List of Other semiconductor manufacturing equipment products

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• Sensors

We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!

• Other semiconductors
• Processing Contract
• Wafer

It is a device that loads wafers one by one.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This is a device used for handling to perform P/N determination and visual inspection of silicon wafers.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

It is a device for inverting and transferring silicon wafers.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

Classified by resistivity and thickness categories.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This is a device that detects the wafer edge using laser light and measures the diameter by comparing it with a calibration wafer (reference wafer).

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This is a device that detects the edge of a wafer and measures its diameter through image processing.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This is a device that measures the thickness of sapphire wafers and sorts them according to their thickness.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

It is a device that measures the thickness of silicon wafers and rearranges them according to their thickness.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

It is a device that measures the thickness of silicon wafers and sorts them according to their thickness.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

It is a device that measures the thickness of silicon wafers and sorts them according to their thickness.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This is a device used to measure the thickness of metal or resin carriers used in the silicon wafer lapping process and double-sided polishing process.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This is a device used to measure the thickness of metal or resin carriers used in the silicon wafer lapping process and the double-sided polishing process.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This is a device used to measure the thickness of metal or resin carriers used in the silicon wafer lapping process and the double-sided polishing process.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

Thickness measurement of compound semiconductor wafers in sizes φ2”, φ4” or φ6”.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

Thickness measurement of various types of wafers below φ4"

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment