Quickly responds to sudden repair requests at the development site. Supports speedy analysis in-house without relying on outsourcing.
"FPC Manufacturing Case Studies" now available! Single-sided FPC production starts from 1 day and double-sided FPC production from 2 days, with production available from 1 piece. We also support pattern design and component assembly.
We will solve issues such as insufficient implementation space and concerns about connection reliability!
Renewal! The world's first hybrid laser printed circuit board processing machine.
The optimal imaging inspection device for TGV inspection has been completed!
Used in areas where durability is important! Protects against soldering, unmounted parts, dirt, and scratches.
Due to its reflow heat resistance of 180°C and high-temperature storage resistance of 120°C, it is suitable for soldering electronic components.
We manufacture a variety of flat through-hole printed circuit boards.
The inner layer copper foil thickness can use 1/2 oz (18 μm) and in some cases 1 oz (35 μm)!
All conductive for suitability in assembly, inspection, and storage of the implementation substrate! We also have the SA type PC rack available.
Exchanging is not an easy task, but it is one of the basic operations that is routinely carried out at the workshop.
Solving customers' "troubles"! For BGA replacement, consult the BGA rework experts at Yamada Workshop!
This time, the control unit is the subject of analysis! It is equipped with a system that has evolved from the conventional method "THSII."
The chip size is the largest class for automotive applications! Low ON resistance with a drive current of 200A class.
Are you having trouble with large-sized PCB manufacturing for small roads?
DI equipment suitable for substrate manufacturing lines! Ideal for precision-focused substrate manufacturing with automatic alignment functionality.
We welcome inquiries and consultations regarding flexible procurement challenges! We respond to various requests, including halogen-free types. We cater to everything from digital cameras to the aerospace field!
The intended use is for automotive decorative accessories, etc.! A thin aluminum base substrate with a thickness of 0.40mm.
A new technology currently under patent application enables the automatic peeling of difficult-to-remove films such as dry film solder resist, ABF, and dry film resist!
The industry's top model for prototype printed circuit board processing machines! From complex circuits to RF and high-frequency applications.
LPKF's UV laser circuit board processing machine that accommodates the most diverse materials.
Professional multilayer board creation in-house and in the lab.
Thin-film process enables the realization of fine and high-precision ceramic wiring boards.
We provide consistent support from design to final product release! *We have a track record of adoption for the supercomputer "K".
Solve your problems with transparent flexible substrates, transparent antennas, transparent heaters, and insert molded substrates!
We accept requests for prototype to mass production in circuit design, pattern design, and manufacturing!
Developed with proven technology over many years! Pre-verification of characteristics through simulation is possible.
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Kemgard is a high-performance flame retardant and smoke suppressant, making it an ideal material for improving flame retardancy and smoke suppression in resins. (New products have been added.)
You can check the mounting positions on the layout! We also accept requests for parts lists solely for cost investigation purposes.
Create a circuit board from Gerber data using machining!
Can be installed without hole processing! Adhesive spacer series available in a total of 8 sizes!
Expanding usage! Proposal for a control board that combines a touch panel with a display and operation board. Proven results in kitchen equipment and scientific instruments!
We will work on product development with an eye on the needs of the next generation.
Specialist in difficult-to-process materials: LPKF's picosecond laser circuit board processing machine.
It is possible to efficiently release the heat from the heating components to the outside! Double-sided through-hole metal substrate.
Achieving surface finishes equivalent to router processing! This is next-generation profile press processing.
Supports mass production of 0603 chips and prototype 0402 chips.
Achieve an easy-to-access and efficient storage shelf for metal masks with sliding dividers!
A dedicated 320-square shelf that reduces the effort of considering storage methods in research and development settings.
Introduction OK from section 1! "Linked" metal mask storage that also supports future expansions.
Introducing a case study on the introduction of rigid substrates by Murakami Electronics Co., Ltd.!
Various types of substrates can be manufactured, including rigid substrates, flexible substrates, build-up substrates, rigid-flex substrates, and special substrates!
High heat resistance and high strength! Ceramic wiring board using DPC plating method.
Introducing products by function such as high frequency, high thermal conductivity, and dimensional stability in a tree diagram!
Button-plated FPC that enables high-speed transmission, ultra-thinness, and flexibility in a new dimension.
Flexible substrates for aerospace applications that achieve both lightweight and high performance.
Flexible substrates contributing to the miniaturization and high performance of precision medical devices.
Ideal for movable parts such as robotic arms. Achieves stable operation even in harsh environments.
A flexible substrate that achieves slim, high-performance home appliances with high heat resistance and low loss.
Flexible substrate with high heat resistance and low loss that contributes to high-quality displays.
We can manufacture in your desired shape depending on the application and usage! Surface treatments are also available for various coatings such as gold and tin.
Total support from reliability evaluation of electronic components and circuit boards that support AI data centers to failure analysis and cause investigation.
Please let us know your requests.
We can accommodate impedance control from 4 layers to 30 layers.
Tightly laminated resist, copper foil, adhesive layer, and PET! Introducing our transparent substrate.
Silicon nitride products developed using ceramic materials technology.
The fusion of ceramic materials and long-developed thick-film metallization technology.
A matching platform for connecting people who want their circuit boards repaired with those who can repair circuit boards.
Ideal for small quantities and a variety of appearance inspections! It won't miss any resist peeling or foreign matter adhesion!
We support everything related to substrate manufacturing. We can handle the entire process or just a single step.
As an introduction to the basics of printed circuit boards, I will introduce the manufacturing flow of a 4-layer printed circuit board.
Introducing bonding gold plating technology! Providing reliable and stable COB.
Achieving high-frequency and high-speed transmission by matching the characteristic impedance.
Narrow pitch mounting of 0402 and 0603 chips. Stacked mounting of chips in two layers.
We support product development without setbacks by implementing noise countermeasures from the early design stage.
Introducing a flexible printed circuit board (FPC) that balances transparency and solderability!
Effective in millimeter wave bands such as 5G communication! Products with low transmission loss, low dielectric constant, and high flexibility.
We provide a consistent service from design to implementation of small quantities of diverse prototype printed circuit boards!
Delivery of remote monitoring devices for optical communication networks! Leave wiring material processing products to us.
With our extensive experience and track record in water jet cutting, we accept requests for prototype and verification cutting of difficult-to-process materials such as metals, resins, and composites.
Bakelite fabric is a high-strength thermosetting plastic with excellent electrical insulation properties, and the sheets are essential materials for electrical components and circuit boards.
We will respond to short delivery times with thorough deadline management!
Reverse engineering that reveals the information engineers want through accurate circuit restoration.
Perfect smear removal for high-aspect-ratio vias. Optimized for ultra-thin substrates with advanced horizontal transport technology.
A problem-solving and proposal-based company that provides high-quality, high-performance electronic circuit boards!
We will accommodate short delivery times, design, and prototype implementation!
A development proposal-type EMS that flexibly responds to diverse needs.
Effective even in cases where component mounting is limited! Here are examples of rigid-flexible circuit board manufacturing.
A circuit board that addresses heat issues! Introducing examples of heat dissipation circuit boards manufactured by Matsuwa Sangyo Co., Ltd.
The number of layers ranges from 2 to 20, and there is a proven track record of resin filling up to a thickness of 3.2mm!
Improvement of inductance, improvement of impedance, and reduction of noise are possible!
Recently, there has been an increasing demand for a certain thickness even outside of automotive applications!
The hole diameter is ≥Φ0.5mm, the land diameter is ≥0.8mm, and the hole pitch is ≥1.0mm!
Visualize the state of lithium-ion batteries and maximize their performance!
It has excellent heat resistance, release properties, and conformability, making it suitable for FPC release applications.
We accommodate a wide variety of types from general specifications to special processing! For printed circuit boards, come to us!
Microscopic openings and high-precision alignment! Formed by direct imaging method.
We are offering materials that will assist in the design of high-precision industrial robot circuit boards!
Specifications for terminal size, clearance, and solder mask thickness are provided.