List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
496～540 item / All 5007 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
A unique LED UV curing solution with numerous patents obtained! Applying UV resin curing in electronics, industry, medical, and optics!
- Other semiconductor manufacturing equipment
- LED Module
- Ultraviolet irradiation equipment
Expanding UV LED products to strengthen response to the growing and diversifying needs for ultraviolet curing.
Excelsius Noble Light Japan Co., Ltd. (Headquarters: Bunkyo-ku, Tokyo, President: Masahiko Suzuki, hereinafter referred to as "the Company") will expand its product portfolio of UV LEDs, one of the light sources for UV curing, and strengthen the provision of UV curing process solutions in new growth areas. In January 2024, the Company was absorbed by Excelsius Technologies, headquartered in the United States (hereinafter referred to as "Excelsius"), and is now handling UV LED products previously managed by its predecessor, Heraeus Noblelight Japan Co., Ltd., and Foseon Technology Japan Co., Ltd., as well as Excelsius. These products encompass a wide range of UV LED light sources for line and area irradiation as well as spot irradiation, regardless of cooling methods. As market demands become increasingly diverse, the Company has established a system that enables more detailed proposals to a broad range of industries through this product expansion.
For the semiconductor industry! Process analyzer / Online analyzer for monitoring tetramethylammonium hydroxide (TMAH) in developer solutions!
- Analytical Equipment and Devices
- Wafer
- Semiconductor inspection/test equipment
Achieving thin film coating in micrometer units with a coater head (slot coat) application device.
- Coater
Used for temporary fixing and bonding with hot melt adhesive!
- Molding Equipment
OptiSeal VSE is a versatile external pressure face seal. It features low friction, excellent chemical resistance, and can be used in environments ranging from extremely low temperatures to high temper...
- Sealing
- Other machine elements
- Other semiconductor manufacturing equipment
We provide high-quality circuit processing and wiring processing services using FIB. We achieve a high processing yield!
- Semiconductor inspection/test equipment
- Semiconductors and ICs
- Microcomputer
Supply disruptions from semiconductor manufacturers, the electrification of the automotive industry, and the spread of 5G communication. Are you keeping up with the urgent need for alternative product evaluations, authenticity assessments, and failure analysis?
The spread of 5G communication, the electrification of the automotive industry, the intensification of US-China trade friction represented by certain semiconductor manufacturers leading to supply stoppages, and the rapid increase in digital products due to the impact of the COVID-19 pandemic are various social phenomena that are increasing the demand for semiconductors. Along with these developments, the acceleration of semiconductor supply risks is progressing. In addition to the adoption of new products, evaluation of existing and distributed products is also necessary... However, the personnel involved in new adoption and product evaluation are limited. Do you have any of these concerns? - Lack of know-how to evaluate semiconductor components - Want to evaluate alternative products but lack personnel and equipment - Want to use stock items and market products but have concerns about reliability - Unable to determine whether the delivered semiconductor products are counterfeit or genuine At Eurofins FQL, we leverage our years of experience in component evaluation and failure analysis to provide not only semiconductor evaluations but also failure analysis services. Additionally, we offer evaluations of distributed products to assist in determining the authenticity of counterfeit, imitation, or long-term stored items. Please feel free to contact us.
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Automating the concentration process involving neutralization and matrix removal in ion chromatography to measure impurities in high-purity ammonium hydroxide used in semiconductor manufacturing.
- Analytical Equipment and Devices
- Ion Chromatography
- Semiconductor inspection/test equipment
Processing S45C quenched and tempered steel using high-precision CNC machining technology. Manufacturing ring components for semiconductor manufacturing equipment.
- Other semiconductor manufacturing equipment
- Processing Contract
Using SUS304 stainless steel and utilizing NC lathes, machining centers, and cylindrical grinding, we manufacture high-precision ring components for semiconductor manufacturing equipment.
- Other semiconductor manufacturing equipment
- Processing Contract
Measurement of hydrogen peroxide trimethylamine and standard cations for semiconductor manufacturing using ion chromatography.
- Ion Chromatography
- Semiconductor inspection/test equipment
- Analytical Equipment and Devices
Storage-compatible glove box PVD flexible thin film experimental device, featuring a tall chamber with a height of 570mm, contributes to improved uniformity during deposition.
- Evaporation Equipment
- Sputtering Equipment
- Annealing furnace
□■□■【Mini-BENCH】Ultra High Temperature Tabletop Experimental Furnace Max 2000℃ □■□■
Tabletop Small-Size Experimental Furnace - Space-Saving, Maximum Operating Temperature 2000℃ ◆ Equipment Configuration ◆ We will propose the desired configuration according to your budget and purpose. (A) Minimum Configuration: Chamber + Temperature Control Unit (B) Above Minimum Configuration (A) + Vacuum Exhaust System (Pump, Gauge, Valve, Vacuum Piping) ◉ Cylindrical Heater: For sintering samples in crucibles (for solid, powder, granule, and pellet-shaped samples) ◉ Flat Heater: For sintering Φ1" to Φ6" wafers and small chip samples ◆ Basic Specifications ◆ - Heater: C/C Composite (Carbon Furnace), Tungsten (Metal Furnace) - Insulation Material: Graphite Felt, Tungsten/Molybdenum - Temperature Control: Programmable Temperature Controller, C Thermocouple - Achievable Vacuum Level: 1x10-2 Pascal (*for an empty furnace) - Power Supply Specifications: AC200V 50/60HZ Three-Phase 6KVA - Cooling Water: 3L/min, 0.4Mpa 25-30℃ ◆ Control Box Specifications ◆ - Programmable Temperature Controller - DC Power Supply Unit or External Transformer Box - Current and Voltage Meters - Heater Circuit Trip Switch - Main Power Switch ◆ Options ◆ - Vacuum Exhaust System - Custom Crucibles and Others
A compact multi-thin film device that incorporates sputtering, deposition, electron beam (EB), and annealing thin film modules in a 60-liter volume chamber, suitable for various applications.
- Sputtering Equipment
- Evaporation Equipment
- CVD Equipment
Wafer Annealing Equipment [ANNEAL] Max 1000℃ APC Automatic Pressure Control MFC x3 System Compatible with Φ4 to 6 inch Substrates
Max 1000℃, MFC up to 3 systems, APC pressure control, compatible with substrates from 4" to a maximum of 6", high vacuum annealing device (<5 × 10-7 mbar) [ANNEAL] is a research and development annealing device capable of high-temperature heat treatment of substrates such as wafers in a stable process atmosphere. It allows high-temperature processing up to 1000℃ using a heating stage installed in a high vacuum water-cooled SUS chamber. A heat shield is installed inside the chamber to ensure safety through interlock. The mass flow controller can be expanded to a maximum of 3 systems, enabling firing operations with precisely adjusted process gas pressure (APC automatic process control system option). Additionally, there are many options available, including a front view port, dry scroll pump, special substrate holder, and additional thermocouples. The heating stage inside the chamber has three variations depending on the process gas atmosphere and treatment temperature: - Halogen lamp heater: Max 500℃ - C/C composite heater: Max 1000℃ (in vacuum, inert gas only) - SiC coating heater: Max 1000℃ (vacuum, inert gas, O2)
Max 1000℃, MFC maximum 3 systems, APC pressure control, compatible with 4" or 6" substrates, high vacuum annealing equipment (<5 × 10^-7 mbar)
- Annealing furnace
- Heating device
- Electric furnace
【MiniLab-125】 Multi-target sputtering system (compatible with Φ8") equipped with a 1000℃ heater stage (SiC coating)! Compact size!
Multifunctional Multi-Sputtering Device (Compatible with Φ8inch Substrates) - Triple-source simultaneous deposition + Single-source Pulse DC sputtering - Flexible arrangement of RF500W and DC850W power supplies to the three-source cathodes (Source 1, 2, 3) - Equipped with a 5KW Pulse DC power supply → Used with dedicated cathode (4) - Substrate heating stage Max 800℃ (SiC-coated heater can achieve Max 1000℃) - MFC x 3 systems (Ar, O2, N2) for reactive sputtering - Main chamber RIE etching stage RF300W - LL chamber <30W low-power controlled soft etching - Unique "Soft-Etching" technology reduces substrate damage through substrate bias - Touch panel or Windows PC operation: All operations can be performed via touch panel/PC without dispersing control. - Equipment installation dimensions: 1,960(W) x 1,100(D) x 1,700(H) mm - Multi-chamber configurations are also possible. ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc., can also be configured.
Handling electronic assembly products such as solder balances and stirrers, as well as soldering equipment and semiconductor devices!
- Soldering Equipment
- Other semiconductor manufacturing equipment
Inspection is possible only on the surface of the double-sided implementation substrate! Also compatible with 3D tomography inspection. *Detailed explanatory materials will be provided.
- Semiconductor inspection/test equipment
- X-ray inspection equipment
Automatically inspect crystal defect voids inside silicon wafers!
- Semiconductor inspection/test equipment
- X-ray inspection equipment
X-ray observation device for analysis with a high resolution of 0.25 μm focal spot size.
- Semiconductor inspection/test equipment
- X-ray inspection equipment
Automated X-ray inspection device for inspecting solder bumps on wafers.
- Semiconductor inspection/test equipment
- X-ray inspection equipment
Automation of super finishing processes and uniformity of roughness. We propose polishing equipment for outer diameter, inner diameter, end face, etc., tailored to your applications and shapes.
- Wafer processing/polishing equipment
Highly versatile! Guarantees a shining edge, perfect finish, and short processing time.
- Wafer processing/polishing equipment
A highly versatile fully electric solution for flat and shaped edges!
- Wafer processing/polishing equipment
Guaranteed high-quality finish and consistent performance! Stone grinding machine with excellent output.
- Wafer processing/polishing equipment
- Stone Processing Machinery
Vivid in the vertical direction! Precisely vertically polished straight edges of marble and granite.
- Wafer processing/polishing equipment
Unique solutions for precision, efficiency, and reliability in stone polishing.
- Wafer processing/polishing equipment
- Stone Processing Machinery
High-precision inspection equipment compatible with transparent materials.
- Semiconductor inspection/test equipment
[Exhibition Information] We will be exhibiting at 'SEMICON JAPAN 2025'.
We will be exhibiting Kubota's semiconductor inspection equipment at SEMICON JAPAN, an international exhibition of manufacturing technologies, equipment, and materials in the semiconductor industry. All of our staff sincerely look forward to your visit. 【Exhibition Information】 Date: December 17 (Wed) - 19 (Fri), 2025, 10:00 - 17:00 Venue: Tokyo Big Sight Booth Location: W1963 *Advance registration is required for attendance. Please check the SEMICON JAPAN website for registration details.
Automating visual inspection of wafer defects.
- Semiconductor inspection/test equipment
[Exhibition Information] We will be exhibiting at 'SEMICON JAPAN 2025'.
We will be exhibiting Kubota's semiconductor inspection equipment at SEMICON JAPAN, an international exhibition of manufacturing technologies, equipment, and materials in the semiconductor industry. All of our staff sincerely look forward to your visit. 【Exhibition Information】 Date: December 17 (Wed) - 19 (Fri), 2025, 10:00 - 17:00 Venue: Tokyo Big Sight Booth Location: W1963 *Advance registration is required for attendance. Please check the SEMICON JAPAN website for registration details.
Equipped with a review microscope! Defects detected can be observed in real-time with the microscope.
- Semiconductor inspection/test equipment
[Exhibition Information] We will be exhibiting at 'SEMICON JAPAN 2025'.
We will be exhibiting Kubota's semiconductor inspection equipment at SEMICON JAPAN, an international exhibition of manufacturing technologies, equipment, and materials in the semiconductor industry. All of our staff sincerely look forward to your visit. 【Exhibition Information】 Date: December 17 (Wed) - 19 (Fri), 2025, 10:00 - 17:00 Venue: Tokyo Big Sight Booth Location: W1963 *Advance registration is required for attendance. Please check the SEMICON JAPAN website for registration details.
Significantly reduce tact time with continuous dispensing! The ultra-precision dispenser device 'Quspa-LX' enables high-precision fine dispensing.
- Other semiconductor manufacturing equipment
Notice of Exhibited Products and Events for Nepcon Japan 2024
We are pleased to announce that Shinwa will be exhibiting at the Internepcon Japan, which will be held from January 24 to January 26. Date: January 24 (Wed) - January 26 (Fri) 10:00 AM - 5:00 PM Location: Tokyo Big Sight, East Hall 1 Booth Number: [E4-8B] At our booth, we will be showcasing the newly redesigned dispenser device "Quspa-LX" for the first time. You will be able to see a demonstration. Additionally, we will introduce the TXC Corporation's crystal oscillators, which hold the number one global market share, and the CMOS camera modules for automotive applications from the Foxconn Group. On January 25 (Thu), the famous YouTuber Monozukuri Taro will be appearing at our booth! He will clearly explain the appeal of our new products. There will be two sessions on that day, so don't miss this opportunity! Morning: 11:00 AM Afternoon: 3:00 PM We look forward to seeing you there. Please note that pre-registration is required for entry to Internepcon Japan this year. If you have not registered, please do so via the link.
Stäubli cleanroom robots have a proven track record in environments that require high cleanliness standards.
- Transport and handling robots
- Other semiconductor manufacturing equipment
- Articulated Robot
Super cleanroom compatible high-precision 6-axis robot
- Other semiconductor manufacturing equipment
Tabletop conveyor. How about for simple verification of fine parts?
- Image Processing Equipment
- Other semiconductor manufacturing equipment
3D Inspection Device HISR - Assisting with precise inspection and verification.
- Color camera
- Other semiconductor manufacturing equipment
We have achievements such as 'sputtering equipment with GB for organic EL' and 'IBS equipment for research and development'!
- Sputtering Equipment
We have a track record of equipment such as 'plasma CVD systems for metal containers' and 'ICP-type MOCVD systems'!
- CVD Equipment
Supports tray transport! Achieves excellent substrate temperature distribution and gas flow method.
- Annealing furnace
- Heating device
Switching between RIE mode and DP mode is possible! Reduction of metal contamination through special surface treatment.
- Etching Equipment
Reduction of particles through suitable surface treatment! Compatible with high vacuum processes using a load-lock system.
- Evaporation Equipment
We have a track record of devices such as the "two-stage composite Pt deposition system"! Please contact us when you need assistance.
- Evaporation Equipment
You can freely choose from the plasma cleaning chamber, organic deposition chamber, electrode deposition chamber, sealing chamber, and more!
- Evaporation Equipment
Maximum substrate heating temperature of 1000℃! Reduces element loss specific to the substrate surface heating process!
- Heating device
- Annealing furnace
It is a versatile and compact device that enables etching, ashing, and ion cleaning!
- Etching Equipment
- Ashing device
Demo units available for loan! Ideal for spin drying silicon wafers, masks, and film substrates!
- Other clean room equipment and facilities
- Other semiconductor manufacturing equipment
Demo units available for loan! This is a cassette-type batch cleaning device that can accommodate up to Φ300.
- Other semiconductor manufacturing equipment