List of Semiconductor Manufacturing Equipment products

  • classification:Semiconductor Manufacturing Equipment

1261~1305 item / All 5250 items

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It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...

  • Sensors

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We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!

  • Other semiconductors
  • Processing Contract
  • Wafer

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100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Fully automated equipment.

  • Other semiconductor manufacturing equipment

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Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)

Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.

100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Fully automatic equipment.

  • Other semiconductor manufacturing equipment

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Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)

Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.

100% focus on BATCHSPRAY technology! Significantly reduce water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.

  • Other semiconductor manufacturing equipment

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Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)

Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.

100% focus on BATCHSPRAY technology! Significant reduction of water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry].

  • Other semiconductor manufacturing equipment

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Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)

Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.

Replace hydrogen peroxide with ozone! Significantly reduce water, exhaust, and chemicals [Wet process equipment for the semiconductor industry] Semi-automatic equipment.

  • Other semiconductor manufacturing equipment

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Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)

Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.

Remove resin residue after dry etching without using organic solvents!

  • Other semiconductor manufacturing equipment

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Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)

Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.

It falls smoothly even with a slight slope! Measures against clogging, bridging, residue, and foreign matter contamination.

  • Wafer processing/polishing equipment
  • Other surface treatment equipment
  • Surface treatment contract service

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Make effective use of the interior of the device while saving space.

  • HG-PA230_HG-PA231p01.jpg
  • Other machine elements
  • Food Packaging Machinery
  • Other semiconductor manufacturing equipment

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March 6, 2025 (Thursday) 16:00 - WEB Seminar [Safety Measures / Improving Work Efficiency] Case Studies on Solving Issues Around Doors and Covers

【Event Date and Time】 March 6, 2025 (Thursday) 16:00 - 16:45 *Participation is free. The capacity is 250 people (first come, first served). 【Highlights】 - We will introduce examples of how we solved customer challenges using our technology for lightly opening doors and lids or securely holding them in place, known as "Motion Design Tech." - Many mechanical components that contribute to safety measures and improved work efficiency will be showcased. Participants who respond to the survey after the seminar will receive a torque hinge!! *The torque hinge offered as a participation benefit is for illustration purposes. The actual product may differ in design and specifications. You can also check the details of the seminar on the registration page. We sincerely look forward to your participation.

There is a track record of adoption in semiconductor manufacturing equipment components. Contributes to weight reduction and strength improvement of products.

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  • Other semiconductor manufacturing equipment

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Vertical diffusion furnace compatible with Φ300mm.

  • Oxidation/Diffusion Device

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Processing of GaN substrates is also possible! Introduction of contact annealing lamp annealing (RTP) equipment.

  • Other semiconductor manufacturing equipment

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Usable from R&D to mass production! Vertical furnace with automatic transport compatible with 3 to 6-inch wafers.

  • Annealing furnace

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Industry high-level high-resolution or high-throughput maskless laser direct writing equipment

  • Electron beam lithography equipment
  • Other surface treatment equipment

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We flexibly respond to everything from software and hardware design to implementation and product assembly. "Yoho's adaptability" to the challenges of various manufacturers.

  • EMS
  • Other semiconductor manufacturing equipment
  • Semiconductor inspection/test equipment

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Capable of accommodating large circuit board assembly in 850×500mm size.

Supports large PCB assembly with a size of 850×500mm. [Precision] Chip size: 03015 Lead pitch: 0.3mm Adjacent pitch: 0.1mm [Supported Chips] BGA, CSP, QFN, SOP, QFP, LED, etc. [Supported Sizes] Minimum size: 50mm×50mm Maximum size: 500mm×850mm Board thickness: 0.5mm to 3.0mm

If you are troubled by contamination from waste and foreign substances after cleaning, NCC will provide solutions!

  • Other machine tools
  • Other production management systems
  • Other semiconductor manufacturing equipment

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For polishing various substrates and for fine burr removal in punched areas.

  • Other machine tools
  • Wafer processing/polishing equipment
  • Special Processing Machinery

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JIMTOFニュース登録.jpg

We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.

We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.

Optimal for multiple varieties and small lots! A new proposed device after centerless grinding of grinding stones.

  • Wafer processing/polishing equipment

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We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.

We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.

Exhibiting at JIMTOF! Demonstrating tape grinding of ball screws and worms for electric vehicles! Also unveiling a newly developed outer diameter grinding machine and new technology for clogging preve...

  • Wafer processing/polishing equipment

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You can achieve the desired surface accuracy with a simple operation to replace the polishing film!

  • Wafer processing/polishing equipment

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No need for an inversion device to clean the LCD substrate on both sides simultaneously!

  • Wafer processing/polishing equipment
  • Circuit board processing machine

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Roughness control below Ra0.1μm is possible! Achieving high efficiency and low-cost processing.

  • Other processing machines
  • Wafer processing/polishing equipment

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A composite device for tape polishing and brushing that maintains shape without distortion due to the tracking mechanism!

  • Other processing machines
  • Wafer processing/polishing equipment

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Achieve precision that is unstable by hand, and definitely improve yield! Easily portable tabletop model.

  • Other processing machines
  • Wafer processing/polishing equipment

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A Z-axis is provided, employing a mechanism that does not damage the workpiece! Polishing can be done with a soft touch.

  • Other processing machines
  • Wafer processing/polishing equipment

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It can accommodate slight differences in shaft length! A device that achieves surface roughness according to the purpose.

  • Other processing machines
  • Wafer processing/polishing equipment

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The brush mechanism allows for the removal of burrs and chips generated during cutting.

  • Other processing machines
  • Wafer processing/polishing equipment

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We propose our polishing equipment to address the concerns of automotive parts manufacturers.

  • Wafer processing/polishing equipment
  • Other abrasives

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Inner diameter grinding device renewal

We have renewed the demo model of the film-type inner diameter polishing machine. The maximum size of compatible workpieces has increased in both height and diameter! During test trials before the equipment is finalized, processing under conditions closer to actual operation has become widely possible. If you are having trouble managing roughness with inner diameter honing or similar processes, please consider the film-type inner diameter polishing machine!

Introducing a case study on equipment installation at an automotive parts manufacturer! We are showcasing solutions using ball screw grinding technology tailored to the concerns of automotive parts ma...

  • Wafer processing/polishing equipment
  • Other abrasives

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Solving the concerns of electronic device manufacturers! We propose our polishing equipment.

  • Other surface treatment equipment
  • Wafer processing/polishing equipment
  • Other abrasives

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Solving various companies' problems! Introducing it clearly with comparisons to other training programs!

  • Wafer processing/polishing equipment
  • Other abrasives
  • Other surface treatment equipment

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Automation of hand polishing, time reduction, and stabilization of quality are possible! Introducing the basic knowledge of film polishing.

  • Other machine tools
  • Wafer processing/polishing equipment

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Challenge to a new film polishing method using multi-axis robots! You can watch it in the video.

  • Other semiconductor manufacturing equipment
  • Grinding Machine

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We will exhibit at JIMTOF2024.

We will be exhibiting at the 32nd Japan International Machine Tool Fair JIMTOF2024. This time, in addition to our existing outer diameter grinding machines and robotic grinding machines, we will showcase a new internal diameter grinding machine, a new end face grinding machine, and a newly developed belt-type surface grinding machine, along with demonstrations. We will also provide explanations about the machines, discussions on film grinding, and talks aimed at specific machine development at the venue, so please come and visit us. Exhibition Location: East Hall E1039, Sanshin Corporation

Exhibition of actual machines at JIMTOF: Improving roughness and flattening of automotive parts and electrical/electronic components.

  • Wafer processing/polishing equipment
  • Flat/Shaped/Vertical Cutting Machine
  • Processing Contract

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Solving issues of labor shortages and technology transfer! An explanation of the purpose and features of Sanshin's equipment.

  • Wafer processing/polishing equipment

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A color filter full polishing device aimed at correcting protrusions and improving the flatness of the RGB surface!

  • Wafer processing/polishing equipment

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JIMTOFニュース登録.jpg

We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.

We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.

Maximizing the features of the wrapping tape makes the intended polishing easy.

  • Wafer processing/polishing equipment

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JIMTOFニュース登録.jpg

We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.

We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.

Recognize the shape of the protrusion and correct the position of the polishing center to ensure accurate protrusion correction.

  • Wafer processing/polishing equipment

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JIMTOFニュース登録.jpg

We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.

We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.

Achieves approximately 30% space-saving compared to conventional machines! Precise finishing is possible regardless of experience level! [Patent obtained]

  • Wafer processing/polishing equipment
  • Engine parts
  • lathe

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Unlike hand grinding, this grinding unit is not affected by the operator's level of experience!

  • Wafer processing/polishing equipment

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Can be processed under suitable conditions! Even beginners can operate it easily.

  • Other processing machines
  • Wafer processing/polishing equipment

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A polishing device effective for polishing various substrates and removing fine burrs from punched parts!

  • Other processing machines
  • Wafer processing/polishing equipment

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Needle valves, for automotive small parts! Introducing the burr removal and outer diameter tape wrapping device!

  • Other processing machines
  • Wafer processing/polishing equipment

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We will introduce a case study of the installation of an outer diameter polishing device at a medical device manufacturer! We solve problems such as dirt on equipment that cannot use cleaning agents!

  • Wafer processing/polishing equipment
  • Other abrasives

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We want to reduce the man-hours for grinding! We will design according to your needs, such as wanting to use a different type of polishing instead of whetstone grinding! We are currently offering a co...

  • Wafer processing/polishing equipment
  • Other abrasives

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