List of Other contract services products
- classification：Other contract services
1606～1620 item / All 8555 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Ideal for micro-machining! Achieves deburring of holes and double-sided machining in one pass, which was difficult with conventional tools!
- Other machine tools
We will be exhibiting at Mecatronics Tech Japan 2021 from October 20 (Wednesday) to October 23 (Saturday)!
Our company will exhibit at "Mechatrotech Japan 2021," which will be held at Portmesse Nagoya from Wednesday, October 20 to Saturday, October 23, 2021. We will introduce our tools, including the 'Bar Off Tool' capable of chamfering and deburring from a diameter of 0.8 mm, and the 'FEM' tool breakage detection device that reliably detects breakage. We look forward to your visit. (Booth number: 2B12)
Significantly reduce inventory management time with RFID! Here are examples of efficient inventory management made possible.
- Other contract services
You can visualize and analyze data even without specialized knowledge! It is possible to turn data into valuable information.
- Other information systems
- Other contract services
Improving the speed of improvement by utilizing ICT tools! A case study of establishing the improved system within the system.
- Other contract services
![[Seminar] Basics and Applications o...](https://image.mono.ipros.com/public/product/image/5e3/2001535951/IPROS17519159923553477961.jpeg?w=280&h=280){kind=small}
Essential for FPGA/SoC designers! The essence of analog technology that influences system stability.
- Technical Seminar
- Other contract services
![[Seminar] Waterproof Design [Advanc...](https://image.mono.ipros.com/public/product/image/c80/2001534982/IPROS10726696504740909625.jpeg?w=280&h=280){kind=small}
For designers at a standstill. Overcome that wall with "gel waterproofing" and "design value guidance." Learn the secrets of waterproof design in 3 hours [Advanced Edition].
- Technical Seminar
- Other contract services
![[Seminar] Thermal Management and He...](https://image.mono.ipros.com/public/product/image/a54/2001535950/IPROS4824529177060812552.jpeg?w=280&h=280){kind=small}
Transform "thermal issues" into "design quality." Master thermal management for electronic devices from the basics to practical applications in one day!
- Technical Seminar
- Other contract services
TEM (Transmission Electron Microscope) meets a wide range of requirements for observing failure sites of electronic components, length measurements, elemental analysis, crystal structure analysis, and...
- Contract Analysis
- Other semiconductors
- Other contract services
Announcement of the introduction of Talos F200E
Our company will introduce the FEI "Talos F200E" transmission electron microscope system. Compared to conventional models, the resolution for TEM and STEM has improved, and performance has been significantly enhanced, allowing for EDS analysis with four detectors. Additionally, it is equipped with features such as drift-corrected frame integration (DCFI), which accumulates multiple frames while correcting for drift.
We provide latch-up testing services to evaluate the resistance of CMOS ICs and semiconductor products containing them to latch-up destruction.
- Contract Inspection
- Other contract services
- Other inspection equipment and devices
We are equipped with a variety of devices to meet your needs, including dimension measurement of various parts and surface roughness measurement!
- Visual Inspection Equipment
- Other measurement, recording and measuring instruments
- Other contract services
Observation of thermal deformation using a 3D shape measuring machine (VR-6200)
This is a measuring device that can non-contact measure surface shapes such as concavities, undulations, and surface roughness. We will introduce "heating deformation observation" using a 3D shape measuring machine. First, we acquire a 3D texture image at room temperature, and then we acquire a 3D texture image in the heated state. By overlaying the texture images before and after heating and checking the differential texture image and cross-sectional profile, it can be seen that the substrate in the heated state has higher ends and a lower center compared to the room temperature state.
Support for the difficulties in the development and evaluation of components, devices, and materials related to semiconductor products.
- Other contract services
Strain measurement of power module package resin.
We would like to present the results of strain measurements conducted by attaching strain gauges and thermometers to the surfaces of power modules, both in the mounted state on a circuit board and in the unmounted state. In the mounted module, a slight delay in temperature change was observed, and correspondingly, the change in strain also appeared to be delayed. This is believed to be due to the slower transfer of heat to the module when it is mounted. At Aites, we conduct temperature cycle tests and temperature-humidity cycle tests, during which we can simultaneously measure the strain occurring in the mounted components. Please feel free to consult with us.
By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.
- Contract Analysis
- Other contract services
- Contract measurement
Confirmation of chiplet package structure by mechanical polishing.
Regarding the chip mounted on the main circuit board of the VR goggles manufactured by Company A, upon visual observation, it was inferred that it has a chiplet structure with multiple chips integrated. To examine the structure in more detail, we created a cross-section using X-ray CT observation and mechanical polishing, and we will introduce the structural confirmation results. *For more details, please download the PDF or feel free to contact us.*
It is possible to observe cross-sections while observing FIB processing in real time.
- Contract Analysis
- Other contract services
- Electron microscope
Power device failure location / Slice & View three-dimensional reconstruction
I will introduce the three-dimensional reconstruction of failure locations using the Slice & View function of FIB-SEM. Continuous SEM images of the structure are obtained, and the resulting images are corrected for positional misalignment between the SEM images and visualized in three dimensions using 3D construction software (Avizo). By combining the position identification technique for cross-sectioning the failure location with the Slice & View function, it is possible to obtain continuous SEM images that retain the defective state and include information before and after the abnormal area.
If it is 5 micrometers or larger, foreign object IR data can be obtained.
- Contract Analysis
- Analytical Equipment and Devices
- Other contract services
Micro FT-IR imaging measurement
We would like to introduce the "Microscopic FT-IR Imaging Measurement" that we conduct. It allows for the visualization of the distribution of substances as a two-dimensional image within a specified plane. It becomes possible to evaluate changes in the distribution of substances that are difficult to assess with regular point measurements through visual images.
We will report rapid analysis results using various sampling techniques regarding foreign substances that significantly impact the yield of electronics products.
- Contract Analysis
- Analytical Equipment and Devices
- Other contract services
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.