We can perform not only surface mounting but also other processes consistently!
Leave the processing of printed circuit board shaping, engraving, and V-cutting to us.
High precision, temperature display resolution 0.1℃. Peltier temperature controller.
Ion migration risk is reduced! Insulation substrate for power modules.
The chip size is the largest class for automotive applications! Low ON resistance with a drive current of 200A class.
Achieve clean peeling! No marking left behind, reduced film breakage due to film damage.
We propose total solutions for our customers, prioritizing one-stop production in manufacturing.
Onboard computer for ultra-small satellites, CubeSats. It is a high-performance computer with low power consumption.
We will respond flexibly according to your consultation!
We offer glass frit products for electronic components and materials, such as low-temperature co-fired ceramic (LTCC), conductive paste additives, and circuit protection coatings!
We will respond to short delivery times with thorough deadline management!
We deliver innovative added value in cost, lead time, and responsiveness centered around circuit board design. Please feel free to compare us with other companies.
A single-board computer designed to be resistant to radiation environments, using high-performance commercial components developed for space.
We handle everything from small-diameter drilling to high-multilayer drilling! For drilling processing, come to our company!
This is a circuit board with resin embedded in the through holes and pads placed on top.
Processing that does not waste materials! We utilize the technology of ultra-fine processing developed through our experience in forging.
Support available from just one piece! A component-integrated board that reduces dead space and achieves miniaturization! Ideal for the miniaturization and integration of printed circuit boards!
Impedance measurement is now possible! It is conducted using TDR measurement.
Aluminum nitride products developed using ceramic materials technology.
Efficiently dissipate heat from the copper coin to the back side! It is possible to reduce the heat generation of the entire circuit board.
Prevent the flow of sealing resin and flux during component mounting!
This is a film suitable for masks used in printed circuit board (PCB) manufacturing.
This is a substrate with unique high heat dissipation properties developed by Daiwa Kogyo Co., Ltd.
It is a new feature that adds "heat dissipation" and "mechanical rigidity" to the functions of conventional printed circuit boards.
We carry out high-precision work from the customer's perspective! Leave electronic equipment-related tasks to us.
Delivery of remote monitoring devices for optical communication networks! Leave wiring material processing products to us.
We also provide proposals and support for consumables! We handle everything from selecting and installing pharmaceuticals to manufacturing equipment comprehensively.
In recent years, the application of plasma technology in the medical bio field has been advancing. We are introducing two models that are perfect for such research and development!
Significant improvement in work efficiency during manual soldering of inserted components!
Short processing time and inexpensive compared to other plating. Good wettability of solder during assembly.
USB connection parallel I/O board. The only one in the country compatible with both Windows and Mac.
Supports a variety of specifications, including compatibility with multiple impedance control specifications!
We fully support technical management, quality management, and delivery management to provide high quality.
Easy operation of vending machine bill validator data and coin mechanism from PC or microcontroller!
Excellent resistance to pinholes, moldability, processability, heat and cold resistance, acid resistance, and release properties! A high-performance film that can be widely used in industrial and pharmaceutical food sectors.
![Kemgard Smoke Suppressants Logo [8-24-18].jpg](https://image.mono.ipros.com/public/product/image/67c/2000701860/IPROS12582784837476261715.jpeg?w=280&h=280)
Kemgard is a high-performance flame retardant and smoke suppressant, making it an ideal material for improving flame retardancy and smoke suppression in resins. (New products have been added.)
Introducing an innovative cordless design that simultaneously achieves static elimination and dust removal anywhere with the ionizer gun!!
Bluetooth/Wi-Fi equipped EPS32 Arduino development board programming
Prototype/Flexible Circuit Board Design Expert
This is a method of forming a build-up layer on top of a core substrate.
Poor implementation, the device does not operate, error display, communication has become impossible... We will improve it.
Achieve high reproducibility! (Track record: approximately 80% or more) Leave the optimization of verification, components, and functions to prototype verification to us. *CPU is subject to consultation.
This conveyor, which uses a mounting machine (mounter) used in semiconductor devices, contributes to automation by achieving high-speed and high-precision supply of tape and seals!
We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques.
Introducing magnetic reduction technology for printed circuit boards! A method to reduce magnetism using flash gold plating.
Noise countermeasure structure
Achieving high-frequency and high-speed transmission by matching the characteristic impedance.
The era has shifted from manual splitting to router splitting.
Introduction of high-power modules, heat dissipation measures for UV-LEDs, and UV protection substrates for UV-LEDs.
Transparent resist, a transparent circuit film that can create circuit patterns with copper foil.
High technology supporting the industrial society! Meito Electric Industry Co., Ltd. plays a part in that.
We respond to a wide range of requests with integrated production from prototype to mass production.
[Video now available]
MARUWA's thin film circuit boards are substrate materials created as a result of the fusion of various proven ceramic materials and the thin film metallization technology developed over many years.
Alumina substrates (ceramic substrates) with minimal dimensional variation in shape and thickness, small warping, bending, and waviness, possessing stable quality and excellent characteristics.
A meticulous support system from circuit and pattern design to prototyping and mass production within Japan.
We provide comprehensive technology related to electronic devices from specification creation to development, design, manufacturing, and evaluation.
It is a coating technology that combines the characteristics of gravure rotary printing and silk screen printing.
Directly mounting bear chips on the substrate! A high-density substrate that achieves miniaturization and thinness of devices.
We will work on product development with an eye on the needs of the next generation.
We can also accommodate a pitch of 0.6mm and a hole diameter of φ0.15mm! We provide burr-free edge through holes.
By embedding solder resist ink in the through-hole section, it is possible to cover it!
Suitable for applications such as power supplies, inverters, and high-current circuit boards and device components!
Achieving unit cost reduction, unit size reduction, and extended lifespan. Ideal for LED substrates and automotive substrates!
The thermal conductivity can support up to 10W! Introducing a single-sided, one-layer metal substrate using a high thermal conductivity insulation layer.
We manufacture a variety of flat through-hole printed circuit boards.
Filling holes on pads is possible for a board thickness of up to 4.8t! We support the manufacturing of BGA and CSP areas.
We respond to various requests! Please leave chip capacitor and chip resistor modifications to us!
★Competitive pricing★ We always provide layouts and wiring with EMI resistance in mind, using environmentally friendly materials★ High quality, low price, and a wide variety★
A flex carrier suitable for transporting thin glass-epoxy substrates that are difficult to transport by self-delivery.
Reverse engineering that reveals the information engineers want through accurate circuit restoration.
We respond to a wide range of customer needs, from prototypes and small-batch production to modifications, even starting from just one unit.
Leave the assembly of high-density and fine components to our advanced implementation line.
The number of layers ranges from 2 to 20, and there is a proven track record of resin filling up to a thickness of 3.2mm!