List of Heating device products

  • classification:Heating device

46~90 item / All 1981 items

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

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  • Other conveying machines

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We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!

  • Other semiconductors
  • Processing Contract
  • Wafer

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Tabletop small-sized experimental furnace - space-saving with a maximum operating temperature of 2000℃! We also manufacture metal furnaces for reducing atmospheres.

  • Heating device
  • Electric furnace
  • Annealing furnace

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【MiniLab】 Evaporation/Sputtering Dual Chamber System

Two thin film experimental devices are connected by a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected via the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB evaporation: 7cc crucible x 6 - Resistance heating evaporation x 2 - Organic evaporation limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron cathode x 4 for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma etching stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique "soft etching" technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)

Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace

  • Heating device
  • Annealing furnace
  • Electric furnace

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☆★☆ Spatter and Vapor Deposition Source Combined Film Formation Device 【nanoPVD-ST15A】 ☆★☆

Sputter Cathode and Co-evaporation Source Mixed Thin Film Experimental Device. Metal deposition, organic deposition, and sputter cathode are installed in a compact frame. A resistance heating evaporation source (for metal deposition), an organic evaporation source (for organic materials), and magnetron sputtering (for metals and insulating materials) are installed in the chamber, allowing for various thin film experimental setups within a single chamber. ◉ Three combinations available: 1. Sputter Cathode + Resistance Heating Evaporation Source x2 2. Sputter Cathode + Organic Evaporation Source x2 3. Sputter Cathode + Resistance Heating Source x1 + Organic Evaporation Source x1 (*DC sputtering only) 【Specifications】 ◉ Compatible substrates: up to Φ4 inches ◉ Sputtering: 2" cathode x up to 3 sources ◉ Vacuum deposition: Resistance heating evaporation (up to 2), organic evaporation (up to 4) ◉ 7" touch panel operation with PLC automatic process control ◉ APC automatic pressure control ◉ 1 line of Ar gas (standard) + expandable with N2, O2 ◉ Connects to a Windows PC via USB for recipe creation and storage. Data logging on PC ◉ Various other options available ◉ Easy operation with a 7" touch panel and PLC automatic process control

Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace

  • Heating device
  • Annealing furnace
  • Electric furnace

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【MiniLab】 Evaporation/Sputtering Dual Chamber System

Two thin film experimental devices are connected by a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected via the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB evaporation: 7cc crucible x 6 - Resistance heating evaporation x 2 - Organic evaporation limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron cathode x 4 for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma etching stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique "soft etching" technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)

Maximum operating temperature 2000℃ Semi-automatic control Ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace

  • Heating device

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■□【PyroMini】□■ Compact High-Performance Infrared Temperature Sensor

High-performance touch panel converter for easy setup, data logging, and data storage on microSD card. The PM2.2 model can also measure glossy metal surfaces. 【Overview】 With a highly visible high-brightness touch panel display, parameters such as temperature range, emissivity, and sampling rate can be intuitively operated and set. Long-term data storage and management are possible with a microSD card. (*An option for a converter without a display is also available.) The compact sensor head, measuring φ18mm x 45mm, allows for temperature measurement in tight spaces. It employs sensors and cables with excellent noise resistance, making it suitable for integration into moving equipment such as robotic arms. The PM2.2 model uses a short wavelength of 2.2um, supporting high temperatures (Max 2000℃) and measurements of glossy metal material surfaces. 【Features】 ◎ Wide range: -20 to 1000℃ (PM), 100 to 2000℃ (PM2.2) ◎ Excellent basic performance: Accuracy ±1%, reproducibility ±0.5%, 240msec fast response ◎ Measurement wavelength range: 8 to 14μm (PM), 2.0 to 2.2μm (PM2.2) ◎ Compact Φ18mm x 45mm

6 to 8 inch ultra-high temperature wafer annealing equipment, a high-performance machine that widely supports various purposes from research and development to small-scale production.

  • Annealing furnace
  • Heating device
  • Electric furnace

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mid-station-linear-load-lock-1.jpg

【MiniLab】 Evaporation/Sputtering Dual Chamber System

Two thin film experimental devices are connected by a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected via the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB evaporation: 7cc crucible x 6 - Resistance heating evaporation x 2 - Organic evaporation limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron cathode x 4 for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma etching stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique "soft etching" technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)

Rapid heating up to 350℃! Since it is transparent, you can check the condition of the heated object through the heater.

  • Food Processing Equipment
  • Industrial Furnace
  • Heating device

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We will introduce the main components and key elements of the high-frequency induction heating device!

  • Heating device

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We are introducing high-frequency dielectric heating, which allows for easy temperature control, in our company column!

  • Heating device

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The generation of toxic gas and the surrounding environment do not become high temperature, creating a good working environment! We have many abundant application examples to introduce.

  • Heating device

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About the expanding use of induction heating! We will provide detailed introductions by field.

  • Heating device

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It is possible to adopt various temperature control methods! The heating coil during heating can be freely raised and lowered, allowing for flexible temperature distribution.

  • Heating device

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The heating coil in operation allows for adjustable height and flexible temperature distribution! Data import to other devices is possible.

  • Heating device

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No need for water cooling cables, making maintenance a breeze! Can be integrated with the furnace body.

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  • Heating device

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Providing high-frequency devices suitable for our customers! The culmination of manufacturing experience and wisdom is our asset!

  • Heating device

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I will briefly explain the differences between induction heating and dielectric heating! Please take a moment to read it.

  • Heating device

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We will provide a detailed introduction to what the high-frequency output is based on!

  • Heating device

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We will provide a detailed introduction to high-frequency induction heating, which has various features such as easy temperature control and high reproducibility!

  • Heating device

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The principle is the same as that of an induction cooker (IH heater) and microwave! High-frequency heating using power in the radio wave range (3kHz to 3GHz).

  • Heating device

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The amount of heat generated changes depending on the electrical properties of the material (such as resistance)! Here, we introduce the heating objects for induction heating and dielectric heating.

  • Heating device

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Automotive electronic components - Shortening molding cycles and improving insulation and durability! Introducing the application fields of dielectric heating.

  • Heating device

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Flexible arrangement of the heating section (coil section) is possible! Supports both atmospheric heating devices and ambient heating with a single power supply for two furnaces.

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  • Heating device

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Easy one-touch clamp for replacing heating coils! Flexible arrangement of the heating section (coil section) is possible.

  • Heating device

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The cost of spare parts is significantly different! It's a space-saving device with flexible placement.

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  • Heating device

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Supports the improvement of wear resistance of CFRP components and the prevention of oxidation and reactions in SiC components. Assists in achieving CO2 emission reduction and carbon neutrality.

  • Heating device
  • Surface treatment contract service
  • Other conveying machines

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We assist with "resource conservation and energy saving" through Tokaro's thermal spraying and surface treatment technology!

  • Heating device

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This is a heater for thin film experiments such as PVD and CVD, featuring excellent uniformity, heating characteristics, and controllability. RF/DC bias specifications are also available.

  • Heating device

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PM_iPROS_550.jpg

■□【PyroMini】□■ Compact High-Performance Infrared Temperature Sensor

High-performance touch panel converter for easy setup, data logging, and data storage on microSD card. The PM2.2 model can also measure glossy metal surfaces. 【Overview】 With a highly visible high-brightness touch panel display, parameters such as temperature range, emissivity, and sampling rate can be intuitively operated and set. Long-term data storage and management are possible with a microSD card. (*An option for a converter without a display is also available.) The compact sensor head, measuring φ18mm x 45mm, allows for temperature measurement in tight spaces. It employs sensors and cables with excellent noise resistance, making it suitable for integration into moving equipment such as robotic arms. The PM2.2 model uses a short wavelength of 2.2um, supporting high temperatures (Max 2000℃) and measurements of glossy metal material surfaces. 【Features】 ◎ Wide range: -20 to 1000℃ (PM), 100 to 2000℃ (PM2.2) ◎ Excellent basic performance: Accuracy ±1%, reproducibility ±0.5%, 240msec fast response ◎ Measurement wavelength range: 8 to 14μm (PM), 2.0 to 2.2μm (PM2.2) ◎ Compact Φ18mm x 45mm

From microwave ovens to high-temperature heating furnaces! A thorough explanation of the basics and applications of microwave heating, equipment design, problem-solving, and chemical reactions.

  • Heating device
  • Microwave Reactor
  • Technical Seminar

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Smartly attached to the test device. A high-performance IR imaging furnace equipped with heating, atmosphere control, and evacuation mechanisms.

  • Heating device

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Pressure vessels have different management requirements depending on their type! (Type I, Small, Type II)

  • Distillation Apparatus
  • Heating device
  • High Pressure Reactor

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A pressure vessel is a container designed to efficiently store gases or liquids!

  • Heating device
  • High Pressure Reactor
  • Evaporation/Concentration Equipment

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Metal knit for mold heating! It reduces damage to molds (local heating and oxidation)! Custom designs can be made to fit the mold shape, achieving uniform heating.

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  • Other processing machines
  • Heating device
  • Casting Machine

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Thank you for visiting Thermotech 2022!! June 1 (Wednesday) to June 3 (Friday), 2022 at Tokyo Big Sight.

The Thermotech '2022 event held at Tokyo Big Sight has successfully concluded. We would like to express our heartfelt gratitude to the many customers who visited our booth. The most popular item was indeed the "hydrogen combustion burner." We received various questions and words of encouragement after watching the comparison video of hydrogen and natural gas combustion flames. We will continue to develop and refine the hydrogen burner to meet our customers' needs. Additionally, we received many requests for detailed information on other products, including environmental equipment (odor removal systems for on-site demonstrations), painting equipment (hybrid gas and electric), and aluminum alloy oxidation suppression furnaces, as well as surface combustion burners and package mixers. Thank you very much.

Explains the basics of microwave heating to engineering applications. Learn about the principles of rapid, internal, and selective heating, thermal runaway, temperature distribution control, and heati...

  • Heating device
  • High frequency/microwave parts
  • Technical Seminar

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Max 1000℃, MFC maximum 3 systems, APC pressure control, compatible with 4" or 6" substrates, high vacuum annealing equipment (<5 × 10^-7 mbar)

  • Annealing furnace
  • Heating device
  • Electric furnace

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【MiniLab】 Evaporation/Sputtering Dual Chamber System

Two thin film experimental devices are connected by a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected via the load lock. With Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB evaporation: 7cc crucible x 6 - Resistance heating evaporation x 2 - Organic evaporation limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron cathode x 4 for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma etching stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique "soft etching" technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)

The "Hydrogen Combustion Specification" of the Package Burner Series! It achieves a stable flame even under high furnace pressure conditions and can be used in a wide range of fields across various in...

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  • Heating device
  • Industrial Furnace
  • Drying Equipment

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High-precision temperature control for heaters from other manufacturers with terminal block connection. Program control and safety features included.

  • Heating device
  • Other physicochemical equipment

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For heating large glass substrates and large-area workpieces. Thin, energy-efficient, and suitable for desktop installation.

  • Heating device
  • Drying Equipment

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It is a high-performance vacuum deposition source that can be used as a high-temperature heating cell for vacuum applications, with an organic deposition source up to 800°C and a metal deposition sour...

  • Evaporation Equipment
  • Heating device
  • Electric furnace

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★★【PyroNFC】Smartphone Configurable Infrared Radiation Temperature Sensor★★

Temperature range, emissivity, alarm, and other parameters can be set using a smartphone or tablet without the need for a display instrument or power supply for the instrument. ● Settings can be made using a smartphone or tablet. ● A dedicated app can be downloaded for free from Google Play (Android 4.1 to 5.1). ● Using Android's NFC communication, simply touch the sensor part to read and write data. ● Ultra-compact sensor (Φ31mm x t29mm) allows temperature measurement in tight spaces. ● Fast response time of 125 msec, high accuracy of ±1.5%. ● Voltage output (0-5V or 0-10V), or K thermocouple output. 【Other Specifications】 ◉ Field of view: 15:1 ◉ Temperature range: 0℃ to 1000℃ ◉ Measurement wavelength range: 8 to 14μm ◉ Emissivity: 0.2 to 1.0 ◉ Power supply: 24VDC (minimum 6V/10V to maximum 28VDC) ◉ Cable: 1m included (extension up to 30m possible) 【Options】 ◉ Body mounting bracket ◉ Extension cable ◉ Air purge kit

Hot Wall Type Thermal CVD Equipment: A compact, high-performance CVD device ideal for fundamental research.

  • CVD Equipment
  • Annealing furnace
  • Heating device

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PM_iPROS_550.jpg

■□【PyroMini】□■ Compact High-Performance Infrared Temperature Sensor

High-performance touch panel converter for easy setup, data logging, and data storage on microSD card. The PM2.2 model can also measure glossy metal surfaces. 【Overview】 With a highly visible high-brightness touch panel display, parameters such as temperature range, emissivity, and sampling rate can be intuitively operated and set. Long-term data storage and management are possible with a microSD card. (*An option for a converter without a display is also available.) The compact sensor head, measuring φ18mm x 45mm, allows for temperature measurement in tight spaces. It employs sensors and cables with excellent noise resistance, making it suitable for integration into moving equipment such as robotic arms. The PM2.2 model uses a short wavelength of 2.2um, supporting high temperatures (Max 2000℃) and measurements of glossy metal material surfaces. 【Features】 ◎ Wide range: -20 to 1000℃ (PM), 100 to 2000℃ (PM2.2) ◎ Excellent basic performance: Accuracy ±1%, reproducibility ±0.5%, 240msec fast response ◎ Measurement wavelength range: 8 to 14μm (PM), 2.0 to 2.2μm (PM2.2) ◎ Compact Φ18mm x 45mm

High-temperature crucible heating heater for vacuum use. A versatile heater unit that can be used as an organic deposition source at 800°C and a metal deposition source at 1500°C.

  • Evaporation Equipment
  • Heating device
  • Electric furnace

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◆OLED◆ Organic vapor deposition - High-temperature metal evaporation source Max 1500℃

The OLED evaporation source is a high-temperature heating heater for vacuum devices with a maximum operating temperature of 1500°C. It can evaporate materials with high evaporation temperatures, making it suitable for a wide range of applications as a vacuum high-temperature heater and evaporation cell, from low-temperature organic deposition (up to 800°C) cells to high-temperature resistance heating deposition (up to 1500°C) MBE cells. Shutter actuators and water-cooled jackets are also available. High-temperature heaters above 800°C are designed with internal shielding, considering insulation and thermal shielding. 【Main Specifications】 ■ Maximum control temperature: 800°C or 1500°C ■ Operating environment: in vacuum or inert gas (*O2 up to 800°C) ■ Heater: tungsten filament ■ Crucible volume: 1cc (maximum fill volume 1.5cc) ■ Crucible material: alumina ■ Case material: SUS304 or molybdenum ■ Thermocouple: K or C 【Options】 ⚫ Crucible material: PBN, graphite, quartz ⚫ Heater: NiCr wire, Kanthal wire (*for O2) ⚫ Crucible volume: 10cc (maximum fill volume 15cc) ⚫ Shutter: pneumatic or motor-driven ⚫ Water-cooled jacket ⚫ Controller (for heater and shutter control)

Fundamental to applied technologies using thermal/non-thermal processes.

  • Technical and Reference Books
  • Other process controls
  • Heating device

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For those struggling with heat radiation and heat conduction from the furnace! Achieve both extended equipment lifespan and energy savings through proper material selection and precise processing base...

  • Industrial Furnace
  • Electric furnace
  • Heating device

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Packing used around furnace equipment, high-performance fiber products requiring tensile strength.

  • Heating device
  • Industrial Furnace
  • Electric furnace

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An ideal insulation material that can be used from -190℃ to 1100℃ and exhibits excellent performance.

  • Heating device
  • Industrial Furnace
  • Electric furnace

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It has become possible to manufacture high-performance insulation materials flexibly to match costs.

  • Industrial Furnace
  • Heating device
  • Electric furnace

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