List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
2296～2310 item / All 5179 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Ideal for micro-machining! Achieves deburring of holes and double-sided machining in one pass, which was difficult with conventional tools!
- Other machine tools
We will be exhibiting at Mecatronics Tech Japan 2021 from October 20 (Wednesday) to October 23 (Saturday)!
Our company will exhibit at "Mechatrotech Japan 2021," which will be held at Portmesse Nagoya from Wednesday, October 20 to Saturday, October 23, 2021. We will introduce our tools, including the 'Bar Off Tool' capable of chamfering and deburring from a diameter of 0.8 mm, and the 'FEM' tool breakage detection device that reliably detects breakage. We look forward to your visit. (Booth number: 2B12)
Positioning jigs, components for semiconductor manufacturing equipment, high-temperature insulating materials!
- Etching Equipment
For semiconductor manufacturing equipment components, heat dissipation plates!
- Etching Equipment
Reduce waste liquid to improve cost and yield. Free demo available with sample submission!
- Other semiconductor manufacturing equipment
The hardness is approximately twice that of hard chrome plating (Hv1800)! Introducing the world's first amorphous chrome plating.
- Other semiconductor manufacturing equipment
- Surface treatment contract service
Scheduled to exhibit at the Functional Film Expo 2022 (Osaka Industry Creation Center)
Notice: Upcoming Exhibition Functional Film Expo 2022 Date: July 27 (Wednesday), July 28 (Thursday) Location: Osaka Industry Creation Center, 3rd and 4th Floors Time: July 27, 13:30 - 17:00 July 28, 10:00 - 16:00 *Please note that prior registration is required. We invite you to visit our booth when you come. We look forward to seeing you.
The AD830Plus is an ultra-fast epoxy die bonder with a cycle time of 0.16 seconds per chip.
- Bonding Equipment
We offer a lineup of CMP equipment ranging from tabletop models to those compatible with 300mm wafers! Customization and new designs are possible, including features like Dry-in/Dry-out!
- Wafer processing/polishing equipment
Cleanly removes stains such as crystallization! Foam-type developer cleaning agent.
- Cleaning agents
- Photomask
By performing "cutting" and "polishing" in one process, we achieve a significant reduction in cross-section cutting work time and high-quality cuts! It can be easily operated by anyone without any ski...
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
Achieving high-quality and high-efficiency cutting of various materials, from difficult-to-cut materials like SiC and LTCC to composite materials such as glass and resin!
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
Made of 0.2% BeCu alloy for low gas emission! An alternative to stainless steel.
- Other semiconductor manufacturing equipment
- Vacuum Equipment
Measuring limits and analyzing extremes 【Tokyo Electron Online EXPO】 Open!
The Tokyo Electron Online Expo hosted by Tokyo Electron is now open! We are showcasing gas analyzers and new vacuum structural materials. Please feel free to stop by.
Contract analysis services using a high-precision quadrupole mass spectrometry system. Detection of ultra-microscopic leaks as well.
- Other semiconductor manufacturing equipment
- Other measurement, recording and measuring instruments
A highly versatile and widely used type primarily intended for coating cushioning materials, building materials, and food plastics!
- Other painting machines
- Coater
Responding to the challenges of assembly!
- Bonding Equipment
- Other services
Quartz glass bobbin used, quartz glass tube immersion heater.
- Other semiconductor manufacturing equipment
- Processing Contract
Dissipates heat and reduces wrap surface friction! Effective when high precision flatness and surface finish are required.
- Wafer processing/polishing equipment
- Other processing machines