List of Bonding Equipment products
- classification：Bonding Equipment
91～135 item / All 142 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
A belt grinding machine that has been in use for about 50 years since 1973. In addition to trust and proven results, the lineup is also extensive.
- Other machine tools
Belt grinding machine "Veda Machine" has high durability and a wide range of service parts.
The "Bader Machine" is our belt grinder that boasts excellent polishing performance for each individual unit. By selecting models and types according to the shape and size of the workpiece, and by equipping it with a polishing belt suitable for the task, it can flexibly accommodate a wide variety of items across various fields. Please make extensive use of it for high-efficiency polishing and grinding, reduction of work time, labor-saving, and standardization of tasks. 【Lineup】 ■ Portable type BP-K (air motor type) ■ Made-to-order machine PC-1 (wheel centerless), BC (standard dust cover) ■ Installed type BM (basic type), SBA-1, BH-2 ■ Wheel type SBD-4S, SBD-7, BWd *For more details, please download the PDF or contact us.
From research and development to production! We demonstrate high quality and high versatility.
- Bonding Equipment
Since its establishment, MPP has over 40 years of experience and know-how, supplying products to more than 400 companies in 20 countries.
- Bonding Equipment
- Other semiconductor manufacturing equipment
MKE is headquartered in South Korea and boasts the second largest shipment volume of bonding wires, solder balls, and adhesives in the world.
- Bonding Equipment
- Other consumables
- Other semiconductors
A highly expandable ACF mounting device that combines alignment and thermal compression in one machine.
- Bonding Equipment
- Mounter
- Other assembly machines
A pulse heat bonding device that achieves a flexible temperature profile with pulse heat! Equipped with a highly durable ceramic heater!
- Bonding Equipment
We offer a diverse lineup including bonding press machines and laminating machines!
- Other processing machines
- Printing Machinery
- Bonding Equipment
Half mirror viewing system! Bonding suitable for the purpose is only the replacement of the head.
- Bonding Equipment
Introducing a rubber connecting machine that allows for easy switching from overlapping sewing to butt sewing.
- Other processing machines
- Bonding Equipment
A room temperature, mechanical wafer peeling device capable of handling wafer sizes from 3” to 300mm.
- Wafer processing/polishing equipment
- Bonding Equipment
[Finished] We will be exhibiting at ICEP-IAAC 2018 (April 17-21, Hotel Hanamizuki, Kuwana, Mie).
We will be exhibiting at ICEP-IAAC 2018 (April 17 (Tuesday) to 21 (Saturday); Kuwana City, Mie Prefecture). We look forward to your visit.
This is a bonding tool made using single crystal diamond. It has excellent thermal conductivity and wear resistance at high temperatures.
- Other semiconductors
- Bonding Equipment
- PCB terminal blocks
Achieving stable dispensing of two-component adhesive!
- Other processing machines
- glue
- Bonding Equipment
Domestic ultra-compact pen-type atmospheric plasma device suitable for fine processing and laboratory applications! It can be easily used at an affordable price.
- Other semiconductor manufacturing equipment
- Bonding Equipment
- Circuit board processing machine
NEW! "Rotating Plasma Device"! Exhibiting at the International Frontier Industry Messe 2012 in Kobe from September 6 to 7. ■ Demo units available at the exhibition booth. Popular for surface modification and cleaning applications.
New Product! Rotating Plasma Device Debuts at Trade Show! 【Trade Show Name】International Frontier Industry Messe 2012 【Dates】 September 6 (Thursday) - 7 (Friday), 2012 10:00 - 17:00 【Venue】Kobe International Exhibition Hall, Building 2 (Kobe Port Island) 【Expected Exhibition Scale】 200 booths (including concurrently held events) * FY 2011 results: 239 companies, 271 booths 【Expected Number of Visitors】 15,000 people * FY 2011 results: 17,253 people 【Booth】 Booth Number B-07 Displayed at the booth of 'Kyoto Environmental Nanocluster (Kyoto Institute of Advanced Technology)' 【Presentation】 September 7 (Friday) Presentation Corner A 11:00-11:20 【Exhibition Content】 ☆ Live Demonstration Tabletop Vacuum Plasma Device YHS-R Rotating Vacuum Plasma Device YHS-DOS ■ Sakigake Semiconductor Special Exhibition Page http://www.sakigake-semicon.co.jp/international-industrial-fair2012_plasma.html
[No Solvent Required] Handy-type atmospheric pressure plasma device, low temperature, no charge damage! High processing performance for cleaning, surface modification, hydrophilization, and adhesion e...
- Other semiconductor manufacturing equipment
- Bonding Equipment
- Circuit board processing machine
NEW! "Rotating Plasma Device"! Exhibiting at the International Frontier Industry Messe 2012 in Kobe from September 6 to 7. ■ Demo units available at the exhibition booth. Popular for surface modification and cleaning applications.
New Product! Rotating Plasma Device Debuts at Trade Show! 【Trade Show Name】International Frontier Industry Messe 2012 【Dates】 September 6 (Thursday) - 7 (Friday), 2012 10:00 - 17:00 【Venue】Kobe International Exhibition Hall, Building 2 (Kobe Port Island) 【Expected Exhibition Scale】 200 booths (including concurrently held events) * FY 2011 results: 239 companies, 271 booths 【Expected Number of Visitors】 15,000 people * FY 2011 results: 17,253 people 【Booth】 Booth Number B-07 Displayed at the booth of 'Kyoto Environmental Nanocluster (Kyoto Institute of Advanced Technology)' 【Presentation】 September 7 (Friday) Presentation Corner A 11:00-11:20 【Exhibition Content】 ☆ Live Demonstration Tabletop Vacuum Plasma Device YHS-R Rotating Vacuum Plasma Device YHS-DOS ■ Sakigake Semiconductor Special Exhibition Page http://www.sakigake-semicon.co.jp/international-industrial-fair2012_plasma.html
Achieving high quality and high productivity! Further evolved high-precision SiP bonders compatible with 300mm wafers.
- Bonding Equipment
200mm compatible, high-performance high-load wafer bonder with a maximum load of 100kN.
- Bonding Equipment
- Wafer processing/polishing equipment
[Finished] We will be exhibiting at ICEP-IAAC 2018 (April 17-21, Hotel Hanamizuki, Kuwana, Mie).
We will be exhibiting at ICEP-IAAC 2018 (April 17 (Tuesday) to 21 (Saturday); Kuwana City, Mie Prefecture). We look forward to your visit.
Prototype - Multi-functional tabletop mounter for small-scale production. Capable of solder application, component placement, and heating all in one machine.
- Mounter
- Bonding Equipment
Dual-head wedge bonder for high-speed, high-precision, and high-productivity lead frames.
- Bonding Equipment
Full auto ACF implementation line, ideal for camera modules and more.
- Bonding Equipment
- Mounter
- Other assembly machines
Air bearing cylinder with zero friction resistance.
- Pneumatic Equipment
- Bonding Equipment
- Wafer processing/polishing equipment
Notice of Participation in the 1st [Kyushu] Semiconductor Industry Exhibition
We will be exhibiting at the "1st [Kyushu] Semiconductor Industry Exhibition" to be held on September 25 (Wednesday) and 26 (Thursday), 2024. On that day, we plan to showcase electronic devices such as remote controls and cables, as well as pneumatic control equipment made by Fujikura Composite, and our self-developed product "Tofmak Non-Stick Coating." We sincerely look forward to your visit. Event Dates: September 25 (Wed) and 26 (Thu), 2024, 10:00 AM to 5:00 PM Venue: Marine Messe Fukuoka, Hall B (Booth Number: 1-19) Organizer: [Kyushu] Semiconductor Industry Exhibition Executive Committee
Continuous thermal bonding with a multi-head system achieves a stable temperature profile.
- Bonding Equipment
Continuous thermal bonding with multi-heads and efficient handling with carrier transport.
- Bonding Equipment
Ideal for R&D and small lot production; can be applied up to a length of 100mm.
- Other mounting machines
- Other assembly machines
- Bonding Equipment
Ideal for R&D and small lot production; can be applied up to a length of 60mm.
- Other mounting machines
- Other assembly machines
- Bonding Equipment
ACF thermal bonding equipment that supports a wide range of processes from R&D to mass production.
- Bonding Equipment
High precision, low cost, multifunctional... Comprehensive catalog of desktop wire bonders and bonding tools.
- Bonding Equipment
- Other semiconductor manufacturing equipment
Next, it enhances adhesion, improves wettability, and has cleaning effects. It is ideal for surface treatments such as thin film formation, various bonding, painting, and plating pre-treatments, as we...
- Other semiconductor manufacturing equipment
- Bonding Equipment
- Circuit board processing machine
Pen-shaped atmospheric pressure plasma device! Surface modification ¥348,000-
A low-temperature, non-charge-damage atmospheric pressure plasma device that excels in surface modification, cleaning, hydrophilic treatment, and adhesion enhancement! Perfect for fine processing and spot treatment! This pen-type atmospheric pressure plasma device operates at low temperatures without charge damage!! It enables environmentally friendly surface treatment through dry cleaning without solvents♪ Utilizing the high reactivity of plasma, it addresses issues such as enhancing adhesion and bonding to various materials like resin, metal, glass, and fiber, improving hydrophilicity, and removing organic substances! While high-priced plasma devices have been mainstream, the pen-type atmospheric pressure plasma device achieves excellent cost performance by focusing on essential functions. Additionally, by using only nitrogen gas for plasma generation without He or Ar, running costs are significantly reduced! Please check the treatment effects with a free demonstration first. *For treatment videos, search on YOUTUBE for "pen-type atmospheric pressure plasma device."
This is the world's first product to generate atmospheric pressure plasma on a surface.
- Other semiconductor manufacturing equipment
- Bonding Equipment
- Circuit board processing machine
We can produce sheets as thin as 1mm and thick plates up to several tens of mm! We meet our customers' needs with shaping processes tailored to their applications.
- Other Auto Parts
- Bonding Equipment
- Transport and handling robots
We can manufacture sheets from less than 1mm to several tens of mm in thickness! We meet our customers' needs with shaping processes tailored to their applications.
- Other Auto Parts
- Bonding Equipment
- Transport and handling robots
We can produce sheets from less than 1mm thick to several tens of mm thick! We meet our customers' needs with shaping processes tailored to their applications.
- Other Auto Parts
- Bonding Equipment
- Transport and handling robots
Three times the brightness. Achieving both compactness and high luminosity!
- Visual Inspection Equipment
- Bonding Equipment
- Lighting for image processing
Capable of supporting various applications such as heating processes and temperature evaluation! Maximum 400℃.
- Other heaters
- Heating device
- Bonding Equipment
This is a super compact and thin hot plate with a built-in cartridge heater, capable of reaching up to 300℃.
- Other heaters
- Heating device
- Bonding Equipment
We provide everything from circuit configurations necessary for flip chips to ultrasonic bonders.
- Bonding Equipment
- Contract manufacturing
Standard support for COF and COG substrates with one unit! A semi-automatic flip chip bonder that achieves the industry's smallest installation space and low cost.
- Bonding Equipment
- Other semiconductor manufacturing equipment
High-performance flip chip bonder for multi-variety cell production lines.
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Cell production support. Capable of handling everything from multi-variety production applications to process and material development!
- Bonding Equipment
- Other semiconductor manufacturing equipment
IC bonding device
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Tabletop semi-automatic machine for cell production use.
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Implementation Solution Service
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Notice of Participation in the 22nd Fine Tech Japan - Low Power Atmospheric Pressure Plasma Device with Reduced Ozone and Nitrogen Oxide Emissions
Well, Inc. (Location: Shinagawa, Tokyo; CEO: Naoyuki Eda), a provider of advanced semiconductor packaging solutions centered around test chips, will exhibit at the 22nd Fine Tech Japan, which will be held at Tokyo Big Sight from April 11 (Wednesday) to April 13 (Friday), 2012. Well's atmospheric pressure plasma equipment is characterized by its environmental friendliness, featuring low power consumption (CO2 reduction) while suppressing the generation of ozone and nitrogen oxides. Additionally, it does not require a vacuum chamber like conventional equipment, combining low capital investment with low running costs, which is its greatest economic advantage. On the day of the event, we will conduct a demonstration using the compact tabletop MyPL-Auto150, allowing you to experience actual large-area plasma irradiation. We sincerely look forward to your visit. 【Contact Information for Inquiries】 Well, Inc. Packaging Solutions Sales Department Tel: 03 (5715) 3501 Email: info@welljp.co.jp http://well-plasma.jp/
Real-time monitoring system for semiconductor packaging process anomalies
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Dispenser & UV irradiation device
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Ultrasonic flip chip bonder
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Next-generation soldering materials that respond to modern needs with a focus on environmental compatibility and health.
- Bonding Equipment
- Other semiconductor manufacturing equipment
- Solder