List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
481～510 item / All 5041 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
Introducing the issues of non-degradable organic substances and examples of wastewater treatment with diagrams and photos!
- Oxidation/Diffusion Device
- others
Introducing a method for the decomposition treatment of organic matter containing refractory organic substances!
- Oxidation/Diffusion Device
- others
Achieve multi-functional bonding solutions with a single unit! Specialized in bonding for batteries.
- Bonding Equipment
"Improving productivity, bond quality, and reliability" - Expanding the bonding area, equipped with advanced pattern recognition, and enhancing process control in wire bonding.
- Other processing machines
- Bonding Equipment
- Other semiconductor manufacturing equipment
The Model 1200 tabletop reflow device is an ideal tabletop unit for process development and small-scale production of microelectronics packages.
- Bonding Equipment
Supports the installation of multi-functional high-precision components! Compatible with applications requiring advanced load control and image recognition. [Demo units available for loan]
- Bonding Equipment
Stable and high-quality wire bond process management! Achieve improved operating rates and high productivity!
- Bonding Equipment
- Other mounting machines
- Other contract services
Wedge bonder equipped with a direct drive motion system and a high-performance image recognition system, achieving high productivity and reliability.
- Other processing machines
- Bonding Equipment
- Other semiconductor manufacturing equipment
Techno Alpha is the Japanese distributor of K&S wire bonders, which boasts a top-class global share in wire bonding, as well as consumables for wire bonders.
- Bonding Equipment
- Other semiconductor manufacturing equipment
- Semiconductor inspection/test equipment
Compatible with in-situ ellipsometers and transmission spectrometers! High-speed ALD equipment manufactured by the German company FHR.
- Other semiconductor manufacturing equipment
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From design to after-service of the equipment! We can offer various equipment proposals.
- Sputtering Equipment
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Support for the entire lifecycle from device design to after-sales service!
- Sputtering Equipment
- Plasma surface treatment equipment
We relentlessly pursue customer satisfaction and technical expertise, contributing to society. We have extensive experience in contract manufacturing for OEMs and prototype machines.
- CVD Equipment
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
Under the management philosophy of 'pursuing customer satisfaction and technical expertise to the utmost and contributing to society,' we develop our business.
- Vacuum Equipment
- Evaporation Equipment
- Sputtering Equipment
Using conductive PP! Suitable for prototypes and small-scale transportation, shipping, and storage.
- Racks and Cases
- Other semiconductor manufacturing equipment
- cabinet
Introduced the ROKURO CEGA capable of processing at Φ0.01. Also supports simultaneous 5-axis machining.
- Ion implantation equipment
Round hole filters and honeycomb mesh, etc.! You can create freely shaped designs.
- Etching Equipment
- Optical inspection of LEDs - Electrical characteristic testing - High-speed processing of classification - By exchanging attachments, one machine can be used for both side view and top view.
- Automatic sorting machine
- Chip type LED
- Other semiconductor manufacturing equipment
Standard products available in a variety of sizes, customization is also OK! *Currently offering product samples to 10 people by lottery.
- Other semiconductor manufacturing equipment
We will be exhibiting at the Kyoto Pulse Plaza, which will be held in Kyoto from February 18, 2026.
This time, Orte Corporation will exhibit at "Kyoto Pulse Plaza" again this year, following our participation in last year's semiconductor exhibition. The latest cutting-edge collets that can only be seen here will be on display! Our specialists in chip transport collets will unveil the latest lineup that solves on-site "troubles"! Be amazed by our rubber collet that achieves a contact width of less than 0.1mm! Of course, we have rubber collets that address ionizer countermeasures, as well as patented holder mechanisms that perfectly accommodate high-aspect and large chips. You will surely find yourself thinking, "This is the collet I wanted!"... We plan to showcase many actual samples! You can actually hold, touch, and experience the performance on the spot. Please come and visit our booth! We are confident that you will definitely think, "I'm glad I came to see this!" 【Exhibition Contents】 - Pickup collets (rubber/plastic/metal/others) - Bonding-related components (upward needles, dispense nozzles, transfer pins) - Wire bonding-related components (EFO torch, wire clampers, window clampers, finger clamps) - Transport components (magazine racks, IC chip trays)
High-performance, cost-effective RF/DC magnetron sputtering device for research and development.
- Other semiconductor manufacturing equipment
- Sputtering Equipment
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
Supports RCA cleaning and various etching! Significantly reduces the usage of chemicals and pure water as well as the footprint.
- Other surface treatment equipment
- Other semiconductor manufacturing equipment
Accommodating various process needs with a diverse range of chamber forms! Work sizes range from 2-inch to 12-inch wafers.
- Other surface treatment equipment
- Other semiconductor manufacturing equipment
Power module and secondary battery circuit formation! Digital control of position, load, and ultrasound.
- Bonding Equipment
Notice of Participation in "JPCA Show 2025" from June 4 (Wednesday) to June 6 (Friday), 2025.
Adwells Co., Ltd. will be exhibiting at the "JPCA Show 2025 (Total Solution Exhibition for Electronic Devices)" held at Tokyo Big Sight. At the exhibition, we will introduce ultrasonic application technologies such as heat sink formation, power module bonding, DMB bonding, flexible substrate bonding, and ultrasonic cutting. Additionally, we plan to display a variety of samples processed with our equipment from various fields, which we believe will be helpful in realizing new ideas and solving challenges. We invite you to visit our booth when you attend the event.
High-speed line inspection at SWIR 2K×1, 110kHz
- Monochrome camera
- Semiconductor inspection/test equipment
Flow spray of 2 mmlit/min or less is possible!
- nozzle
- valve
- Etching Equipment
The website of the ultrasonic spray nozzle manufacturer "Sonaer" has been renewed.
The website of the ultrasonic spray nozzle manufacturer "Sonaer" has been renewed. Compared to the previous website, product browsing has improved, and we have also started offering a new system. If you are interested, please feel free to contact us.
Achieving ultra-precise dispensing through screw rotation! Extensive track record and versatility in LED/line coating/3D coating!
- Bonding Equipment
Notice of Participation in Internepcon 2018: Solder Jet Demonstration! Free Samples for the First Visitors
Dear Sir/Madam, I would like to congratulate you on the continued prosperity of your company. I sincerely appreciate your exceptional support. Our company will be exhibiting at the 47th InterNEPCON Japan, which will be held at Tokyo Big Sight from January 17 (Wednesday) to January 19 (Friday), 2015. We would like to cordially invite you to see our ultra-precision dispenser equipment and high-precision dispenser (cream solder jet). All of our employees and staff are looking forward to your visit. ◎ Exhibition Booth: E7-38 <Exhibition Details> - Cream solder jet dispenser demonstration (Sample application gifts available on a first-come, first-served basis) - Proposals and displays of optimal equipment for smartphone component mounting and automotive semiconductor applications - Business negotiation room available <Contact Information> Shinwa Co., Ltd. Mechatronics System Center Contact: Ozawa TEL: 052-739-0175 E-Mail: kenji-ozawa@shinwa-jpn.co.jp
A super compact spin coater that won't be in the way even inside the glove box.
- Other semiconductor manufacturing equipment