Microhole ceramics produced by extrusion molding.
A CIP molding device capable of uniform pressure up to MAX 400 MPa! We support everything from research and development to production, with numerous achievements.
Introducing the high-purity fine carbon T series, which offers domestic equivalent grade and overwhelming cost performance.
Light as aluminum, strong as steel! Comprehensive catalog of composite materials "MMC" now available.
Japan Fine Ceramics offers optimal solutions from a rich lineup of various ceramics to composite materials.
We will introduce the achievements of ceramicizing molds and their benefits.
Introducing the CA series of high-purity alumina ceramics, which offer equivalent domestic grade and overwhelming cost performance.
Introducing our dense alumina, which has overwhelmingly increased the insulation breakdown voltage at high temperatures, essential for insulator parts, ahead of other companies.
Improving the longevity of plasma-resistant, corrosion-resistant, and quartz components in semiconductor manufacturing equipment, setters for molten metals, electronic components, and ferrite sintering, as well as enhancing wettability for crucibles, etc.
[New Technology] A new method different from thermal spraying allows for full coating even on complex structures! *Case-specific coating examples are currently being offered.
Continuously repels contaminants from exterior walls and more! A new era of electrostatic repulsion anti-soiling technology!
By impregnating ceramics with metal, we achieve resistance to cracking. This is a new lightweight and high-rigidity material. Its adoption is advancing for improved performance of devices.
Overwhelming low thermal expansion and high thermal conductivity make it suitable for use in heat dissipation components!
Larger sizes are easier to achieve than ceramics, and by impregnating with metal, the fracture toughness is increased, making it less prone to cracking.
φ450 (18 inches) jig, equivalent specific gravity and Young's modulus to Si wafers! Low price!
Birth of shatter-resistant ceramics
The birth of the popular version MMC [SA151], which maintains the lightness of aluminum while increasing rigidity to 1.5 times that of aluminum.
We have made it possible to form thin-film integrated circuits on "stepped ceramic substrates," which eliminate the need for customer bonding processes and reduce thermal conduction loss.
We provide high-precision SiC ceramic products with a maximum size of 800 x 40t. We will introduce the benefits of adoption through proven results, such as improved device performance and resolution of thermal issues.
By changing metal parts to ceramics, significant improvements in lifespan are expected. Here are some examples of improvements.
Ideal for thin film circuit formation! JFC's unique alumina substrate with high strength, high purity, and excellent planar smoothness.

































































































