List of Printed Circuit Board products
- classification：Printed Circuit Board
91～135 item / All 2107 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
No more need to lift heavy one-gallon cans! Enjoy comfortable liquid transfer in the central kitchen.
- Other Pumps
Decision to exhibit at the 1st Chubu Food Industry Creation Exhibition '26!
We will be exhibiting at the "1st Chubu Food Industry Creation Exhibition '26" to be held at Port Messe Nagoya from November 4 (Wednesday) to November 6 (Friday), 2026. As a new addition to our lineup, we will showcase the "Cordless Sanitary Handy Pump," which is a product we started selling in April last year, alongside our "Compact Sanitary Handy Pump Model MHS." - Cordless! Portable anywhere! Easy to use! Simple cleaning! It is compatible with standard 18L cans and BIB (Bag-in-Box) and features a structure that allows for easy disassembly and cleaning. We would like to invite you to visit us at this opportunity. - Venue: Port Messe Nagoya - Our exhibition booth: Hall 1 "C-66"
We will solve issues such as insufficient implementation space and concerns about connection reliability!
- Printed Circuit Board
Inline model that automates the printed circuit board cutting process.
- Circuit board processing machine
- Other processing machines
- Printed Circuit Board
Introduction of the batch printing function! Announcement of the November WEB seminar.
【November WEB Seminar (Duration: 30 minutes)】 You can easily participate for free in our WEB seminar using ZOOM! The seminar in November will cover the following course. [Course] Introduction to Laser-based Circuit Board Marking Equipment and Batch Printing Function ----▼ Click here to register ▼--------------------------------------------- By clicking the "Details/Registration" button below, you can check the details and register! ------------------------------------------------------------------------
Improvement of productivity through parallel setup in the printed circuit board division process, also accommodating inline production processes!
- Circuit board processing machine
- Other processing machines
- Printed Circuit Board
Notice regarding the Total Solution Exhibition for Electronic Devices 2026 (JISSO PROTEC 2026)
We will be exhibiting the "Router-type Turntable Circuit Board Cutting Machine" and the "Laser-type Circuit Board Marking Device" at the Total Solution Exhibition for Electronic Devices 2026 (JISSO PROTEC 2026), which will be held at Tokyo Big Sight from June 10 to 12, 2026. At the exhibition venue, you will be able to confirm the actual processing quality through demonstrations of circuit board cutting and printing. We look forward to your visit to the Meibishi Technica booth on the day. <Location> Tokyo Big Sight, East Hall 1 (Booth No. 1A-31) <Exhibition Content> "Router-type Turntable Circuit Board Cutting Machine" We propose a high-productivity circuit board cutting device that achieves parallel setup during circuit board cutting through a turntable system and is compatible with robot collaboration. "Laser-type Circuit Board Marking Device" We propose high-resolution printing that supports high-speed fine printing of two-dimensional codes and characters necessary for the traceability of printed circuit boards, as well as compatibility with various materials.
We made our first exhibition of the turntable-type circuit board cutting machine MR2535H2T.
- Circuit board processing machine
- Printed Circuit Board
【Monthly Web Seminars Now Held!】Automating the processes from PCB supply to PCB cutting, palletizing onto output trays, and PCB discharge!
- Circuit board processing machine
- Other processing machines
- Printed Circuit Board
Introduction of the batch printing function! Announcement of the November WEB seminar.
【November WEB Seminar (Duration: 30 minutes)】 You can easily participate for free in our WEB seminar using ZOOM! The seminar in November will cover the following course. [Course] Introduction to Laser-based Circuit Board Marking Equipment and Batch Printing Function ----▼ Click here to register ▼--------------------------------------------- By clicking the "Details/Registration" button below, you can check the details and register! ------------------------------------------------------------------------
No actual substrates or devices are needed! By simulating the takt time of the printed circuit board splitting process in advance, you can calculate a production quantity that is closer to actual prod...
- Printed Circuit Board
- Other services
- Circuit board processing machine
Troubleshooting Edition! Announcement of the March WEB Seminar
【March WEB Seminar (Duration: 30 minutes)】 You can easily participate for free in our WEB seminar using ZOOM! In March, we will hold the following two courses. [Course 1] Automation of the entire process from substrate supply to substrate cutting, palletizing onto the output tray, and substrate discharge, including support for inline automation and batch processing with the "Substrate Cutting Machine + Robot Transport System," along with tips for extending the lifespan of router bits. [Course 2] We will solve your problems with our substrate marking equipment. ----▼ Click here to register▼--------------------------------------------- By clicking the "Details & Registration" button below, you can check the details and register! ------------------------------------------------------------------------
You can use printed circuit board CAD data to specify the cutting points of the board splitting machine on your computer.
- Circuit board processing machine
- Other processing machines
- Printed Circuit Board
During operation, the front door closes, eliminating concerns about touching moving parts, ensuring safe work conditions!
- Other processing machines
- Circuit board processing machine
- Printed Circuit Board
High-reliability FPC contributing to sensor connections of space exploration vehicles.
- Printed Circuit Board
- connector
High-reliability FPC contributing to the miniaturization and weight reduction of rocket control systems.
- Printed Circuit Board
- connector
High-reliability FPC contributing to the miniaturization and lightweighting of satellites and space equipment.
- Printed Circuit Board
- connector
![[For Space Medicine] Lightweight an...](https://image.mono.ipros.com/public/product/image/2050559/IPROS16902731983533487698.jpg?w=280&h=280){kind=small}
High-reliability FPC contributing to the miniaturization and lightweighting of space medical devices.
- Printed Circuit Board
- connector
![[Space Robot] Lightweight and Highl...](https://image.mono.ipros.com/public/product/image/2050559/IPROS1088871854183718768.jpg?w=280&h=280){kind=small}
High-reliability FPC contributing to joint drive of space robots.
- Printed Circuit Board
- connector
![[Space Station] FPC for the Space I...](https://image.mono.ipros.com/public/product/image/2050559/IPROS6863520877033731752.jpg?w=280&h=280){kind=small}
High-reliability FPC contributing to the life support system of the space station.
- Printed Circuit Board
- connector
![[Space Antenna] Lightweight and Hig...](https://image.mono.ipros.com/public/product/image/2050559/IPROS7685167866886425594.jpg?w=280&h=280){kind=small}
High-reliability FPC contributing to the miniaturization and lightweighting of space antennas.
- Printed Circuit Board
- connector
![[Space Solar Power] Lightweight and...](https://image.mono.ipros.com/public/product/image/2050559/IPROS11974600008571778375.jpg?w=280&h=280){kind=small}
High-reliability FPC supporting the power supply system of space solar power generation.
- Printed Circuit Board
- connector
To address quality issues and delays in parts procurement due to overseas outsourcing! We provide credit supplementation through our procurement network, delivering from PCB assembly to inspection, as...
- EMS
- Printed Circuit Board
Ability in accordance with "JAXA specification" requirements.
- Printed Circuit Board
- connector
Press Release from Taiyo Techno Rex: Regarding the Conclusion of a Business Outsourcing Contract for Space Environment Testing
~Starting the demonstration of high-reliability FPC through space environment testing~ Taiyo Techno Rex Co., Ltd. has recently signed a business outsourcing contract with Jinsei Co., Ltd. regarding the space environment testing of our space-use FPC (Flexible Printed Circuit) cables. Our FPC will be mounted on the engineering model of the small satellite "Cubesat" developed by Jinsei, and various tests simulating the space environment will be conducted. This testing is an important initiative aimed at confirming and demonstrating functionality in future orbital operations. In outer space, resistance to extremely harsh conditions such as extreme temperature changes, radiation, and intense vibrations is required. We view this initiative not only as limited to space applications but also as an opportunity to demonstrate FPC technology that exhibits high reliability even under extreme conditions. Moving forward, we will continue to develop and provide high-reliability FPCs with an eye toward expanding into a wide range of fields, including aerospace, industrial equipment, automotive devices, and various inspection equipment, where high quality and reliability are essential.
For the development and manufacturing of small IoT devices and precision equipment! We provide a comprehensive in-house system from material procurement to PCB assembly, inspection, assembly, packagin...
- EMS
- Printed Circuit Board
We realize electronics with thin, lightweight, and flexible substrates. The design philosophy of flexible hybrid electronics in response to changes in social structure.
- Printed Circuit Board
August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.
We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!
Reduce manufacturing processes by applying functional ink only where necessary! A new manufacturing technology that contributes to energy savings and material waste reduction.
- Printed Circuit Board
August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.
We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!
Wireless communication sends data to smartphones and the cloud! FHE system configuration that allocates roles appropriately.
- Printed Circuit Board
August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.
We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!
We expand the possibilities of product design with flexible substrates! FHE enhances design freedom and creates new applications.
- Printed Circuit Board
August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.
We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!
Solving technical challenges for large-scale deployment of IoT sensors! We propose low-cost dataization for society as a whole.
- Printed Circuit Board
August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.
We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!
We will manufacture multi-layer flexible printed circuit boards (3 to 6 layers) entirely from polyimide. Please look forward to our quick delivery response! (Multi-layer boards, FPC)
- Other electronic parts
- Printed Circuit Board
- Circuit board design and manufacturing
Experience Taiyo Technorex's FPC at Flex's social study tour, Nepcon Japan 2025!
◎FPC (Flexible Printed Circuit Board): Under the theme of "Discovering Applications for FPC," you can experience the characteristics of FPC in four zones: lightweight, flexible, fine, and special. 1. Comparison of weight between rigid boards and FPC 2. FPC that you can actually touch and bend 3. Reduction of board area due to high-density wiring 4. FPC with special features such as transparent, high-frequency, and pressure-resistant types Additionally, we are also showcasing next-generation circuit technologies such as stack vias and via fills. It's not just about FPC! We have live demonstrations of 'FA Automation' and the latest appearance inspection system using AI technology! ◎FA Automation: By achieving teaching-less automation through visual feedback control, we eliminate the burden of calibration and realize high-precision, high-speed operation. We have prepared a demonstration for the transport of rigid boards. ◎The latest final appearance inspection system, the AI system 'TY-VISION XAIS,' is now in Chapter 2! In addition to improving efficiency by reducing false positives in the final appearance inspection process, it also supports defect detection using AI. It is effective for defects with minimal brightness differences that are difficult to detect with inspection devices, even though they can be identified visually.