List of Electronic Components and Modules products

Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

• Other conveying machines

Support from product planning to filling, processing, and shipping for additives, cleaning agents, chemicals, deodorizing and disinfecting agents, etc.! For those who have raw materials but no place t...

• Other consumables
• Processing Contract

It is possible to evaluate the shape change and strain energy when external forces are applied to nanomaterials.

• Contract Analysis
• others
• Secondary Cells/Batteries

We will evaluate the internal structure of the device in a comprehensive manner.

• Contract Analysis
• Other electronic parts

It is possible to capture molecular information of inorganic substances in the depth direction using TOF-SIMS.

• Contract measurement
• Transistor
• Memory

Simultaneous measurement of inorganic and organic components in minute specific areas.

• Contract measurement
• Wafer
• Memory

Not only the surface, but also up to a depth of 30nm - Quantitative evaluation of the chemical state at the surface and inside the material at the same location and non-destructively!

• Secondary Cells/Batteries

We evaluate abnormalities inside the device non-destructively.

• Contract Analysis
• Other electronic parts
• Transistor

Composite approach to the cross-sectional structure and surface shape of the negative electrode, as well as elemental mapping images of the active material cross-section!

• Secondary Cells/Batteries
• Contract measurement

Impurities in films and interfaces such as plating can be evaluated using TOF-SIMS.

• Wafer
• Contract measurement
• Other semiconductors

Shape observation and simple quantitative analysis using SEM-EDX.

• Contract Inspection
• Wafer
• Other semiconductor manufacturing equipment

You can evaluate the p/n polarity and carrier concentration distribution of the diffusion layer in SiC devices.

• Contract Analysis
• Other electronic parts

It is effective to differentiate between the two methods depending on the surface structure of interest.

• Contract Analysis
• Memory

Quantitative evaluation of the guest in the light-emitting layer and film thickness is possible.

• LCD display

High-sensitivity analysis of various solutions, such as pure water and wafer cleaning liquids, is possible.

• Contract Analysis
• Wafer
• Water quality testing

It is possible to evaluate the degree of curing of the resin by capturing changes in functional groups.

• Contract Analysis
• Other electronic parts

It is possible to evaluate the competitive adsorption of multiple molecules using the focus parameters for film formation (temperature, pressure).

• Contract Analysis
• Other electronic parts
• Memory