This is an introduction to a Chinese company that manufactures power semiconductors using SiC (silicon carbide) and GaN (gallium nitride).
NPU products specialized for AI inference calculations, offering higher performance, lower power consumption, and reduced costs and maintenance compared to traditional GPU chips, making them suitable for Edge AI.
If you need to remove, install, or replace chip resistors, capacitors, IC components, etc. due to design changes or incorrect implementations, please leave it to us!
Introducing dicing blades suitable for semiconductors, displays, solar, and LEDs.
Connect the circuit boards using a pin header with spring characteristics designed for card edge with pin terminals!
Safely and cleanly transporting wafers, the foundation of semiconductor technology!
Reducing labor costs in semiconductor manufacturing. Automation from product positioning, marking, identification to sorting!
Not only wholesale and processing of materials, but also leave the drafting to us!!
Controls conductivity in the range of 10E4 to 11Ω. A tray that excels in low dust generation and static prevention. Material suggestions suitable for the usage environment are also possible.
Haikem has acquired sales agency rights for semiconductor materials! Responding to the shortage of semiconductor materials in Japanese companies both domestically and internationally.
The NL8802 is a high-quality audio operational amplifier that serves as an entry-level model in the MUSES series, offering a balanced combination of sound quality, performance, and cost.
We would like to provide information about test wafers supplied to semiconductor material manufacturers and equipment manufacturers.
Simulations can be performed according to the requested ion species, depth, and concentration.
Carbon nanotubes are expected to have a wide range of applications in fields such as energy, electronics, and nanotechnology.
Molding insulation material that can be used at temperatures exceeding 2,000℃! It excels in insulation properties and workability, making it suitable as furnace material for applications that require purity!
We also accommodate various special-shaped dicing tape frames in different sizes!
Small capacity transport and storage containers for corrosive liquids and high-purity chemicals used in semiconductor manufacturing (such as hydrogen peroxide, nitric acid, sulfuric acid, hydrofluoric acid), UN certified.
In the electronic component mounting metal mask industry, we want to 'always be a pioneer.'
For hole processing, including ultra-fine pores on a nano scale and holes requiring high precision, high quality, high density, and high positioning accuracy, please leave it to Toray Precision.
Die bond for hoop frames, compatible with both eutectic and epoxy (dual-use specification available), supports small chips (from 0.15mm) and provides stable operation!
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Leave semiconductor, electronic components, emergency procurement, and cost reduction to us. We also conduct global investigations of EOL products, cost reduction for long-term manufactured products, and research and procurement of alternatives.
We offer affordable alternatives for hard-to-obtain electronic components and parts that have increased in price!
325W Stereo High Performance, High Definition, Class D Amplifier 'TPA3255'
Single power supply low power consumption, wide bandwidth, voltage feedback operational amplifier "OPA830"
It is a rutile coupler prism for inputting, propagating, and outputting laser light in a thin film optical waveguide.
This is a suitable alternative to the discontinued product from Company C. - Built-in watchdog timer - Reset signal with both positive and negative logic outputs
Capable of handling everything from mass production to small-lot prototyping. Provides comprehensive support for product development, material procurement, assembly, and electrical characteristic testing.
We also support various special-shaped dicing tape frames in different sizes!
We have many years of manufacturing technology and know-how for HTCC multilayer ceramic packages!
Capable of grinding processing and wafer inspection! Developed to meet new tape and customer requirements.
Semiconductor Test Architects
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Features high reliability! This case transports expensive and valuable wafers more securely and safely.
Complete electrostatic measures: We are giving away a sample book of electronic materials 'carrier tape'!
Stable tape transport is possible even for ultra-small sizes (0402, 0603)! Samples are currently available.
Easy expansion of the tester itself! Strong support for mass production of high-density multi-pin devices.
Offering a variety of metal masks produced in-house! A wide range of metal mask products available *Free giveaway ongoing.
As a bonding wire of the copper + Pd system, it was adopted for the first time in the world by a major overseas semiconductor manufacturer.
We are responsible for the design, manufacturing, and sales of burn-in boards, IC sockets, checkers, and other equipment for the inspection and evaluation of electronic devices.
Digital temperature sensor with ±0.5℃ accuracy and digital interface!
A new buff roll that significantly reduces the time compared to the conventional buff roll.
A rubber parts manufacturer that constantly moves forward. They are utilized in various aspects of life.
Clip Bonder - Die bonder for power semiconductors, chip and clip bonding, with optional appearance inspection and NG product punching unit support.
A semiconductor package that supports miniaturization and high density through unique cavity structure formation technology.
Many achievements in semiconductor wafer processes! Introducing our molding support in a clean environment.
The FIB device allows for high-precision processing at the desired position on a Si substrate without a mask at the nano level.
We procure high-purity specialty gases suitable for electronic devices such as semiconductors from China. We have experience handling gases like helium and nitrogen trifluoride.
High-quality, low-cost single crystal SiC wafers ★ Available from just one piece ♪
CZ method/FZ method, we can provide single crystal silicon ingots up to a maximum diameter of Φ600mm!
We provide GaN templates (GaN thin films, GaN thick films) manufactured using the MoCVD method. The substrate uses a sapphire substrate.
We can handle silicon substrates using the CZ method/FZ method, from crystal growth to slicing, lapping, etching, polishing, oxidation film, and epitaxy!
We respond accurately and meticulously to high-level demands in various fields such as astronomy, disaster prevention, and communication!
High thermal conductivity and low thermal expansion semiconductor heat sink made of copper and molybdenum clad material.
Ideal for preventing degradation or destruction of ICs and components from overcurrent such as load short circuits!
A startup from the University of Tokyo! Developed and manufactured using versatile intermediate membranes.
Excellent cost performance! There is no distortion in the design part, and the printing accuracy is outstandingly good.