With the rework system for parts repair/repair/re-implementation! No failures with easy operation! SMT rework system using spot air method.
Rework device/rework system catalog available! For those struggling with rework, all SMT components can be handled with this one device! All-in-one type.
[Rework Equipment Technical Documentation] Explanation of rework troubles for 0402/0603 components used in wearable and mobile devices.
This is a document that clearly explains "rework of printed circuit boards," which every engineer should know about.
We have a lineup of all-in-one rework machines such as the "RD Series"!
The mark or hole is recognized by the CCD camera and serves as the processing reference for the V-cut.
Processing of large-diameter materials and thick plates, which are difficult to process with a multi-wire saw, is possible! This significantly reduces processing loss of expensive materials.
Shortest half-day estimate / NC lathe processed products / C3604 (free-cutting brass)
This is an essential book for adhesive users aimed at designing highly reliable, durable, and strong adhesive joints.
Cost reduction and weight reduction with a vacuum chuck made of honeycomb panels!
By converting conventional vacuum chucks, such as porous types, into aluminum honeycomb panels, significant cost reductions can be achieved!
By converting conventional vacuum tables, such as porous ones, into aluminum honeycomb panels, significant cost reductions can be achieved!
Adopting solid UV lasers as the light source! Compatible with everything from compact, low-cost LLO devices to large equipment for G6 panels.
Achieving both high quality and high-speed processing! Drilling and cutting of glass using ultra-short pulse lasers.
Ensure reliable protective coating for the implementation substrate! Customization according to line configuration is possible.
Achieving complete smear removal! The device design takes maintenance into consideration.
Supports everything from single-layer substrates to flexible substrates using Roll to Roll! No resist residue remains.
Affordable and ultra-compact experimental equipment suitable for IC and MEMS experiments! We propose ready-to-use experimental devices!
A device that dislikes moisture! Laser cutting technology with a completely dry process.
Inline model that automates the printed circuit board cutting process.
Reduction of the hassle of router bit exchange! The insertion slot is designed with a light curtain, allowing for safe use.
【Monthly Web Seminars Now Held!】Automating the processes from PCB supply to PCB cutting, palletizing onto output trays, and PCB discharge!
No actual substrates or devices are needed! By simulating the takt time of the printed circuit board splitting process in advance, you can calculate a production quantity that is closer to actual production!
Overwhelming cost performance! Capable of simultaneous marking on both sides of the substrate! Short delivery time!
Electronic component shelf that improves the efficiency of electronic component reel inventory operations and achieves warehouse space savings! A proposal that increases work efficiency by 6 times and reduces warehouse space by 50%!
Next-gen drilling for ABF and BT substrates. Achieve 5μm vias with ±5μm precision. Ideal for high-density AI chip packaging.
Ultra-fine 15/15μm resolution for HDI & IC substrates. Advanced spray technology ensures residue-free, uniform development.
No harmful chemicals. Low cost. Eco-friendly. Organic protective coating that preserves solderability through long-term storage.
Cleanliness, high work efficiency, reduction of operational costs.
Achieving both high precision and flexibility. The new generation "DR20x0 / DR30x0" series is born.
High-quality cutting of composite materials is possible! Laser ablation processing machine equipped with a ultra-short pulse laser oscillator.
Leave everything from foundation implementation to assembly to us.
High-precision patterning for partial coating. Sales started on January 15, 2020.
Introducing numerous examples of high-difficulty substrates, such as 0.5 pitch BGA mounted 8-layer through resin-filled boards (t0.6)!
Introduction of a printed circuit board with a hole wall pattern gap of 0.175 and a 0.4 pitch 196 pin BGA.
We realize printed circuit board design, prototyping, and assembly with short delivery times, small quantities, and a variety of products.
Essential for improving production efficiency! Packaging magazine sticks that protect precision parts and more! Can also be used for part alignment and inspection jigs, leveraging high durability and transparency.
"Packaging materials for equipment that can reduce transportation costs" - 'Magazine Stick' suitable for the implementation and transportation of automotive parts, electronic components, and precision parts. *Video available.
Numerous application results with 1005CR! 'Seal-glo Chip Adhesive'. Compatible with high-speed dispensers and fine coating regardless of printing!
An epoxy-based adhesive developed as a temporary fixing agent for chip components! It reduces the burden on electronic components with low-temperature curing at 90°C for 90 seconds.
All processes of "assembly, packaging, transportation, and implementation" can be handled in a single container. Improve the processes of implementation and transportation for automotive parts, electronic components, and precision parts! *Video available now.
Significantly reduced tape detachment during mounting standby. Strong adhesive prevents splicing errors and contributes to increased productivity! Achieved high quality at low cost.
Is it still manual? Introducing the "spray-type small etching device" suitable for testing and experiments in a tabletop size! Examples of use such as etching films!
High-performance flip chip bonder for multi-variety cell production lines.
High-density plasma is generated over a large area by the unique reactor head!
It performs splitting at approximately twice the speed of conventional splitting speeds using a 2-spindle system.
Applying high-speed automatic machine technology, productivity is more than doubled! Router-type circuit board separator.
Leave the substrate cutting device to TME.
Leave the substrate cutting device to TME.
Leave the substrate cutting device to TME.
Surface modification, cleaning, hydrophilicity treatment, and adhesion enhancement with excellent low-temperature charge damage-free performance! Pen-type atmospheric pressure plasma device!
Vacuum three-dimensional thermal pressurization device