List of Other polymer materials products
- classification：Other polymer materials
541～585 item / All 4577 items
We provide comprehensive support from design to manufacturing and maintenance!
- Contract manufacturing
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
Epoxy resin that enhances heat dissipation and improves the reliability of semiconductor devices.
- Other polymer materials
- Other consumables
It is an adhesive that is expected to have strong adhesion to materials such as silicone rubber and foam.
- Other polymer materials
Added silicone adhesive and sealant "TSE382" to AD-Chemi.
Momentive's "TSE382" is a one-component, oxime-based condensation RTV (Room Temperature Vulcanizing) silicone that reacts with moisture in the air to promote crosslinking reactions. In its uncured state, it is a low-viscosity paste, and after curing, it becomes an elastic rubber that forms a highly crosslinked siloxane network structure. Since it employs an oxime-based condensation reaction, it is a "neutral curing type" that does not release corrosive by-products such as acetic acid during the curing process. It exhibits high adhesion strength to aluminum, stainless steel, zinc die-cast, and various engineering plastics (such as ABS, PC, PBT, epoxy, etc.) without the need for surface treatment. In particular, due to the flexibility of the siloxane chains and their low surface energy, it spreads and wets the fine irregularities of the substrate surface, demonstrating a cohesive failure type of adhesion mode with high interfacial adhesion. For more details, please visit our website.
This is a thin film coating agent designed to protect electronic printed circuit boards (PCBs). It protects substrates and components from mechanical and environmental corrosion.
- Rubber
- Other polymer materials
Added silicone adhesive and sealant "TSE322S" to AD-Chemi.
Momentive's "TSE322S" is a one-component, heat-curing silicone adhesive sealant optimized for assembly applications where thermal, mechanical, and environmental stresses act in combination, such as in electronic devices and optical modules. This material forms a silicone network with excellent heat resistance, flexibility, and electrical insulation based on a siloxane backbone, achieving high adhesion strength and dimensional stability through heat curing. Since it does not generate by-products during curing, the risk of gas corrosion and void formation is low even in sealed structures and around electronic components, making it suitable for applications requiring long-term reliability. A major feature of TSE322S is its interface formation technology that does not require a primer. The formulation design is less dependent on the polarity and surface energy of the substrate surface, allowing it to exhibit a chemical and physical composite adhesion mechanism to metals such as aluminum, copper, and stainless steel, engineering plastics such as PPS, PBT, and epoxy, as well as inorganic materials like glass and ceramics. This ensures high adhesion stability even in complex module structures that combine dissimilar materials. For more details, please check our website.
We propose silicone adhesives, potting materials, and encapsulants that can also be used for conventional general-purpose devices requiring heat dissipation.
- Rubber
- Other polymer materials
Added silicone adhesive and sealant "TSE322S" to AD-Chemi.
Momentive's "TSE322S" is a one-component, heat-curing silicone adhesive sealant optimized for assembly applications where thermal, mechanical, and environmental stresses act in combination, such as in electronic devices and optical modules. This material forms a silicone network with excellent heat resistance, flexibility, and electrical insulation based on a siloxane backbone, achieving high adhesion strength and dimensional stability through heat curing. Since it does not generate by-products during curing, the risk of gas corrosion and void formation is low even in sealed structures and around electronic components, making it suitable for applications requiring long-term reliability. A major feature of TSE322S is its interface formation technology that does not require a primer. The formulation design is less dependent on the polarity and surface energy of the substrate surface, allowing it to exhibit a chemical and physical composite adhesion mechanism to metals such as aluminum, copper, and stainless steel, engineering plastics such as PPS, PBT, and epoxy, as well as inorganic materials like glass and ceramics. This ensures high adhesion stability even in complex module structures that combine dissimilar materials. For more details, please check our website.
Controlling the bubbles changes the quality.
- Other polymer materials
Added silicone adhesive and sealant "TSE382" to AD-Chemi.
Momentive's "TSE382" is a one-component, oxime-based condensation RTV (Room Temperature Vulcanizing) silicone that reacts with moisture in the air to promote crosslinking reactions. In its uncured state, it is a low-viscosity paste, and after curing, it becomes an elastic rubber that forms a highly crosslinked siloxane network structure. Since it employs an oxime-based condensation reaction, it is a "neutral curing type" that does not release corrosive by-products such as acetic acid during the curing process. It exhibits high adhesion strength to aluminum, stainless steel, zinc die-cast, and various engineering plastics (such as ABS, PC, PBT, epoxy, etc.) without the need for surface treatment. In particular, due to the flexibility of the siloxane chains and their low surface energy, it spreads and wets the fine irregularities of the substrate surface, demonstrating a cohesive failure type of adhesion mode with high interfacial adhesion. For more details, please visit our website.
We will introduce the products that will be exhibited at the 39th Nepcon Japan from January 22 to January 24 (Tokyo Big Sight).
- Engineering Plastics
- Other polymer materials
- plastic
Exhibited at the 40th NePCON Japan from January 21 to January 23 (Tokyo Big Sight).
Nepcon Japan is an electronics development and assembly exhibition that showcases electronic components and materials, as well as manufacturing, assembly, and inspection equipment that support the multifunctionality and high performance of electronic devices.
Stretchable conductive material with conductivity imparted to acrylic elastomer.
- Other polymer materials
Stretchable conductive material with conductivity imparted to acrylic elastomer.
- Other polymer materials
For automotive cooling systems. This epoxy resin is ideal for heat dissipation and insulation sealing.
- Other polymer materials
- Other consumables
For heat dissipation and insulation sealing of semiconductor devices. Excellent workability with quick curing and low viscosity.
- Other polymer materials
- Other consumables
It is a flexible acrylic polymer with a low Tg.
- Other polymer materials
Flame retardant, high thermal conductivity, and flexible epoxy resin.
- Other consumables
- Other polymer materials
It is a spherical phenolic resin with good fluidity and high filling capability.
- Other polymer materials
- plastic
It is a solid resol-type phenolic resin with ultra-low odor.
- Other polymer materials
It can be widely used from general silica sand to special sand.
- Other polymer materials
![[Free Sample] Spherical Phenolic Re...](https://image.mono.ipros.com/public/product/image/20d/2000198386/IPROS99381331689845693551.jpeg?w=280&h=280){kind=small}
Free sample provision available! Controllable particle size! It is also possible to obtain spherical carbides from a high fixed carbon content!
- Other polymer materials
- plastic
![[Applications Wanted!] Spherical Ph...](https://image.mono.ipros.com/public/product/image/809/2000279204/IPROS8375492184728129058.jpg?w=280&h=280){kind=small}
Particle size control is possible from 5μm to 500μm! It is also possible to obtain spherical carbides from a high fixed carbon content!
- Other polymer materials
- plastic
Maintaining the properties of phenolic resin! Achieving carbon neutrality through natural resources.
- Other polymer materials
High moisture absorption suppression, anti-agglomeration, and anti-blocking properties! Introducing a resin that reduces ammonia generation by about 1/20.
- Other polymer materials
No hardener required for heat curing! It has low moisture absorption and excellent anti-blocking properties.
- Other polymer materials
Tacky fire with excellent compatibility with rubber and metal adhesion. Suitable for automotive tires, footwear, and insulation tubes for electric wires.
- Other polymer materials
Case studies of powder resol for electrical insulation materials: It is heat and chemical resistant, and once cured, it does not deform, making it suitable for precision insulation boards and molded p...
- Other polymer materials
For hot melt adhesives! Achieve high initial tack and heat resistance with rosin-modified xylene resin 'Lignol R-70/R-140'.
- Other polymer materials
"Rignol R-70/R-140" is a high-performance rosin-modified xylene resin that improves flexibility, tackiness, and weather resistance in rubber modification.
- Other polymer materials
"Rignol R-70/R-140" is a rosin-modified xylene resin that enhances the adhesion of can inner surface sealants while providing both heat resistance and chemical resistance.
- Other polymer materials
Active in automotive parts such as separators for fuel cells. Excellent heat resistance. Supports small lot production.
- Composite Materials
- Other polymer materials
It is a material in which carbon fibers are coated and granulated with phenolic resin using a special method.
- fiber
- Composite Materials
- Other polymer materials
By having a high fixed carbon content and performing firing and heat treatment, spherical carbides can be obtained.
- Other polymer materials
- plastic
An innovation that significantly changes the image of plastic.
- Other polymer materials
- gear
- plastic
Harness the power of resin for disc roller protection! "Rignite Under Roller"
- Rubber
- Other polymer materials
By controlling the porosity, we can accommodate particle size control from 5 to 750 μm! We will meet your needs from particle size control to small lots.
- Other polymer materials
- plastic
By spherizing conventional phenolic resins using a special method, we achieve improved fluidity while maintaining equivalent performance, allowing for high filling capacity!
- Other polymer materials
- plastic