List of Seminars and Skill Development products
- classification：Seminars and Skill Development
1561～1575 item / All 6497 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Ideal for micro-machining! Achieves deburring of holes and double-sided machining in one pass, which was difficult with conventional tools!
- Other machine tools
We will be exhibiting at Mecatronics Tech Japan 2021 from October 20 (Wednesday) to October 23 (Saturday)!
Our company will exhibit at "Mechatrotech Japan 2021," which will be held at Portmesse Nagoya from Wednesday, October 20 to Saturday, October 23, 2021. We will introduce our tools, including the 'Bar Off Tool' capable of chamfering and deburring from a diameter of 0.8 mm, and the 'FEM' tool breakage detection device that reliably detects breakage. We look forward to your visit. (Booth number: 2B12)
Identify the challenges faced in the verification process! Introducing solutions to the challenges.
- Technical and Reference Books
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Technical Specialty Books - Measures for Foaming in Aqueous Systems, Balancing Film Thickness Control and Quick Drying
- others
- Technical and Reference Books
- Technical and Reference Books
[Book] Troubleshooting Coating and Drying (No. 2198) [Available for Preview]
- Measures against water-based foaming, balancing film thickness control and quick drying - ★ Formation of coffee stains in thin film drying and countermeasures ★ Transparency of coatings! Towards particle control and defect countermeasures! －－－－－－－－－－－－－－－－－－－－－ ■ Table of Contents Chapter 1: Rheology of Coatings and Defect Countermeasures Chapter 2: Principles of Coating Methods and Troubleshooting in the Coating Process Chapter 3: Troubleshooting in the Drying Process Chapter 4: Formulation Design and Functionality of Coatings and Paints Chapter 5: Formation Process of Coatings and Paint Films and Their Evaluation, Analysis, and Assessment －－－－－－－－－－－－－－－－－－－－－ ● Published: May 31, 2023 ● Format: A4, 563 pages ● Authors: 62 ● ISBN: 978-4-86104-952-1 －－－－－－－－－－－－－－－－－－－－－
Detailed development of production methods for useful substances using koji fermentation and their application technologies!
- Food synthesis and fermentation
- Technical Seminar
- Others Synthesis/Fermentation
An explanation of the characteristics of PFAS, regulations, and their impacts on health and the environment, focusing on trends in the development of alternative materials and the current state of sup...
- Technical Seminar
- others
Cultivating employees who can embody hospitality that brings emotion!
- Distance learning/E-learning
- Distance learning/E-learning
Realizing the dream of working in Japan. The goal is to support the development of individuals as global citizens.
- Vocational Training/Technical School
- Vocational Training/Technical School
What I focused on was "effectiveness." English conversation lessons anytime at home or during free time.
- Distance learning/E-learning
- Vocational Training/Technical School
Truly, language skills that can compete globally! The only one-stop solution you can count on is Lingage.
- Distance learning/E-learning
- Vocational Training/Technical School
As a registered support organization, we have abundant know-how in supporting Japanese language learning for foreign workers with specified skills!
- Vocational Training/Technical School
A thorough explanation of semiconductor packaging from the basics to applications!
- Other semiconductors
- others
- Technical and Reference Books
8/5 Webinar: Semiconductor Packaging Technology Course
■Title "Changes in Joint Structures and Packaging Responses Due to the Evolution of Semiconductors ~ Response of Resin Sealing Technology to the Increase in the Number of Joints and Narrow Pitching ~" In semiconductor packages, which are advancing in high integration, high density, and three-dimensionality, addressing the increase in joints (bumps) and narrowing of pitches has become an important challenge. In this seminar, experienced instructors will organize the changes in joint structures accompanying the evolution of semiconductor packages and explain the latest trends, challenges, and countermeasures in resin sealing technology and mounting technology. 【Knowledge Gained from the Seminar】 - Development history and latest trends of semiconductor packaging - Changes in joint structures and packaging technology - Evaluation methods for resin sealing materials and sealing technology - Sealing technology for narrow pitch bumps and reliability improvement - Challenges and countermeasures in advanced packaging 【Target Audience】 Engineers, researchers, and sales representatives from semiconductor-related companies, as well as those involved in semiconductor manufacturing, mounting, sealing materials, and packaging technology.
A detailed explanation of the highly regarded porous metal-organic framework (MOF) from the basics to the latest research! Includes on-demand viewing!
- Technical Seminar
- Distance learning/E-learning
- Other polymer materials
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Aiming for professionalism! Introducing the position and role of JRCA, as well as the history of its activities.
- ISO-related consultant
- Management Seminar
- Qualification Seminar
Publishing know-how on resin molding, mold technology, and CAE analysis. Free distribution campaign for gas vent parts [SG-WIND] for the first 100 site members who register!
- Technical and Reference Books
- Other molds
- Other analyses
How to check for the presence of invisible ion residues! Introducing cleaning know-how.
- Technical and Reference Books