List of Sputtering Equipment products
- classification：Sputtering Equipment
61～75 item / All 215 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
Would you like to introduce the PACE series for pressure calibration testing on the manufacturing line? It is also possible to reduce production costs!
- Etching Equipment
- Sputtering Equipment
- Pressure
Electrode formation processes and mounting processes for various devices such as LEDs, LDs, and FETs are possible.
- LED Module
- Sputtering Equipment
- Wafer processing/polishing equipment
![Production achievements [2] / Semic...](https://image.mono.ipros.com/public/product/image/ee9/2000412310/IPROS09238320213951143733.jpeg?w=280&h=280){kind=small}
Shortest half-day estimate / From metal parts to resin products, we introduce components related to semiconductor manufacturing equipment based on our track record!
- Sputtering Equipment
[Design/Customization] Winding Machine
We only accepted customization and modification design of the equipment. Customer / Precision Machinery Parts Manufacturer End User / Electronic Equipment Manufacturer Request Details / Modification design using existing equipment Main Specifications Transporting small lithium-ion battery components / Cutting from transport fixtures Reel taping / Laser marking / Reel winding Equipment Dimensions / W3,500mm × D1,200mm × H1,000mm This time, we only undertook the mechanical and equipment design. We were responsible for the mechanical design of the work transport fixture supply section, the work cutting / extraction / feeding section, and the reel winding section. The customer handled parts procurement, assembly, and other aspects outside of mechanical design. We also accept design-only projects. We can flexibly respond to customer requests, whether for custom equipment or, as in this case, using existing equipment. Our greatest strength is our ability to provide a one-stop service for the entire process from design to installation in equipment and fixture manufacturing. Please feel free to share any concerns related to equipment and fixtures, such as transport, robotics, and production facilities.
Shortest half-day estimate / We have accepted the production of equipment parts made of aluminum material.
- Sputtering Equipment
We will be exhibiting at the International Frontier Industry Messe 2021.
We are pleased to announce that we will be exhibiting at the "International Frontier Industry Messe 2021" on September 2nd (Thursday) and 3rd (Friday). 【Exhibition Booth Location】 D-63 (Hall 2) "International Frontier Industry Messe 2021" ________________ 〈Dates〉 September 2nd (Thursday) and 3rd (Friday) 〈Location〉 Kobe International Exhibition Hall 1 and 2 This is one of the largest comprehensive industrial exhibitions in Western Japan, focusing on the introduction of advanced technologies and product displays that serve as a foundation for new business creation, as well as facilitating technical exchanges and business matching. ______________________________________________________ At this exhibition, the organizers will implement measures to prevent the spread of COVID-19. Additionally, our staff will conduct health management through temperature checks, wear masks at all times, ensure thorough hand sanitization, and maintain social distancing during customer interactions as part of our infection prevention measures. Admission is free. We sincerely look forward to your visit. We will continue to strive to meet your expectations, and we kindly ask for your continued support. Thank you very much.
This processing requires a significant amount of positioning. We maintain a guarantee of ±0.05.
- Sputtering Equipment
A new PVD device proposed by a company that knows Endura inside and out.
- Sputtering Equipment
Equipped with three sources of cathodes in a compact tabletop size. It is also possible to produce insulating thin films, oxide, and nitride thin films.
- Sputtering Equipment
Information on major suppliers! Sputtering target market and supply chain.
- Sputtering Equipment
Introduction of various experimental devices for research and development in semiconductors, electronic devices, fuel cells, displays, and thin film experiments.
- Sputtering Equipment
- Evaporation Equipment
- Annealing furnace
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
Composite thin film experimental device nanoPVD-ST15A capable of mixed installation of vacuum deposition (metal and organic deposition sources) and sputtering cathodes.
- Sputtering Equipment
- Evaporation Equipment
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
![[Hot Stage] Ultra High Temperature ...](https://image.mono.ipros.com/public/product/image/671/2000002653/IPROS21404174246949592221.png?w=280&h=280){kind=small}
An ultra-high temperature substrate heating stage that allows for substrate elevation, rotation, and RF/DC substrate bias all in one device! 'All-In-One' component.
- Sputtering Equipment
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
High-efficiency magnetron sputtering cathode compatible with RF, DC, and pulse DC for depositing metals and insulators without impurities. It also excels in maintainability.
- Sputtering Equipment
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
Sputter Cathode and Co-evaporation Source Mixed Thin Film Experimental Device: Metal deposition, organic deposition, and sputter cathode installed in a compact frame.
- Sputtering Equipment
- Evaporation Equipment
- Annealing furnace
【MiniLab】 Evaporation/Sputtering Dual Chamber System
Two thin film experimental devices are connected by a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected via the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB evaporation: 7cc crucible x 6 - Resistance heating evaporation x 2 - Organic evaporation limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron cathode x 4 for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma etching stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique "soft etching" technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)
Suitable for the film formation of nanomaterials (metal nanoparticles, nanowires, nanosheets, materials for nanoelectronics)!
- Sputtering Equipment
High-end sputtering process for optical films used in aerospace engineering and medical/bio applications is possible!
- Sputtering Equipment