List of Semiconductors and ICs products
- classification：Semiconductors and ICs
3541～3570 item / All 4493 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
Establishing innovative grinding technology! Achieving ultimate surface roughness and TTV in a short time and at low cost.
- Wafer processing/polishing equipment
- Wafer
We have uploaded TDC YouTube Exhibition part 7!
Title: "Introduction of TDC Original Products" This time, we would like to introduce the TDC original product, the mirror paperweight. At first glance, it seems like an ordinary mirror, but we, the employees, call it "the mirror that reflects inconvenient truths." Since there is absolutely no distortion, it clearly shows unwanted pores and blemishes compared to commercially available mirrors. Additionally, this mirror can also be used as a paperweight. As a lucky paperweight, we create each one with the sentiment of "no problem, it's okay, let's overcome it." If you are interested, please feel free to contact us. You can view it through the related links below.
We handle a variety of products, starting with electronics-related items.
- paint
- Other semiconductors
- plastic
Supports low-power LED matrix composed of 48 or 12 individual LEDs.
- Chip type LED
- Other semiconductors
Processing of ultra-thin, high flatness products made from Mo (molybdenum) and its alloys.
- Chip type LED
- Wafer
- diode
Processing of ultra-thin, high flatness products made from Mo (molybdenum) and its alloys.
- Chip type LED
- Wafer
- diode
Ultra-thin high-precision processing of W tungsten and its alloys.
- Chip type LED
- Wafer
- diode
Introduction to the AM571x Industrial Development Kit (IDK)
- Other semiconductors
Cutting-edge manufacturing" is once again entering the era of "within Japan.
- Board to Board Connectors
- Other semiconductors
Introduction to the AM572x Industrial Development Kit (IDK)
- Other semiconductors
Introduction to the AM437x Industrial Development Kit (IDK)
- Other semiconductors
Sercos III Slave, Reference Design 'TIDEP0039' for AM437x Communication Development Platform
- Other semiconductors
Ethernet/IP Communication Development Platform 'TIDEP0003'
- Other semiconductors
PROFIBUS Communication Development Platform 'TIDEP0002'
- Other semiconductors
EtherCAT slave and multi-protocol industrial Ethernet reference design 'TIDA-00299'
- Other semiconductors
Development platform for industrial communication and industrial Ethernet, 'AMIC110 Industrial Communication Engine (ICE)'
- Other semiconductors
Motor control microcontroller development kit 'InstaSPIN^TM-FOC compatible C2000 Piccolo LaunchPad'
- Other semiconductors
MSP430FR5994 LaunchPad: A microcontroller development kit with ultra-low power consumption, high durability, and fast write access.
- Other semiconductors
Development kit for obtaining Wi-Fi certification at the chip level: 'SimpleLink Wi-Fi CC3200 LaunchPad'
- Other semiconductors
Development kit "CC1310 LaunchPad" compatible with Sub-1GHz wireless.
- Other semiconductors
Low-cost development kit for 32-bit high-performance microcontroller 'MSP432P401R LaunchPad'
- Other semiconductors
USB 2.0 High-Speed (HS) Signal Conditioner "TUSB213"
- Other semiconductors
- Other power sources
USB Type-C, 8.1 Gbps Multi-Protocol Linear Redriver "TUSB544"
- Other semiconductors
- Other power sources
Ultra-small single-channel nanoPower low-voltage comparator 'TLV7041'
- Other semiconductors
- Other power sources
Ultra-small single-channel nanoPower low-voltage comparator 'TLV7031'
- Other semiconductors
- Other cable related products
1-channel, rail-to-rail input micro-power low voltage comparator 'TLV7021'
- Other semiconductors
- Other power sources
Custom-made vertical gas jet non-contact transport device "Float Chuck SAC Type"
- Other semiconductors
- CVD Equipment
- LCD display
Bernoulli chuck for non-contact transfer of high-temperature workpieces.
- Evaporation Equipment
- Wafer
- Other industrial robots
We have assembled equipment that is strong in the analysis of organic materials such as resin and carbon composites.
- diode
- Contract measurement
- Composite Materials
Announcement of the Start of Non-Destructive Testing Services from April 2018
On April 2, 2018, MST will introduce the latest processing and analysis equipment and begin offering non-destructive analysis services. We will provide analysis services across a wide range of fields, including product development and quality control in electronic devices, pharmaceuticals, and food. Non-destructive analysis is a technology that visualizes the internal condition of a product without destroying it. With the introduction of the latest processing and analysis equipment, MST will now be able to conduct non-destructive analysis. We will offer analysis services on a contract basis.
We contribute to society by providing safe products that are kind to people and the Earth!
- Other semiconductors
- Contract manufacturing
- Processing Contract