Onboard computer for ultra-small satellites, CubeSats. It is a high-performance computer with low power consumption.
Achieving audio output with just a microcontroller and H-bridge circuit: A high-quality, high-efficiency audio solution without an audio IC.
A single-board computer designed to be resistant to radiation environments, using high-performance commercial components developed for space.
High-purity insulating materials for the purpose of sealing semiconductor chips!
High-purity insulating materials for the purpose of sealing semiconductor chips!
High-purity insulating materials for the purpose of encapsulating semiconductor chips!
A lineup of various sizes! Industrial touch monitors with built-in microcontrollers.
Ultra-small satellite, onboard computer for CubeSat, CSP. A single-board computer equipped with a Zynq-7020 processor.
Control Raspberry Pi Pico2 with an easy and intuitive LabVIEW interface.
Significant power consumption reduction has been achieved through partial CMOS logic implementation at the physical layer and low-voltage support at the logic layer.
By connecting with "SLIPHDMIR," it is possible to most efficiently extract performance and characteristics.
It can be easily integrated into SoCs such as HD TVs and AV receivers.
Achieving a maximum transfer rate of 300MB/s for UHS-II with low power consumption through proprietary technology.
A device equipped with a small module that contains a LoRaWAN communication chip and an AVR microcontroller on a single board.
Built-in 192K bytes! A 32-bit MCU characterized by low power operation.
System on module equipped with Zynq devices. It is the largest FPGA board that can use free development tools.
RX63N equipped embedded network logger CPU board with abundant peripheral functions.
NXP i.MX8M Plus equipped with Toradex's Verdin family CPU module.
NXP i.MX8M Mini equipped with Toradex's Verdin family CPU module.
NXP i.MX8 equipped with Toradex's Apalis family CPU module.
【BSCD】Intel/Atmel/Microchip/Freescale Semiconductor/Fujitsu/Holtek Popular P/N ☟
Covers a wide range of applications from LCD, audio, MCU, to SoC. This is a selection guide to find the optimal one based on specifications and functions.
China's No.1 share ARM microcontroller
Quickly obtain cutting-edge information that is useful for company management!
Customization is possible with additional necessary features based on the standard product lineup! Multimedia SoC [Selection Guide available].
![Rebound - Logo - On white[2].jpg](https://image.mono.ipros.com/public/company/image/a55/2090280/IPROS12301427208103016948.png?w=280&h=280)
We will open a sales office in Tokai (Nagoya).
Protecting products from various impacts - Foam resin cushioning material ~ Corner pads
IC that lights up 8 LEDs in a specified pattern (14 types).
The VIA SOM-3000 module can shorten the time to market for innovative new edge AI devices.
The VIA SOM-9X50 module streamlines the development of next-generation edge AI devices.
Embedded boards that can be widely used for industrial, medical devices, automotive applications, etc. All production from design to mass production is done domestically. Long-term supply guarantee and small lot production available.
We will also search for parts that have been rejected by other companies.
High-purity insulating materials for the purpose of sealing semiconductor chips!
COM-HPC Server Size D module with Intel Xeon D-2700/2800: conga-HPC/sILH
COM-HPC Server Size D module with Intel Xeon D-1700/1800: conga-HPC/sILL
COM Express Basic Type 7 module with Intel Xeon D-1700/1800: conga-B7XI
NXP i.MX 8M Plus equipped with Qseven module: conga-QMX8-Plus
11th Generation Intel Core equipped COM-HPC Client Size B Module: conga-HPC/cTLH
11th Generation Intel Core equipped COM Express Basic Type 6 Module: conga-TS570
11th Generation Intel Core equipped COM Express compact Type 6 (Rugged version): conga-TC570r
NXP i.MX 8M Plus equipped with SMARC module: conga-SMX8-Plus
11th Generation Intel Core equipped COM-HPC Client Size A Module: conga-HPC/cTLU
11th Generation Intel Core equipped COM Express compact Type 6 module: conga-TC570
AMD Ryzen Embedded V2000 equipped COM Express Compact Type 6: conga-TCV2
NXP i.MX 8X series processor equipped SMARC module: conga-SMX8-X
AMD EPYC Embedded 3000 equipped COM Express Basic Type 7: conga-B7E3
3.5-inch SBC with 8th Generation Intel Core (Whiskey Lake): conga-JC370
8th Generation Intel Core COM Express Compact Type 6 Module: conga-TC370
SMARC module with NXP i.MX 8M Mini series processor: conga-SMX8-Mini
Intel Atom x6000E equipped COM Express Compact Type 6: conga-TCA7
Intel Atom x6000E (Elkhart Lake) equipped Qseven module: conga-QA7
Intel Atom x6000E (Elkhart Lake) equipped SMARC module: conga-SA7
Intel Atom x6000E equipped COM Express Mini Type 10: conga-MA7
Intel Atom x6000E (Elkhart Lake) equipped Pico-ITX board: conga-PA7
13th Generation Intel Core equipped COM Express Compact Type 6 module: conga-TC675