List of Semiconductors and ICs products
- classification：Semiconductors and ICs
1681～1695 item / All 4817 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Ideal for micro-machining! Achieves deburring of holes and double-sided machining in one pass, which was difficult with conventional tools!
- Other machine tools
We will be exhibiting at Mecatronics Tech Japan 2021 from October 20 (Wednesday) to October 23 (Saturday)!
Our company will exhibit at "Mechatrotech Japan 2021," which will be held at Portmesse Nagoya from Wednesday, October 20 to Saturday, October 23, 2021. We will introduce our tools, including the 'Bar Off Tool' capable of chamfering and deburring from a diameter of 0.8 mm, and the 'FEM' tool breakage detection device that reliably detects breakage. We look forward to your visit. (Booth number: 2B12)
Ultra-small satellite, onboard computer for CubeSat, CSP. A single-board computer equipped with a Zynq-7020 processor.
- Printed Circuit Board
- Microcomputer
We have overseas sales achievements! Our strengths are a wide variety of products and the trust of Made in Japan!
- fiber
- Other semiconductors
Standard type aluminum extruded small heat sink with a width of 12.6mm and a height of 6.5mm.
- Other semiconductors
It is possible to easily respond to security requirements for existing products!
- Dedicated IC
- Other semiconductors
A heat sink with two 24VDC fans set on an aluminum heat sink measuring W120mm x H60mm x L150mm.
- Other semiconductors
A heat dissipation device that combines an aluminum heat sink compatible with transistor clips and a DC 12V axial fan.
- Other semiconductors
Aluminum filler with high thermal conductivity and heat dissipation properties.
- Wafer
From semiconductor substrates to powder applications. A lineup of grades tailored to diverse needs!
- Other semiconductors
We will be exhibiting at the 14th Shenzhen Heat Conduction Heat Dissipation Materials Expo 2025, which will be held in Shenzhen, China from June 4 (Wednesday) to June 6 (Friday), 2025!
Our group company in China, Hunan Ningxiang Jiweixin Metal Powder Co., Ltd., will be exhibiting at the 14th Shenzhen Heat Conduction Heat Dissipation Materials Expo 2025, which will be held from June 4 (Wednesday) to June 6 (Friday), 2025. This exhibition will be a comprehensive showcase of heat conduction and heat dissipation materials and equipment. At our booth, we plan to introduce a wide variety of aluminum powders, including high-purity aluminum powder, aluminum alloy powder, and aluminum nitride. We sincerely look forward to your visit.
It is predicted to grow at an average annual growth rate of 5.7% from 2025 to 2031.
- others
- Other semiconductors
Manufacturing and testing technology for small packages on cutting-edge rationalization lines! Quick and meticulous response.
- Wafer
- Dedicated IC
- Other semiconductors
Realizing non-contact thickness measurement of various materials that transmit white light.
- Other measurement, recording and measuring instruments
- Sensors
- Wafer
Notice of Participation in SEMICON JAPAN 2024
Our company will exhibit at "SEMICON JAPAN 2024," which will be held at Tokyo Big Sight starting December 11, 2024 (Booth number: 2705). At this exhibition, we will introduce semiconductor industry-specific applications and non-contact measuring instruments that contribute to the reliability of the ever-evolving semiconductor manufacturing process and the improvement of semiconductor performance. We cordially invite you to visit our booth and take a look at our offerings. Exhibited products: - Non-contact thickness measurement gauge (interferometry technology) - Contact/non-contact (confocal technology) hybrid applications - Optical 3D surface roughness and shape measuring instruments - High-end 3D surface measurement for probe card inspection - Visual blade inspection system for dicing processes