List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
2266～2280 item / All 5179 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Ideal for micro-machining! Achieves deburring of holes and double-sided machining in one pass, which was difficult with conventional tools!
- Other machine tools
We will be exhibiting at Mecatronics Tech Japan 2021 from October 20 (Wednesday) to October 23 (Saturday)!
Our company will exhibit at "Mechatrotech Japan 2021," which will be held at Portmesse Nagoya from Wednesday, October 20 to Saturday, October 23, 2021. We will introduce our tools, including the 'Bar Off Tool' capable of chamfering and deburring from a diameter of 0.8 mm, and the 'FEM' tool breakage detection device that reliably detects breakage. We look forward to your visit. (Booth number: 2B12)
Equipped with a holder that supports substrate rotation and substrate heating! Continuous film deposition is possible without releasing into the atmosphere!
- Evaporation Equipment
Transport between chambers is achieved by the transfer rod! Continuous film formation is possible without releasing into the atmosphere!
- Evaporation Equipment
- Sputtering Equipment
Custom production is possible according to application from single item prototypes! Lineup includes "EB Gun" and "K Cell"!
- Sputtering Equipment
- Other machine elements
Equipped with an EB source expansion port! Compatible with 4-inch substrates, it features a substrate heating mechanism and a film thickness control mechanism!
- Evaporation Equipment
We will introduce energy semiconductor device research and development systems compatible with φ4-inch substrates!
- Plasma surface treatment equipment
- Sputtering Equipment
- Analytical Equipment and Devices
A compact and space-efficient device! The substrate supports φ4 inch, and it comes with a heating mechanism and T/S variable mechanism!
- CVD Equipment
Contributing to the reduction of environmental impact and total cost down in the barrel polishing process.
- Wafer processing/polishing equipment
Equipped with fully automatic and enhanced device functions, as well as remote monitoring capabilities! Contributing to increased productivity in the dicing process!
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
Semiconductor failure analysis, yield analysis, reverse engineering, microdisplay failure analysis.
- Etching Equipment
- Other semiconductor manufacturing equipment
Started operations as a major supplier of high-precision pressure calibration equipment to government agencies around the world.
- Calibration and repair
- Tester
- Other measurement, recording and measuring instruments
Achieving probing compatible with multiple simultaneous measurements! Correcting misalignment after dicing.
- probe
- Semiconductor inspection/test equipment
High current/high voltage probing is possible! Achieving contact on both sides of the wafer.
- probe
- Semiconductor inspection/test equipment
This is a high-precision SC-cut OCXO in a 7×5mm size. It is a high stability, fixed frequency type with ±20ppb (-40 to +85℃). It is a standard stock item.
- Semiconductor inspection/test equipment
- Power Monitoring Equipment
- Time-frequency measurements
This is a high-precision SC-cut OCXO in a 14×9mm size. It has a high stability fixed frequency of ±10ppb (-40 to +85℃). It is a standard stock item.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
- Other electronic parts