List of Bonding Equipment products

It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...

• Sensors

We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!

• Other semiconductors
• Processing Contract
• Wafer

The flip chip bonder is ideal for small-scale production and development, perfect for high-precision assembly required for optical devices and more.

• Bonding Equipment

Ultra-high precision bonders that achieve both submicron accuracy and mass production capability.

• Bonding Equipment

Exhibiting at Internepcon! Introducing new products that accommodate large-scale products. <Sample testing now available>

• Bonding Equipment
• Reflow Equipment
• Soldering Equipment

The standard vacuum reflow device with the number one domestic track record! <Sample tests now accepting applications>

• Bonding Equipment
• Reflow Equipment
• Soldering Equipment

Tabletop Wire Bonder HB16

• Bonding Equipment

Solving issues such as storage and supply stability, wettability, and heat resistance! Next-generation environmental compatibility!

• Reflow Equipment
• Evaporation Equipment
• Bonding Equipment

The AD830Plus is an ultra-fast epoxy die bonder with a cycle time of 0.16 seconds per chip.

• Bonding Equipment

Responding to the challenges of assembly!

• Bonding Equipment
• Other services

Easy operation! Results such as wire trajectories are displayed visually!

• Bonding Equipment

Tabletop manual wire bonder Model 626. It can be used for prototyping and development.

• Bonding Equipment

You can perform the entire series of operations from applying adhesive, bonding, to UV spot curing with a single piece of equipment!

• dispenser
• Bonding Equipment

A device that performs a series of processes from slit coating to vacuum lamination.

• Other assembly machines
• Bonding Equipment

Supports high-precision stacked packages such as NAND flash.

• Bonding Equipment

Ideal for bonding small pin ICs such as QFN.

• Bonding Equipment

Ideal for bonding small pin ICs such as QFN.

• Other semiconductors
• Bonding Equipment

It is a high-quality, high thermal capacity device-compatible die bonder for Dpak, To220 to To3p, and IGBT.

• Bonding Equipment

Over 9,000 units delivered worldwide! Bonding is possible with just a click of the mouse. Compact and effective for research and development as well as small-scale production.

• Other processing machines
• Bonding Equipment

A device that applies dam material and fill material by dispensing and bonds them together in the atmosphere.

• dispenser
• Bonding Equipment

It is a mass production device for optical bonding using OCR.

• Bonding Equipment

It is a mass production device for optical bonding using OCR.

• Bonding Equipment

Precision parts processing / stainless steel processing / SUS processed products

• CMP Equipment
• Photomask
• Bonding Equipment

We accept mass production operations tailored to customer requests and specifications, such as high-quality products!

• Other contract services
• Bonding Equipment
• Soldering Equipment

Leveraging the unique technology and expertise of a semiconductor device manufacturer, we achieve high quality and productivity!

• Other contract services
• Bonding Equipment
• Soldering Equipment

For fine lines and thick lines! Easy operability based on ergonomic mobile user panels.

• Bonding Equipment

Digital display on the screen! Measuring the amplitude of tools used with the wire bonder.

• Bonding Equipment

The M17 series is capable of providing flexible and highly reliable solutions for various bonding challenges.

• Bonding Equipment

Flexible bonding function! With Y and Z motor drive, it offers easy operability.

• Bonding Equipment

Versatile bonder with a variety of options! It is a universal bonder capable of performing wire bonding and pull/share tests.

• Bonding Equipment

From research and development to production! We demonstrate high quality and high versatility.

• Bonding Equipment

Since its establishment, MPP has over 40 years of experience and know-how, supplying products to more than 400 companies in 20 countries.

• Bonding Equipment
• Other semiconductor manufacturing equipment

MKE is headquartered in South Korea and boasts the second largest shipment volume of bonding wires, solder balls, and adhesives in the world.

• Bonding Equipment
• Other consumables
• Other semiconductors

A highly expandable ACF mounting device that combines alignment and thermal compression in one machine.

• Bonding Equipment
• Mounter
• Other assembly machines

A pulse heat bonding device that achieves a flexible temperature profile with pulse heat! Equipped with a highly durable ceramic heater!

• Bonding Equipment

We offer a diverse lineup including bonding press machines and laminating machines!

• Other processing machines
• Printing Machinery
• Bonding Equipment

Half mirror viewing system! Bonding suitable for the purpose is only the replacement of the head.

• Bonding Equipment

Introducing a rubber connecting machine that allows for easy switching from overlapping sewing to butt sewing.

• Other processing machines
• Bonding Equipment

A room temperature, mechanical wafer peeling device capable of handling wafer sizes from 3” to 300mm.

• Wafer processing/polishing equipment
• Bonding Equipment

This is a bonding tool made using single crystal diamond. It has excellent thermal conductivity and wear resistance at high temperatures.

• Other semiconductors
• Bonding Equipment
• PCB terminal blocks

Achieving stable dispensing of two-component adhesive!

• Other processing machines
• glue
• Bonding Equipment