"Complete sealing of electronic components in just a few dozen seconds. Waterproof, dustproof, and insulated." A sealing method for electronic components that replaces potting = hot melt molding.
The terminals are already wired, so it's ready to use! *Measurement jigs can also be made!
High-precision sensor with a total error of ±1.5% FSS! 14-bit digital output with 0.03% resolution and compensation circuit condensed into an ultra-small size of 8×7mm.
A silver paste that allows low-temperature firing at 370 to 400°C. Suitable for external electrodes for all-solid-state batteries and wiring electrodes on ceramic and glass substrates for various passive components.
2018 edition of the NFPA-approved Japanese version materials. A sample version including up to Chapter 3 is available for free.
Streamlining the picking process for semiconductors and electronic components! We will promote further smart factory development through the introduction of material towers.
To alleviate labor shortages and reduce working hours! Numerous achievements from major companies *Patent obtained.
Safe and secure materials! Flame-retardant insulating sheets with excellent insulation and electrical properties.
































































































































































