In the event of a recall, having traceability allows for the limitation of the affected lot, minimizing the scope and cost of the recall!
A low-pressure molding method that replaces 2-liquid potting, achieving improved production efficiency and miniaturization. Case studies will be presented at Nepcon Japan in September 2026!
The inner layer copper foil thickness can use 1/2 oz (18 μm) and in some cases 1 oz (35 μm)!
Introduction of high-power modules, heat dissipation measures for UV-LEDs, and UV protection substrates for UV-LEDs.
Alumina substrates (ceramic substrates) with minimal dimensional variation in shape and thickness, small warping, bending, and waviness, possessing stable quality and excellent characteristics.
It suppresses the discoloration of heated copper and improves moisture resistance. It is a water-soluble, non-chrome, environmentally friendly product.









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