List of Wafer products
- classification:Wafer
91~135 item / All 290 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
We provide blanket films and patterned wafers for material and device evaluation.
- Wafer
Superior lubrication and cooling performance, high grinding efficiency, excellent surface treatment quality, better finishing, easy to use.
- Rust Inhibitor
- Grinding Machine
- Wafer
Ideal for handling and cleaning semiconductor wafers and substrates.
- Wafer
The world's first cooling water composite treatment agent formulated with "non-chlorine inorganic sterilizing components" developed through Organo's unique manufacturing technology.
- Wafer
We will handle mass production testing (CP test / FINAL test) and test development (test programs, boards).
- Wafer
We will handle mass production testing (CP test / FINAL test) and test development (test programs, boards).
- Wafer
Numerous achievements: Various wafer processing options are available. From bare die shipment to package assembly, you can also choose the shipping method.
- Wafer
We will accommodate various stud bump processing according to your specifications.
- Wafer
Supports high-difficulty processing of hard materials! Dicing processing of fragile chips like Low-k wafers can be done without damage.
- Wafer
Utilized in many products around us! An introduction to the manufacturing processes and applications of semiconductors.
- Wafer
We will be exhibiting at 'SEMICON JAPAN' held at Tokyo Big Sight (East Exhibition Hall) from December 13 (Wednesday) to 15 (Friday), 2023!
- Wafer
With a commitment to high quality and short delivery times, we will expand our business to meet the diverse needs of our customers!
- Wafer
- Other semiconductors
Achieving high-aspect-ratio trench pattern wafers with deep etching technology.
- Wafer
Full cut and step cut compatible with dual spindle! Processing track record for wafer thickness of 725 to 100 μm and chip sizes of 0.5 mm or less!
- Wafer
In the state of the sheet after dicing, it cannot be picked up by the device, and we want to change to tray specifications; we can accommodate even just with die sorting according to the application!
- Wafer
It has the characteristic of small output fluctuations due to temperature, making it possible to expand into various fields! Custom manufacturing is also available.
- Wafer
Prevention of damage from shock and vibration!!
- Wafer
sakase topics No.62
Introduction to the upcoming exhibition We will be exhibiting at the "MEMS Sensing & Network Systems Exhibition" held at Makuhari Messe from October 17 to 19! At the Sakase booth, we will showcase products that can be used as "research and development/production process support tools" for sensors and next-generation MEMS (IoT, AI, automotive, medical), including: - Transport boxes and cases for sensors and MEMS - Transport jigs for inter-process handling If you are nearby, please stop by our booth. Testing with actual products is possible, so take this opportunity to try out any samples you would like to test. For more details, please refer to the attached "Sakase Topics September issue."
Due to the dry process, no water is used, making it environmentally friendly. Achieves increased productivity with zero car floss. Compared to conventional methods, it reduces the footprint.
- Wafer
- LCD display
- Fine Ceramics
Due to the dry process, no water is used, making it environmentally friendly. Achieves increased productivity with zero car flows. Compared to conventional methods, it has a smaller footprint.
- Wafer
- LCD display
- Fine Ceramics
Leave the semiconductor silicon wafers to us.
- Processing Contract
- Wafer
The system features modular design! It can accommodate long-term changes according to technology and productivity.
- Wafer
Low cost and high productivity! With modular design, the equipment can be configured to meet customer requirements.
- Other electronic parts
- Wafer
The laser head and controller are integrated. There is also a water-cooled model.
- Laser marker
- Wafer
- Secondary Cells/Batteries
A versatile marking device equipped with the latest picosecond and femtosecond lasers.
- Wafer
- diode
- Laser marker
Proposal for semiconductor manufacturing: We offer cost-effective materials as alternatives to traditional thick epitaxy and inverted epitaxy for IC and MEMS applications.
- Wafer
Supports chips smaller than 0.3mm! Next-generation manufacturing equipment designed for the miniaturization of electronic components!
- Wafer
Achieve high productivity with high-speed pickup technology of up to 10 pcs/sec! Our unique technology ensures reliable packaging of even the smallest chips. *Customizable.
- Wafer
- Taping Machine
Adopts a mechanism that discharges exhaust upward. It picks up and transfers surrounding chips non-contact without blowing them away with the ejected gas.
- Wafer
- CVD Equipment
- Wafer processing/polishing equipment
A Bernoulli chuck for non-contact transport of ultra-thin, long workpieces measuring 1.4 mm in width and 55 mm in length.
- Wafer processing/polishing equipment
- Wafer
- Separation device
We offer custom products such as 100-200mm bonded wafers (SOI, SiSi), dielectric separation, and deep trench etching with a high aspect ratio.
- Wafer
[Demo unit available for loan] This lighting is suitable for inspecting transparent and translucent compound semiconductor wafers, defect inspection on non-transparent silicon wafer surfaces, and scra...
- LED lighting
- Work Light
- Wafer
Development of technologies for adhesion, control, and monitoring! Comprehensive support from design to manufacturing.
- Other semiconductors
- Wafer
- Other conveying machines
Providing epitaxial wafers for various optical semiconductor devices such as semiconductor lasers, VCSELs, PDs, and DBRs.
- Laser Components
- Other optical parts
- Wafer
2-inch epitaxial wafers of semiconductor lasers and RCLEDs
- Wafer
- Laser Components
Natural silica is the raw material. A new material that emits terahertz waves, applied in various fields due to its performance.
- Wafer
Ultra-high vacuum - compatible with pressurized atmospheres! A bonding system equipped with uniform heating and pressurization functions!
- Wafer
- Other machine elements
193 nm, 213 nm, 244 nm, 257 nm, 266 nm FHG generation semiconductor laser system
- Wafer
Utilizing its characteristics, it is used in various fields including optical fibers! A detailed introduction to the main types and more.
- Glass
- Wafer
Introducing products for semiconductors, such as silicon wafers and CZ/FZ ingots!
- Wafer
- Other semiconductors
Notice of Participation in 'SEMICON Japan 2022' from December 14 (Wednesday) to December 16 (Friday), 2022
Trinity Corporation will be exhibiting at SEMICON Japan 2022, held at Tokyo Big Sight. We will primarily showcase silicon wafers and ingots for semiconductors, as well as their processed products. This exhibition will focus on displaying silicon wafers and ingots for semiconductors, along with their processed products. We sincerely look forward to your visit.