List of Sputtering Equipment products

  • classification:Sputtering Equipment

46~60 item / All 217 items

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

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  • Other conveying machines

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Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!

  • Cooling system

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April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024

Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.

The after-sales service has also received positive feedback! By conducting regular maintenance, we achieve a longer lifespan for the equipment.

  • Sputtering Equipment

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From design to after-service of the equipment! We can offer various equipment proposals.

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  • Sputtering Equipment

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Support for the entire lifecycle from device design to after-sales service!

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  • Sputtering Equipment
  • Plasma surface treatment equipment

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Under the management philosophy of 'pursuing customer satisfaction and technical expertise to the utmost and contributing to society,' we develop our business.

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  • Vacuum Equipment
  • Evaporation Equipment
  • Sputtering Equipment

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From site surveys to design and construction, experienced engineers will handle it!

  • Other electronic parts
  • Sputtering Equipment

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A film deposition platform for semiconductor wafers and advanced packaging capable of various film deposition treatments.

  • Sputtering Equipment
  • Etching Equipment
  • CVD Equipment

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Providing mass production solutions for high-speed and flexible substrate film deposition applications!

  • Sputtering Equipment
  • Etching Equipment

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Meeting the high cleanliness standards required in the semiconductor and medical device fields. We carry out everything from precision cleaning to packaging and assembly in a consistent clean environm...

  • CVD Equipment
  • Sputtering Equipment
  • Resist Device

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Flexibility, compact design, and low investment costs! An ideal choice for small-scale production.

  • Sputtering Equipment
  • Etching Equipment

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Extremely low Rc system design in the industry and the highest level of inter-wafer reproducibility!

  • Sputtering Equipment
  • Etching Equipment

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Higher productivity for PLP! More process possibilities. Optimized for advanced packaging.

  • Sputtering Equipment
  • Etching Equipment

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Evatec officially enters the next-generation packaging market in Japan with CLUSTERLINE 600 - Expanding business development towards the era of Panel-Level Packaging for AI and HPC.

Evatec AG (headquartered in Switzerland) is intensifying the deployment of its large panel-compatible coating platform "CLUSTERLINE 600" in the Japanese market and will fully enter the rapidly growing next-generation packaging market for AI (artificial intelligence) and high-performance computing (HPC). In the global semiconductor ecosystem, the transition to new manufacturing architectures such as large interposers, ultra-high-density RDL (Redistribution Layer), glass core substrates, and panel-level packaging is accelerating. In particular, with the increasing size of AI packages, the shift from traditional 300mm wafer-based manufacturing to 600mm class panel processes is gaining attention as a next-generation manufacturing technology. Evatec positions this change as one of the most important growth opportunities in the semiconductor industry over the next decade. By making the CLUSTERLINE 600 its core product, the company aims to expand its advanced packaging business in the Japanese market and support customers' technology development and mass production in areas such as panel-level packaging, advanced IC substrates, and glass core substrates.

We have achievements such as 'sputtering equipment with GB for organic EL' and 'IBS equipment for research and development'!

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  • Sputtering Equipment

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Achieving a substrate temperature of 900℃! Equipped with a 3-axis mechanism on the substrate stage to realize a uniform film thickness distribution.

  • Sputtering Equipment

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For semiconductors, MEMS, electronic components, etc.! High-speed and stable continuous film deposition is possible from single crystal epitaxial buffer layers to piezoelectric films!

  • Sputtering Equipment

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For semiconductors, MEMS, electronic components, etc.! High-speed and stable continuous film deposition is possible from single crystal epitaxial buffer layers to piezoelectric films!

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  • Sputtering Equipment

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