List of Semiconductor inspection/test equipment products

  • classification:Semiconductor inspection/test equipment

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

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  • Other conveying machines

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Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!

  • Cooling system

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April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024

Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.

It is a device that measures the thickness of silicon wafers and sorts them according to their thickness.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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This is a device used to measure the thickness of metal or resin carriers used in the silicon wafer lapping process and double-sided polishing process.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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This is a device used to measure the thickness of metal or resin carriers used in the silicon wafer lapping process and the double-sided polishing process.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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This is a device used to measure the thickness of metal or resin carriers used in the silicon wafer lapping process and the double-sided polishing process.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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Thickness measurement of compound semiconductor wafers in sizes φ2”, φ4” or φ6”.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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Thickness measurement of various types of wafers below φ4"

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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Thickness measurement of Si, SiC, and other wafers with a diameter of φ100mm to φ150mm.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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Thickness measurement device for silicon wafers with a diameter of φ200mm and φ300mm.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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This is a device that removes silicon wafers from a dedicated cassette and measures the thickness at the set points.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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This is a device for measuring the thickness of SiC wafers adhered to a glass plate and the thickness of the adhesive, as well as measuring the thickness of individual SiC wafers.

  • Other semiconductor manufacturing equipment
  • Semiconductor inspection/test equipment

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The very popular TME series

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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Large-diameter silicon wafer measuring instrument

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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This is a device that extracts silicon wafers from a dedicated cassette using edge handling and measures the thickness of a set pattern.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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Measurement of Si wafer thickness, front and back surface P/N determination.

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment

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We provide advanced specialized technology as an integrated R&D foundry.

  • Semiconductor inspection/test equipment
  • Analytical Equipment and Devices
  • Other contract services

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