Introducing our substrate specifications, including MCL-E-67 and R-1766!
High-speed, high-precision drilling and routing machine that meets all processing needs.
Implement further solutions with space-saving! Achieve maximum versatility and utilization efficiency from valuable floor space.
Easy printed circuit board prototyping in-house and in the lab!
【Monthly Web Seminars Now Held!】Automating the processes from PCB supply to PCB cutting, palletizing onto output trays, and PCB discharge!
Laser system for drilling and routing large substrates using green laser.
This is a receiving jig for dividing the substrate with a substrate splitting machine. In addition to preventing warping of the substrate during routing, it also streamlines the splitting process!
Applying high-speed automatic machine technology, productivity is more than doubled! Router-type circuit board separator.
Leave the substrate cutting device to TME.
Compatible with organic amine-based stripping solutions! The optimal spray arrangement ensures no resist residue remains.
LPKF's UV laser circuit board processing machine that accommodates the most diverse materials.
Professional multilayer board creation in-house and in the lab.
If it's a honeycomb panel, we can produce custom vacuum chucks from just one piece at a low price and with a short delivery time!
[No Solvent Required] Handy-type atmospheric pressure plasma device, low temperature, no charge damage! High processing performance for cleaning, surface modification, hydrophilization, and adhesion enhancement!
Leave the substrate cutting device to TME.
For cutting a wide range of materials such as ceramics, metals, electronic components, and composites. Increased work efficiency with open-type doors! Adjustable cutting length with a movable table.
Support for workpiece positioning in mold manufacturing!
We will exhibit a "turntable-type substrate cutting machine" that allows parallel setup during substrate cutting and a "substrate marking device" that can accommodate a wide range of materials!
Domestic ultra-compact pen-type atmospheric plasma device suitable for fine processing and laboratory applications! It can be easily used at an affordable price.
Heater chips and heater tools compatible with major manufacturer pulse heat power supplies.
By placing multiple devices, it is possible to easily achieve multi-processing.
High-level drying has been achieved by combining compressed air and spin rotation.
High-density plasma is generated over a large area by the unique reactor head!
All-in-one type — All SMT components with this one device.
Introduction of a printed circuit board with a 0.3 pitch 144 pin BGA featuring via-on-via with copper plating!
Prevent work misalignment! Ideal stack pins (small diameter pins) for precision machining.
With the rework system for parts repair/repair/re-implementation! No failures with easy operation! SMT rework system using spot air method.
[Rework Equipment Technical Documentation] Explanation of rework troubles for 0402/0603 components used in wearable and mobile devices.
This is a document that clearly explains "rework of printed circuit boards," which every engineer should know about.
Compatible models for the auto program software "α PRO 3D"! It is equipped with a reverse circuit board insertion prevention feature.
Renewal! The world's first hybrid laser printed circuit board processing machine.
Specialist in difficult-to-process materials: LPKF's picosecond laser circuit board processing machine.
We offer contract processing of hard and brittle materials (Si, quartz glass, ceramics) and propose, design, and manufacture specialized processing machines tailored to your needs!
By converting conventional vacuum tables, such as porous ones, into aluminum honeycomb panels, significant cost reductions can be achieved!
Solving the heat dissipation problem of LEDs! New technology achieves board-less design.
A device that dislikes moisture! Laser cutting technology with a completely dry process.
Improvement of productivity through parallel setup in the printed circuit board division process, also accommodating inline production processes!
Overwhelming cost performance! Capable of simultaneous marking on both sides of the substrate! Short delivery time!
An electronic component shelf that achieves efficient warehouse space-saving for the management of electronic component reel inventory! Easy operation with free location and LED lighting!
High-quality fine printing, marking device model for M-size substrates that can accommodate a wide range of materials! (Available in single-sided/double-sided specifications)
Release of FAQ materials addressing common questions from customers struggling with electronic component reel inventory management! Solve challenges with the "Smart Reel Rack"!
It is a fiber laser oscillator that achieves high peak power! It flexibly accommodates applications such as precision welding and precision cutting processing.
Fully automated inline high-speed laser depaneling machine that enables integration into assembly lines.
High-quality cutting of composite materials is possible! Laser ablation processing machine equipped with a ultra-short pulse laser oscillator.
Surface modification, cleaning, hydrophilicity treatment, and adhesion enhancement with excellent low-temperature charge damage-free performance! Pen-type atmospheric pressure plasma device!
Kyosha provides comprehensive support for improving factory productivity and quality using automated and IT technologies. Equipment and dedicated jigs can be purchased as a set.
Reduce the cleaning process with oil-free presses and improve quality! Excellent production efficiency in press processing.
Leave the substrate cutting device to TME.
Leave the substrate cutting device to TME.
Attention smartphone component manufacturers and PCB assembly manufacturers! We are offering a free technical document featuring examples of improvements using the jet dispense method.
High-performance flip chip bonder for multi-variety cell production lines.
High-precision pattern processing is achieved through vacuum etching technology! It finishes without variation across the surface.
Uniform plating treatment is possible even in deep vias and high aspect ratio through holes!
Supports everything from single-layer substrates to flexible substrates using Roll to Roll! No resist residue remains.
Ideal for research and development (elemental technology)! / Desktop vacuum laminator
After stacking multiple sheets of film, they are heated and bonded together under vacuum.
A must-see for companies involved in printed circuit board manufacturing, metal mask manufacturing, and printed circuit board design.
Attach it to your open press machine and repurpose it as a vacuum press machine at low cost.
The daily production volume is high, and the production method involves frequent model changes.
A compact tabletop circuit board cutting machine suitable for cell production. Achieves low-stress and safe circuit board cutting with sharp cutting edges! *Test cutting currently accepted.
Significantly shorten production takt time with high-speed, three-axis drive! It can safely cut without putting stress on the mounted circuit board! *Test cutting currently accepted.
When you want to easily cut samples! Compatible with a wide range of materials such as ceramics, metals, electronic components, and composites. Custom clamp jig design is also available. *Demo available.
Compact Ultra-High Precision Development Device MPD40
High-speed supply of stacked breathable sheets, films, non-woven fabrics, and paper one by one using a non-contact transport device called "Float Chuck."
Transport green sheets, through-hole substrates, breathable sheets, and non-woven fabrics without contact.
A developing device that is easy to operate with a color LCD touch panel!
Ideal for HC sheet replacement.
SUS304 / Stainless Steel / Lathe Processing / Screw Processing
[New Feature] In addition to the conventional CCD cameras, we have added a CCD camera that recognizes and corrects the shape of the product's end face.
■ It is possible to process ABF material blind holes with a high taper ratio and uniform hole bottom quality. ■ The minimum hole diameter is φ10um, allowing for control of processing quality.
High-quality blind hole and through hole processing is possible by combining trepanning and punching. Router processing using ultra-small diameter beams is also possible.
■ The densification of package substrates is progressing, and there is a demand for miniaturization using CO2 lasers. ■ Introducing examples of miniaturization processing using our VELA machine.
Recommended for processing standard holes in film materials! Suitable for both thin and thick materials. Achieves high-speed and high-precision punching with an electric punch head!
Recommended for trimming printed circuit boards and metal sheets! Supports die cutting and half-cutting as well. Achieves high-speed and high-precision cutting!
Desktop inkjet printer system for semiconductors, PCBs, and printed electronics.
High-precision patterning for partial coating. Sales started on January 15, 2020.
For full to partial coating. Sales started on January 15, 2020.
Introducing numerous examples of high-difficulty substrates, such as 0.5 pitch BGA mounted 8-layer through resin-filled boards (t0.6)!
Below t1.6! Here are examples of data specifications for BGA-mounted substrates.
Implementation of ultra-small solder balls is possible! Solder balls can be directly mounted on the flux of the PCB surface electrodes!
Achieve more precise movements! This one machine is sufficient for square pipes, oval pipes, and irregular pipes.
Quick response with reliable technology and quality! We are a comprehensive EMS company for electronic device manufacturing.
Laser marker for substrates. Equipped with camera imaging and image processing software as standard. It is capable of correcting print positions, confirming the direction of workpiece loading, and saving code readings, among other functions.
Warped substrate correction and warpage measurement inspection machine
DMBFY company's circuit board cleaning machine
We will finish to your desired surface roughness using two methods: wrapping processing and polishing processing (mirror polishing method)!
Processing technology that allows flexible responses tailored to customer needs, from a single prototype to mass production.
We are committed to manufacturing printed circuit boards with a pattern accuracy of 0.1μm.
It is a versatile machine capable of uniformly heating and pressurizing large areas in a vacuum. It is used for applications such as bonding, laminating, and sealing without voids.
Preventing troubles in subsequent processes by R-trimming the four corners after cutting the copper-clad laminate.
The mark or hole is recognized by the CCD camera and serves as the processing reference for the V-cut.
Positioning pins/stacking pins (small diameter pins) to fix the workpieces so that they do not shift! Material: SKH51, SUS material, carbide, etc.