List of Other semiconductor manufacturing equipment products
- classification：Other semiconductor manufacturing equipment
241～255 item / All 2043 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
Excellent bonding using AMX patented micro-punch technology.
- Other semiconductor manufacturing equipment
With our core technology, we respond to our customers' themes! Haimeka will walk alongside our customers!
- Contract manufacturing
- Other semiconductor manufacturing equipment
- Circuit board design and manufacturing
![[Analysis Case] Composition Analysi...](https://image.mono.ipros.com/public/default/object/noimage_l.gif?w=280&h=280){kind=small}
Shape observation and simple quantitative analysis using SEM-EDX.
- Contract Inspection
- Wafer
- Other semiconductor manufacturing equipment
Bringing precision dispensing closer to you. Precision dispenser 'Quspa-Dx'.
- Other semiconductor manufacturing equipment
A systematic explanation from the basics of semiconductor packaging to the design and evaluation of encapsulation materials. Leading experts thoroughly organize practical perspectives from WLP/PLP to ...
- Other semiconductor manufacturing equipment
- Other semiconductors
- Technical Seminar
Clean drying using high-purity IPA is possible for devices, wafers, glass, components, etc., regardless of material or shape.
- Other semiconductor manufacturing equipment
Our local subsidiary in Thailand supports your business! - A trading company known for its flexibility.
- Other semiconductor manufacturing equipment
- others
- Other Connectors
![[Compact & Lightweight] UV (Ultravi...](https://image.mono.ipros.com/public/product/image/2b2/2000455383/IPROS90958152167746040604.png?w=280&h=280){kind=small}
A compact curing device that can be used on a tabletop. It allows for both top and bottom irradiation, and its affordable price is also attractive! *Demo units available for loan.
- Other semiconductor manufacturing equipment
Features stable solder ball mounting and improves productivity through an inline system.
- Other semiconductor manufacturing equipment
A sheet-type resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from high-pressure jets [testable].
- High pressure cleaner
- Other semiconductor manufacturing equipment
- Resist Device
Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.
We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!
Dicing ring (frame) cleaning device available in two types: jet cleaning type (non-contact) and scrub cleaning type (contact).
- Other semiconductor manufacturing equipment
Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.
We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!
Both upper and lower surfaces can be UV irradiated. Even with an affordable version that is easy to use, we thoroughly pursue cost-effectiveness (effectiveness) in curing.
- Other semiconductor manufacturing equipment
Notice of Participation in "Semicon Japan 2018"
We will be exhibiting at "SEMICON Japan 2018," which will be held at Tokyo Big Sight in December 2018! We will be participating in the "SEMICON Japan 2018 (Back-End & General Zone)." ▼ Exhibited Products - "Ultrasonic Cutting Device CSX-400 Series" - "Chip 6-Sided Appearance Inspection Device CI-4000" - "Ultra-Low Load Compatible Flip Chip Bonder CB-600" - "Tabletop LED Light Source UV Irradiation Device" We sincerely invite you to visit our booth during this opportunity. 【Date】 December 12 (Wednesday) - 14 (Friday), 2018 10:00 AM - 5:00 PM 【Venue】 Tokyo Big Sight, East Exhibition Hall, Conference Hall 【Booth Number】 2009
![[Compact & Lightweight] UV-LED Irra...](https://image.mono.ipros.com/public/product/image/41b/2000460215/IPROS62495294798517871344.png?w=280&h=280){kind=small}
A compact LED curing device that can be used on a tabletop. It can emit light from both the top and bottom, and its affordable price is also attractive! *Demo units available for loan.
- Other semiconductor manufacturing equipment
Dust removal device compatible with thin plates. Equipped with a magnetic gear in the drive unit! This single unit can accommodate a wide range of substrate thicknesses.
- Printed Circuit Board
- LCD display
- Other semiconductor manufacturing equipment