List of For Techies products
- classification：For Techies
316～360 item / All 4664 items
We provide comprehensive support from design to manufacturing and maintenance!
- Contract manufacturing
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
Explaining the basic knowledge of photoresist essential for high-density packaging.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Fundamental knowledge of photoresist essential for microstructure processing in MEMS.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Basic knowledge of photoresists useful for manufacturing small actuators.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Fundamental knowledge of photoresist essential for forming wiring patterns on printed circuit boards.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
An explanation of the basic knowledge of photoresist, which is essential for semiconductor manufacturing.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Measures against salt damage for ships! An explanation of the basics of electrodeposition coating.
- Coating Agent
- Technical and Reference Books
Enhancing rust prevention for automobiles! Here is an explanation of the basics of electrocoating.
- Coating Agent
- Technical and Reference Books
Basic knowledge of electrodeposition coating that contributes to the longevity of infrastructure facilities.
- Coating Agent
- Technical and Reference Books
Basic knowledge of electrophoretic painting that helps ensure the insulation of OA machines.
- Coating Agent
- Technical and Reference Books
Basic knowledge of electrodeposition coating to enhance the durability and aesthetics of stationery.
- Coating Agent
- Technical and Reference Books
![[Book] Reducing CTE in Semiconducto...](https://image.mono.ipros.com/public/product/image/342077/IPROS9071615174886190092.gif?w=280&h=280){kind=small}
[Available for preview] ~ Chiplets, responding to 2.5D/3D high-density packaging ~
- Technical and Reference Books
[Book] Reducing CTE in Semiconductor Packaging and Warpage Countermeasures (No. 2367) [Available for preview]
~Chiplets, Responding to 2.5D/3D High-Density Packaging~ ◎ What are the key points for integrating materials with different thermal expansion coefficients and elastic moduli? ◎ A comprehensive overview of thermal stress countermeasures required in high thermal density environments and composite packages. ---------------------------- ■ Table of Contents Chapter 1: Development Trends of Element Technologies for Miniaturization and Integration of Semiconductor Packages Chapter 2: Development Trends of Filler Materials Enabling Improved Thermal Conductivity and Low Thermal Expansion Chapter 3: Development Trends of Negative Thermal Expansion Materials Chapter 4: Surface Treatment, Dispersion, and Filling Techniques for Fillers Chapter 5: Development Trends of Low Thermal Expansion Substrate Materials and Glass Substrates Chapter 6: Development of Semiconductor Encapsulation Materials and Stress Reduction Chapter 7: Development of Bonding Materials Chapter 8: Development Trends of Low CTE Resin Materials Chapter 9: Evaluation and Simulation Techniques in Semiconductor Packaging Materials ---------------------------- ● Publication Date: July 31, 2026 ● Format: A4, 395 pages ● Authors: 33 ● ISBN: 978-4-86798-163-4 ----------------------------
![[Book] Materials Informatics (No. 2...](https://image.mono.ipros.com/public/product/image/342077/IPROS15036913493640052264.gif?w=280&h=280){kind=small}
[Available for preview] - High-speed exploration of new material candidates, prediction of compositions and structures that meet desired properties, optimization of formulation conditions.
- Technical and Reference Books
[Book] Development of Polymer Materials through Materials Informatics (No. 2365) [Available for preview]
- High-speed exploration of new material candidates, prediction of compositions and structures that meet desired properties, optimization of formulation conditions - ★ Explaining the key points for organizing all internal and external data such as molecular structures, images, spectra, and literature/patent information into a usable form for MI! ---------------------------- ■ Table of Contents Chapter 1: Materials Development, Structural Design, and Applications through Materials Informatics Chapter 2: Molecular Design and Reaction Analysis for Materials Development, Descriptorization of Compounds Chapter 3: Optimization of Formulation Conditions, Prediction of Composition Ratios, and Extraction of Reaction Factors Using Machine Learning and Simulation Chapter 4: Collection, Analysis, and Processing of Experimental and Measurement Data for Materials Development and Process Design Chapter 5: Introduction and Operation of Autonomous Experiments and Automation Technologies in Materials Development ---------------------------- ● Publication Date: July 31, 2026 ● Format: A4 size, 425 pages ● Authors: 41 ● ISBN: 978-4-86798-162-7 ----------------------------
![[Book] Removal and Prevention of Bi...](https://image.mono.ipros.com/public/product/image/342077/IPROS3927512216342148316.gif?w=280&h=280){kind=small}
【Available for preview】◎ A complete manual for the removal of biofilm to break through "slime" and "resistance" for the field!
- Technical and Reference Books
【Book】Development of Biofilm Removal, Prevention, and Formation Inhibitors (No.2363) 【Available for preview】
◎ A Complete Manual for the Removal of Biofilms to Overcome "Slime" and "Resistance" for the Field! －－－－－－－－－－－－－－－－－－－－－ ■ Table of Contents Chapter 1: Mechanisms of Biofilm Formation Chapter 2: Various Evaluation Methods for Biofilms Chapter 3: Evaluation Methods for the Development of Anti-Biofilm Products Chapter 4: Types and Characteristics of Anti-Biofilm Agents Chapter 5: Development of Anti-Biofilm Agents from the Perspective of Bacterial Adhesion Prevention Chapter 6: Mechanisms of Biofilm Formation Inhibition and Development of Anti-Biofilm Agents Chapter 7: Control, Removal, and Prevention Measures for Oral and Infection-Derived Biofilms Chapter 8: Specific Control, Removal, and Prevention Measures for Biofilms Occurring in Living Environments Chapter 9: Specific Control, Removal, and Prevention Measures for Biofilms Occurring in Food Chapter 10: Specific Control, Removal, and Prevention Measures for Biofilms Occurring in Factories, Machinery, and Piping －－－－－－－－－－－－－－－－－－－－－ ● Publication Date: July 31, 2026 ● Format: A4, 384 pages ● Authors: 65 ● ISBN: 978-4-86798-161-0 －－－－－－－－－－－－－－－－－－－－－
![[Book] Dynamic Viscoelasticity Meas...](https://image.mono.ipros.com/public/product/image/572/2000674194/IPROS31076941735868389271.jpeg?w=280&h=280){kind=small}
Technical Specialized Books - Polymers, Composite Materials, Emulsions, Suspensions, Gels, Cosmetics, Food -
- others
- Technical and Reference Books
- Technical and Reference Books
[Book] Dynamic Viscoelasticity Measurement and Its Data Interpretation Cases (No. 2135BOD)
■Table of Contents Chapter 1: Measurement Methods and Simulation of Dynamic Viscoelasticity Chapter 2: Measurement of Dynamic Viscoelasticity of Polymers and Composite Materials and Case Studies of Data Interpretation Chapter 3: Setting Conditions and Evaluation of Molding and Processing Processes Utilizing Dynamic Viscoelasticity Measurement Data Chapter 4: Measurement of Dynamic Viscoelasticity of Gels and Case Studies of Data Interpretation Chapter 5: Measurement of Dynamic Viscoelasticity of Pastes, Coatings, and Adhesives and Case Studies of Data Interpretation Chapter 6: Measurement of Dynamic Viscoelasticity of Cosmetics and Case Studies of Data Interpretation Chapter 7: Measurement of Dynamic Viscoelasticity of Foods and Case Studies of Data Interpretation －－－－－－－－－－－－－－－－－－－－－－－－－－ ●Publication Date: December 24, 2021 ●Authors: 57 ●Format: A4 size, 589 pages Hardcover Edition: Price: 88,000 yen (tax included) ISBN: 978-4-86104-866-1 ↓↓ The hardcover edition is out of print ↓↓ On-Demand Edition Available Price: 44,000 yen (tax included) ISBN: 978-4-86798-047-7 After receiving your order, we will perform simple printing and binding －－－－－－－－－－－－－－－－－－－－－－－－－－
Instead of training to "know" AI, we offer training that is "usable" in business. Customization of training themes is also possible.
- Technical Seminar
We will standardize skills using training content utilizing the metaverse and improve the corporate level!
- Distance learning/E-learning
- Other services
The hegemony strategy of "materials, interfaces, and thermal control" that takes away profits from AI semiconductors!
- Technical and Reference Books
- Other semiconductors
- others
[Free event on 9/3] Ministry of Economy, Trade and Industry presentation! We will explain the current state and challenges of Japan's manufacturing industry based on the 2026 edition of the White Pape...
- Technical Seminar
- Seminar
Leave energy-saving through heat energy recovery to us!
- Technical Seminar
- Chiller
- Heat exchanger
For researchers and technology developers in the manufacturing industry! Experiment Design (DOE) that can be started with no code.
- Technical Seminar
- Statistical analysis
Utilization of the experimental design features of the statistical analysis software JMP in the manufacturing industry.
JMP is a software that not only excels in statistical analysis and graph creation but also has robust features for experimental design. By utilizing experimental design, efficient data collection can be achieved while keeping time and costs down. In this seminar, we will focus on the features of experimental design, specifically the sample size explorer and Bayesian optimization, and present examples of their application in the manufacturing industry in a demonstration format. [Overview] First half: Utilization of t-tests in the manufacturing industry and simulation of required data numbers We will explain the overview and examples of t-tests, which are used for various purposes in the manufacturing industry, and introduce analysis examples using JMP. Additionally, we will demonstrate how to simulate the relationship between the required data numbers for t-tests and statistical power using the sample size explorer. Second half: Utilizing JMP Pro Bayesian optimization - Application to simulation experimental data The Bayesian optimization platform is originally designed for experimental data that includes measurement errors; however, there is also a significant demand to apply it to simulation experimental data that does not include errors, such as CAE. In this seminar, we will introduce approaches for utilizing Bayesian optimization with simulation experimental data.
We will organize how the Japanese manufacturing industry will confront labor shortages, uncertainties, and the need for productivity improvement!
- Technical Seminar
- Seminar
A major reorganization of the chemical industry begins in the era of AI, semiconductors, and EVs! It is viewed not just as an issue for the chemical industry, but as a societal infrastructure problem!
- Technical and Reference Books
- others
A must-have book for researchers and engineers struggling with motor vibration and noise, providing solutions through 553 Q&A items!
- Technical and Reference Books
From the current state of international regulations and rules to the latest trends in debris removal technology.
- Technical and Reference Books
Seize the light of the next generation! A detailed explanation of the latest research trends in advanced solar cell technology and the challenges toward social implementation!
- Technical and Reference Books
Measurement of heat, development of heat dissipation materials, and explanation of thermal design and cooling technology!
- Technical and Reference Books
From breeding and process DX to precision fermentation and upcycling.
- Technical and Reference Books
Manipulating light to create the future, a detailed explanation of the cutting-edge technological innovations opened up by photonic crystals and photonic nanostructures!
- Technical and Reference Books
From two dimensions to three dimensions: 3D packaging technology that greatly influences the performance of semiconductors.
- Technical and Reference Books
The forefront of the transformation of the semiconductor industry structure.
- Technical and Reference Books
A comprehensive explanation of hydrogen utilization from the basics to applications through combustion!
- Technical and Reference Books
Key points of experimental observation
- Technical and Reference Books