All conductive for suitability in assembly, inspection, and storage of the implementation substrate! We also have the SA type PC rack available.
The analog input channels support simultaneous sampling and are equipped with external trigger input and external clock input terminals! Comprehensive catalogs and case study materials are currently being offered.
[Free Sample Offer] Contributes to process shortening with room temperature quick-drying! Fluorinated conformal coating agent - WOP -
LPKF's UV laser circuit board processing machine that accommodates the most diverse materials.
We will work on product development with an eye on the needs of the next generation.
This is a film suitable for masks used in printed circuit board (PCB) manufacturing.
This is a substrate with unique high heat dissipation properties developed by Daiwa Kogyo Co., Ltd.
Variable Speed Wet Table Cutting Machine MUS-4SA
Ion migration risk is reduced! Insulation substrate for power modules.
We provide high-value products that take into consideration the environment and safety.
Ideal for small quantities and a variety of appearance inspections! It won't miss any resist peeling or foreign matter adhesion!
Storage shelf for metal masks that can be connected one step at a time.
It is a coating technology that combines the characteristics of gravure rotary printing and silk screen printing.
Head unit operating type! In-house developed, Japanese-made 2M MJPEG compatible USB camera module.
We will accommodate short delivery times, design, and prototype implementation!
We can manufacture various products such as BVH and COH by sequentially laminating the conductor layer onto the core material!
Recently, there has been an increasing demand for a certain thickness even outside of automotive applications!
Over 10 years of manufacturing experience for substrates for thermoelectric modules (Peltier elements). For power devices, solid-state relays (SSR), and more!
A single-board computer designed to be resistant to radiation environments, using high-performance commercial components developed for space.
High-speed processing developed with Ladder.
We respond to a wide range of requests with integrated production from prototype to mass production.
We will provide implementation jigs that focus on quality and productivity.
We would like to introduce the general delivery times for printed circuit board manufacturing by Shinko Photo Service.
Introducing technology to prevent resin leakage! It is possible to prevent resin from leaking.
Just 1 minute! You can erase scratches on the substrate simply by writing with a pen and exposing it to UV light! A solder resist repair pen that can correct pinholes over 1000 times.
Professional multilayer board creation in-house and in the lab.
Injecting urethane resin into the substrate case. It protects the substrate from water, dust, vibration, and insects. Recommended for substrates used in harsh environments such as high temperature, high humidity, and outdoors.
Only the necessary features! Simple rack for metal masks.
For high-performance ceramic substrates, please consult our specialized manufacturer.
Murakami's photoresist for screen printing boasts world-class production levels.
【Monthly Web Seminars Now Held!】Automating the processes from PCB supply to PCB cutting, palletizing onto output trays, and PCB discharge!
We deliver innovative added value in cost, lead time, and responsiveness centered around circuit board design. Please feel free to compare us with other companies.
By eliminating the symbol mark printing process, it becomes possible to reduce resource and energy consumption, as well as decrease defective waste.
★Competitive pricing★ We always provide layouts and wiring with EMI resistance in mind, using environmentally friendly materials★ High quality, low price, and a wide variety★
We propose a better design that you will be satisfied with by utilizing our analysis services.
Significant improvement in work efficiency during manual soldering of inserted components!
Short processing time and inexpensive compared to other plating. Good wettability of solder during assembly.
Ultra-small satellite, onboard computer for CubeSat, CSP. A single-board computer equipped with a Zynq-7020 processor.
At Nippon Sec Co., Ltd., we utilize the printed circuit board manufacturing technology developed through our experience with electronic display boards to provide high-quality boards tailored to our customers' needs.
After curing, it provides a high-efficiency thermal interface without air gaps.
Substrate for high-temperature printed circuit boards with excellent insulation reliability.
We will respond flexibly according to your consultation!
Easy operation of vending machine bill validator data and coin mechanism from PC or microcontroller!
We fully support technical management, quality management, and delivery management to provide high quality.
Simple Measurement Gauge for Drill Holes in Printed Circuit Boards
The inner layer copper foil thickness can use 1/2 oz (18 μm) and in some cases 1 oz (35 μm)!
We provide suitable processing according to specifications! We also offer direct delivery to plating factories.
Excellent resistance to pinholes, moldability, processability, heat and cold resistance, acid resistance, and release properties! A high-performance film that can be widely used in industrial and pharmaceutical food sectors.
The chip size is the largest class for automotive applications! Low ON resistance with a drive current of 200A class.
Direct heat conduction to the base material!
We will exhibit at a trade show that contributes to the development of the entire electronic circuit industry and related industries!
Leave it to us for circuit boards for power modules! We manufacture thick copper base wiring boards and boards that bond thick copper to ceramics using the AMB method.
Quality improvement is achievable through the non-contact method using the reel-to-reel process! Please consult us first, regardless of large lots.
Utilizing the properties of silicone resin to achieve "high heat resistance" and "UV resistance"!
Button-plated FPC that enables high-speed transmission, ultra-thinness, and flexibility in a new dimension.
We can manufacture in your desired shape depending on the application and usage! Surface treatments are also available for various coatings such as gold and tin.
The attachment and detachment of the substrate is a simple operation that only requires placing it on the guide! It reduces losses caused by model switching.
[Video now available]
This is a device that can contribute to reducing environmental impact.
This is a method of forming a build-up layer on top of a core substrate.
Control the pattern width and interlayer thickness to perform impedance control.
We carry out product planning, design, and manufacturing consistently in-house, starting from small lots.
Simultaneous imaging type reduces takt time! Compatible with various circuit boards!
We will provide the best proposals from a rich variety of products created by a spirit of inquiry and a wide range of handled items.
We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.
We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques.
As an introduction to the basics of printed circuit boards, I will introduce the manufacturing flow of a 4-layer printed circuit board.
Introducing bonding gold plating technology! Providing reliable and stable COB.
Double-sided type that allows for complex wiring.
Achieve high reproducibility! (Track record: approximately 80% or more) Leave the optimization of verification, components, and functions to prototype verification to us. *CPU is subject to consultation.
Effective for thermal management of low energy conversion efficiency devices like UV LEDs! Water-cooled flow circuit substrate.
Support available from just one piece! A component-integrated board that reduces dead space and achieves miniaturization! Ideal for the miniaturization and integration of printed circuit boards!
Impedance measurement is now possible! It is conducted using TDR measurement.
RoHS compliant lead-free solder compatible reflow oven
Package composed of high thermal conductivity AlN material.
Efficient storage with sliding dividers! You can easily take things out even while wearing gloves, as they slide out for easy access!
A slide-type storage shelf for metal masks that balances storage efficiency and ease of access, further simplified to improve usability.
A flat push-back board that achieves a flat finish for improved efficiency during assembly.
We aim to create products that our customers can trust and feel secure about.
Ceramic materials for all-solid-state batteries expected to be the next-generation energy storage solution.
We offer contract processing services for the core technology of manufacturing thin ceramic substrates, known as "green sheet coating and molding."
We support everything related to substrate manufacturing. We can handle the entire process or just a single step.
Replacement from the harness is also possible! An extremely thin and flexible circuit board that can be bent freely.
Flux residue requires analysis methods according to its type! Zestron’s analysis support.
If you want to learn about photoresists, which are essential for semiconductor manufacturing, please take a look!
We offer a substrate embedded with copper coins to efficiently dissipate heat.
Miniaturization of devices, heat dissipation applications, and printed circuit boards tailored to individual product implementations!
You can also use it for new employee training and internal study sessions. *Currently running an initial discount campaign for new customers on design and circuit board manufacturing!
In fact, Sanwa's special substrates are used in such places. We support the resolution of various challenges such as implementation defects, costs, and man-hours with substrate technology.
Embed copper pins directly under the heating components! This can reduce the cost difference based on the number of copper pins.
Filling holes on pads is possible for a board thickness of up to 4.8t! We support the manufacturing of BGA and CSP areas.
Prevention of current leakage from the edge due to good edge covering properties free of organotin compounds.
We respond to various requests! Please leave chip capacitor and chip resistor modifications to us!
Even with BGA jumper wiring, it's still at the expert workshop for BGA implementation, Yamada!