Over 20 years of support! Infineon's powerful development partner, TriCore.
Achieving Time to Market for C6000 applications through debugging efficiency.
High-purity insulating materials for the purpose of sealing semiconductor chips!
Now is the chance for EOL measures! Avoid the risks of production stoppage and increased costs with replacement design.
Are you having trouble with decapping (resin opening, package opening), which is essential for failure analysis of ICs and semiconductors?
Onboard computer for ultra-small satellites, CubeSats. It is a high-performance computer with low power consumption.
Image processing computer for satellites compliant with the 3U OpenVPX standard.
Debugger and trace solution compatible with C7000 core.
You can start the preliminary development of the software before the chips come out!
Experienced engineers will solve your requests for embedded system replacement design development and EOL support design in a way that meets your needs.
RX63N equipped embedded network logger CPU board with abundant peripheral functions.
Quickly obtain cutting-edge information that is useful for company management!
Image × AI × Security on a single chip! MIPI-compatible RISC-V SoC ESP32-P4 has arrived!
A single-board computer designed to be resistant to radiation environments, using high-performance commercial components developed for space.
Ultra-small satellite, onboard computer for CubeSat, CSP. A single-board computer equipped with a Zynq-7020 processor.
Control Raspberry Pi Pico2 with an easy and intuitive LabVIEW interface.
Industrial 8051 microcontroller that operates over a wide range of voltages and temperatures! Ensures high reliability even in noisy environments.
High-purity insulating materials for the purpose of sealing semiconductor chips!
We will also search for parts that have been rejected by other companies.
A 3.5-inch single-board computer with rich I/O features, advanced connectivity, and suitable for installation in space-constrained locations.
Significant power consumption reduction has been achieved through partial CMOS logic implementation at the physical layer and low-voltage support at the logic layer.
By connecting with "SLIPHDMIR," it is possible to most efficiently extract performance and characteristics.
Achieving a maximum transfer rate of 300MB/s for UHS-II with low power consumption through proprietary technology.
It can be easily integrated into SoCs such as HD TVs and AV receivers.
Achieving a maximum transfer rate of 300MB/s for UHS-II with low power consumption through proprietary technology.
For the development of complex/high-performance processors/SoCs equipped with multiple ARM Cortex-A/R cores!
Debugger and trace solution that strongly supports software development for RH850.
Debugger and trace solution compatible with Renesas SuperH family (SH2/SH3/SH4)
Debugger and trace solutions compatible with the Renesas RX family.
The powerful and well-known features of the C7000 core demonstrate industry-leading performance.
A powerful, modular, and flexible debugging system that supports a wide range of chips and architectures.
With "PowerTrace," it is possible to detect abnormal behavior and timing discrepancies without affecting the real-time performance of embedded systems.
Cost-effective all-in-one debugging and tracing module.
Record digital and analog signals, and enhance efficiency by linking them to the program flow!
Calibration and debugging with just one port. A smart choice for XCP.
Simulator, emulator, debugger for virtual targets
Unlimited multicore debugging is possible even with the most complex chips.
Tools that flexibly fit into the increasingly complex and diverse modern SoC/FPGA-based development environments.
A lineup of various sizes! Industrial touch monitors with built-in microcontrollers.
Redundant configuration × High computing performance - A new standard for in-vehicle AI integration RB-2 DUAL ORIN
★Equipped with 4-core Intel Core i3-9100HL★2x XMC/PMC ★SSD option★2x GE★Long-term supply
★ 2x Front Removable Storage Module ★ High-speed PCIe transfer from host to module ★ Ruggedized support
Design of embedded CPU boards - supporting manufacturing and various sensor-compatible analog circuit design!
For replacement design and development from Renesas microcontrollers to RX microcontrollers due to EOL support, please leave it to Yamato Technical Research Institute.
Avoiding the crisis of production interruption! Achieving rapid and reliable EOL response through replacement design and reverse engineering.
Replacement design of embedded systems - Transition to a high-functionality microcontroller 1Chip that achieves stable supply and cost reduction.
Replacement design for embedded systems - a new design solution fully addressing end-of-life IC measures and specification changes.
Replacement Design for Embedded Systems - Strategies for Alternative Component Solutions and Cost Reduction Achieved through Microcontroller Integration -
Replacement design of embedded systems - Avoiding production interruption risks while maintaining quality and mass production capability.
Avoiding the crisis of production interruption! Achieving EOL response through replacement design.
Achieve automation of IC packaging with space-saving design! Inspection equipment capable of high-precision 2D and 3D dimensional measurement.
Provides amazing GPU power! A cost-effective BOX-PC with three expansion slots.
It is a high-speed ECU interface that efficiently communicates with the ECU via the microprocessor's DAP interface.
We select the optimal non-destructive analysis from lock-in infrared thermal analysis, 3D X-ray tomography, ultrasonic testing (SAT), etc., and narrow down the abnormal areas.
We provide high-quality circuit processing and wiring processing services using FIB. We achieve a high processing yield!
A device equipped with a small module that contains a LoRaWAN communication chip and an AVR microcontroller on a single board.
A lineup of authors actively working at the forefront of this field. Covering everything from fundamental principles to the latest research trends and key points for business application!
System on module equipped with Zynq devices. It is the largest FPGA board that can use free development tools.
One-stop support for the development and prototyping of semiconductor and sensor packaging, as well as semiconductor modules, utilizing semiconductor bare chip mounting technology for small to medium-scale production.
Customization is possible with additional necessary features based on the standard product lineup! Multimedia SoC [Selection Guide available].
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We will open a sales office in Tokai (Nagoya).
NXP i.MX8M Plus equipped with Toradex's Verdin family CPU module.
NXP i.MX8M Mini equipped with Toradex's Verdin family CPU module.
NXP i.MX8 equipped with Toradex's Apalis family CPU module.
No need for high performance. Just the necessary features at half the cost.
Covers a wide range of applications from LCD, audio, MCU, to SoC. This is a selection guide to find the optimal one based on specifications and functions.
【BSCD】Intel/Atmel/Microchip/Freescale Semiconductor/Fujitsu/Holtek Popular P/N ☟
High-resolution display output and camera input for image AI applications realized on a single-chip microcontroller!
A high-performance microcontroller that enhances the potential of microcontrollers has arrived! It is well-suited for applications with high computational demands while consuming low power.
China's No.1 share ARM microcontroller
Expand in global markets and regions with a single design! Apply a single design to future functionalities.
This full-digital audio output middleware enables high sound quality, low power consumption, and low heat generation using only a microcontroller and an H-bridge circuit.
SAMD5x/E5x MCU family that achieves security features and connectivity with low power consumption.
8-bit PIC microcontroller equipped with CAN FD and CIP (Core Independent Peripheral)
Equipped with Microchip's original core! Supports intelligent edge processing.
Microchip Technology Inc. announces the PIC64GX MPU, the first product in the PIC64 portfolio product line.
IC that lights up 8 LEDs in a specified pattern (14 types).
The VIA SOM-3000 module can shorten the time to market for innovative new edge AI devices.
The VIA SOM-9X50 module streamlines the development of next-generation edge AI devices.
Protecting products from various impacts - Foam resin cushioning material ~ Corner pads
Image processing computer for satellites using Virtex 7 FPGA.