List of Technical and Reference Books products
- classification:Technical and Reference Books
241~255 item / All 1722 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
Enhancing rust prevention for automobiles! Here is an explanation of the basics of electrocoating.
- Coating Agent
- Technical and Reference Books
Basic knowledge of electrodeposition coating that contributes to the longevity of infrastructure facilities.
- Coating Agent
- Technical and Reference Books
Basic knowledge of electrophoretic painting that helps ensure the insulation of OA machines.
- Coating Agent
- Technical and Reference Books
Basic knowledge of electrodeposition coating to enhance the durability and aesthetics of stationery.
- Coating Agent
- Technical and Reference Books
[Available for preview] ~ Chiplets, responding to 2.5D/3D high-density packaging ~
- Technical and Reference Books
[Book] Reducing CTE in Semiconductor Packaging and Warpage Countermeasures (No. 2367) [Available for preview]
~Chiplets, Responding to 2.5D/3D High-Density Packaging~ ◎ What are the key points for integrating materials with different thermal expansion coefficients and elastic moduli? ◎ A comprehensive overview of thermal stress countermeasures required in high thermal density environments and composite packages. ---------------------------- ■ Table of Contents Chapter 1: Development Trends of Element Technologies for Miniaturization and Integration of Semiconductor Packages Chapter 2: Development Trends of Filler Materials Enabling Improved Thermal Conductivity and Low Thermal Expansion Chapter 3: Development Trends of Negative Thermal Expansion Materials Chapter 4: Surface Treatment, Dispersion, and Filling Techniques for Fillers Chapter 5: Development Trends of Low Thermal Expansion Substrate Materials and Glass Substrates Chapter 6: Development of Semiconductor Encapsulation Materials and Stress Reduction Chapter 7: Development of Bonding Materials Chapter 8: Development Trends of Low CTE Resin Materials Chapter 9: Evaluation and Simulation Techniques in Semiconductor Packaging Materials ---------------------------- ● Publication Date: July 31, 2026 ● Format: A4, 395 pages ● Authors: 33 ● ISBN: 978-4-86798-163-4 ----------------------------
[Available for preview] - High-speed exploration of new material candidates, prediction of compositions and structures that meet desired properties, optimization of formulation conditions.
- Technical and Reference Books
[Book] Development of Polymer Materials through Materials Informatics (No. 2365) [Available for preview]
- High-speed exploration of new material candidates, prediction of compositions and structures that meet desired properties, optimization of formulation conditions - ★ Explaining the key points for organizing all internal and external data such as molecular structures, images, spectra, and literature/patent information into a usable form for MI! ---------------------------- ■ Table of Contents Chapter 1: Materials Development, Structural Design, and Applications through Materials Informatics Chapter 2: Molecular Design and Reaction Analysis for Materials Development, Descriptorization of Compounds Chapter 3: Optimization of Formulation Conditions, Prediction of Composition Ratios, and Extraction of Reaction Factors Using Machine Learning and Simulation Chapter 4: Collection, Analysis, and Processing of Experimental and Measurement Data for Materials Development and Process Design Chapter 5: Introduction and Operation of Autonomous Experiments and Automation Technologies in Materials Development ---------------------------- ● Publication Date: July 31, 2026 ● Format: A4 size, 425 pages ● Authors: 41 ● ISBN: 978-4-86798-162-7 ----------------------------
【Available for preview】◎ A complete manual for the removal of biofilm to break through "slime" and "resistance" for the field!
- Technical and Reference Books
【Book】Development of Biofilm Removal, Prevention, and Formation Inhibitors (No.2363) 【Available for preview】
◎ A Complete Manual for the Removal of Biofilms to Overcome "Slime" and "Resistance" for the Field! --------------------- ■ Table of Contents Chapter 1: Mechanisms of Biofilm Formation Chapter 2: Various Evaluation Methods for Biofilms Chapter 3: Evaluation Methods for the Development of Anti-Biofilm Products Chapter 4: Types and Characteristics of Anti-Biofilm Agents Chapter 5: Development of Anti-Biofilm Agents from the Perspective of Bacterial Adhesion Prevention Chapter 6: Mechanisms of Biofilm Formation Inhibition and Development of Anti-Biofilm Agents Chapter 7: Control, Removal, and Prevention Measures for Oral and Infection-Derived Biofilms Chapter 8: Specific Control, Removal, and Prevention Measures for Biofilms Occurring in Living Environments Chapter 9: Specific Control, Removal, and Prevention Measures for Biofilms Occurring in Food Chapter 10: Specific Control, Removal, and Prevention Measures for Biofilms Occurring in Factories, Machinery, and Piping --------------------- ● Publication Date: July 31, 2026 ● Format: A4, 384 pages ● Authors: 65 ● ISBN: 978-4-86798-161-0 ---------------------
Technical Specialized Books - Polymers, Composite Materials, Emulsions, Suspensions, Gels, Cosmetics, Food -
- others
- Technical and Reference Books
- Technical and Reference Books
[Book] Dynamic Viscoelasticity Measurement and Its Data Interpretation Cases (No. 2135BOD)
■Table of Contents Chapter 1: Measurement Methods and Simulation of Dynamic Viscoelasticity Chapter 2: Measurement of Dynamic Viscoelasticity of Polymers and Composite Materials and Case Studies of Data Interpretation Chapter 3: Setting Conditions and Evaluation of Molding and Processing Processes Utilizing Dynamic Viscoelasticity Measurement Data Chapter 4: Measurement of Dynamic Viscoelasticity of Gels and Case Studies of Data Interpretation Chapter 5: Measurement of Dynamic Viscoelasticity of Pastes, Coatings, and Adhesives and Case Studies of Data Interpretation Chapter 6: Measurement of Dynamic Viscoelasticity of Cosmetics and Case Studies of Data Interpretation Chapter 7: Measurement of Dynamic Viscoelasticity of Foods and Case Studies of Data Interpretation -------------------------- ●Publication Date: December 24, 2021 ●Authors: 57 ●Format: A4 size, 589 pages Hardcover Edition: Price: 88,000 yen (tax included) ISBN: 978-4-86104-866-1 ↓↓ The hardcover edition is out of print ↓↓ On-Demand Edition Available Price: 44,000 yen (tax included) ISBN: 978-4-86798-047-7 After receiving your order, we will perform simple printing and binding --------------------------
The hegemony strategy of "materials, interfaces, and thermal control" that takes away profits from AI semiconductors!
- Technical and Reference Books
- Other semiconductors
- others
A major reorganization of the chemical industry begins in the era of AI, semiconductors, and EVs! It is viewed not just as an issue for the chemical industry, but as a societal infrastructure problem!
- Technical and Reference Books
- others
A must-have book for researchers and engineers struggling with motor vibration and noise, providing solutions through 553 Q&A items!
- Technical and Reference Books
From the current state of international regulations and rules to the latest trends in debris removal technology.
- Technical and Reference Books
Seize the light of the next generation! A detailed explanation of the latest research trends in advanced solar cell technology and the challenges toward social implementation!
- Technical and Reference Books
Measurement of heat, development of heat dissipation materials, and explanation of thermal design and cooling technology!
- Technical and Reference Books
From breeding and process DX to precision fermentation and upcycling.
- Technical and Reference Books