List of Other electronic parts products
- classification：Other electronic parts
8056～8100 item / All 8328 items
Heat resistant up to 1200℃. We will custom-make high-performance insulation covers that ensure safety in the working environment!
- Glass
This is an introduction to examples of through-hole processing for LCP (liquid crystal polymer).
- Other electronic parts
This is an example of gradient processing on PET with a minimum width of 20μm to 100μm. Depth control is possible up to 0.5μm.
- Other electronic parts
This is an example of fine cutting processing on 0.5mm thick PTFE with a 0.2mm square and a 0.4mm pitch using a picosecond laser.
- Other electronic parts
Only 3.9 kg?! The handheld UV emitter is incredibly lightweight.
- Other electronic parts
- Other lighting equipment
We provide a comprehensive service from product planning, development, and design to parts procurement and manufacturing.
- Other electronic parts
- Circuit board design and manufacturing
High-density packaging, compatibility, and a wide variety of pin counts.
- Other electronic parts
Hirose original design connector, various combinations are possible.
- Other electronic parts
Easy-to-connect crimp connections can be made with crimping tools that comply with JIS C 9711.
- Other electronic parts
We manufacture and assemble various special specifications of parts according to needs.
- Other electronic parts
- Contract manufacturing
Function Block integrated to capture signals to a workstation and business monitor.
- Other electronic parts
For in-vehicle devices and more. We create future light systems.
- Other electronic parts
A small electronic buzzer that serves two functions; it can be used as a speaker.
- Sound Parts
- Oscillator
- Other electronic parts
Quality inspection, assembly, packaging
- Other electronic parts
- Other services
- Processing Contract
Nano-coating treated heat dissipation plate for LED lighting
- Other electronic parts
Advanced implementation evaluation TEG (test) chip
- Other electronic parts
- others
- Processing Contract
Glass chip for observing underfill entrapment voids.
- Other electronic parts
- others
- Processing Contract
![LED Bar Module [Full Color LED]](https://image.mono.ipros.com/public/product/image/b8b/135151043/IPROS_11976752171271250000.JPG?w=280&h=280){kind=small}
Selling ultra-thin flexible LED bar modules with a substrate thickness of 0.5mm.
Well Co., Ltd. (Location: Shinagawa-ku, Tokyo; CEO: Naoyuki Eda), a next-generation semiconductor implementation solution company centered around test chips, will sell ultra-thin flexible LED bar modules with a substrate thickness of 0.5mm. Thanks to the ultra-thin flexible substrate and 3M adhesive tape, installation is easy in curved areas and tight spaces. You can use it starting from a minimum size of 30mm (with 3 LEDs). Choose from red, yellow, blue, green, white, or RGB for the mounted LEDs. <Introduction Homepage> http://well-led.jp/led_flexibemodule.aspx <Inquiries regarding this matter> Well Co., Ltd. LED Division 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-led.jp/led_inspectionsystem.aspx
LED Bar Module [High Brightness White LED 2 chips]
- Other electronic parts
Selling ultra-thin flexible LED bar modules with a substrate thickness of 0.5mm.
Well Co., Ltd. (Location: Shinagawa-ku, Tokyo; CEO: Naoyuki Eda), a next-generation semiconductor implementation solution company centered around test chips, will sell ultra-thin flexible LED bar modules with a substrate thickness of 0.5mm. Thanks to the ultra-thin flexible substrate and 3M adhesive tape, installation is easy in curved areas and tight spaces. You can use it starting from a minimum size of 30mm (with 3 LEDs). Choose from red, yellow, blue, green, white, or RGB for the mounted LEDs. <Introduction Homepage> http://well-led.jp/led_flexibemodule.aspx <Inquiries regarding this matter> Well Co., Ltd. LED Division 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-led.jp/led_inspectionsystem.aspx
LED Bar Module [High Brightness White LED 3 Chips]
- Other electronic parts
Selling ultra-thin flexible LED bar modules with a substrate thickness of 0.5mm.
Well Co., Ltd. (Location: Shinagawa-ku, Tokyo; CEO: Naoyuki Eda), a next-generation semiconductor implementation solution company centered around test chips, will sell ultra-thin flexible LED bar modules with a substrate thickness of 0.5mm. Thanks to the ultra-thin flexible substrate and 3M adhesive tape, installation is easy in curved areas and tight spaces. You can use it starting from a minimum size of 30mm (with 3 LEDs). Choose from red, yellow, blue, green, white, or RGB for the mounted LEDs. <Introduction Homepage> http://well-led.jp/led_flexibemodule.aspx <Inquiries regarding this matter> Well Co., Ltd. LED Division 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-led.jp/led_inspectionsystem.aspx
Metal base CCL substrate for high-power LEDs
- Other electronic parts
Test chip with next-generation solder bumps.
- Other electronic parts
- others
- Processing Contract
Test chip for ultra-fine pitch WB/FC mounting evaluation.
- Other electronic parts
- others
- Processing Contract
Test chip for ultra-fine pitch WB/FC mounting evaluation.
- Other electronic parts
- others
- Processing Contract
Test chip for evaluating Cu bonding with Cu bumps.
- Other electronic parts
- others
- Processing Contract
![Test chip [Large general-purpose]](https://image.mono.ipros.com/public/product/image/232/135151026/IPROS_18202600641364791000.gif?w=280&h=280){kind=small}
Test chip [Large general-purpose]
- Other electronic parts
- others
- Processing Contract
Test chip 【Ultra-small chip size 0.55mm】
- Other electronic parts
- others
- Processing Contract
Test chip for evaluating LCD driver implementation.
- Other electronic parts
- others
- Processing Contract
Test chip for thermal resistance and stress measurement.
- Other electronic parts
- others
- Processing Contract
Test chip for ultra-fine pitch wire bonding evaluation.
- Other electronic parts
- others
- Processing Contract
Test chip with solder bumps
- Other electronic parts
- others
- Processing Contract
Test chip with solder bumps
- Other electronic parts
- others
- Processing Contract
![Test chip [Multi-type]](https://image.mono.ipros.com/public/product/image/086/135151018/IPROS_13072303327799126000.gif?w=280&h=280){kind=small}
Removal of special solder and low-temperature solder.
- Other electronic parts
Supply of high-performance, low-cost products is possible.
- Other electronic parts
Available for ultra-wideband use from 10 MHz to 10 GHz.
- High frequency/microwave parts
- Other electronic parts
By using heat shrink tubing, it can also become a simple insulated connector.
- Other electronic parts