List of Contract Analysis products
- classification：Contract Analysis
1021～1035 item / All 2052 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
We guarantee A2 milk, which has gained attention in recent years, through DNA analysis!
- Contract Inspection
- Contract Analysis
Detects DNA from seven types of livestock, including hamburger and sausage.
- Contract Analysis
- Contract Inspection
Analysis can be performed on samples in various conditions thanks to our unique preprocessing technology!
- Other Testing Contract
- Contract Analysis
Specification verification and failure analysis through reliability testing.
Our company conducts consistent analysis from reliability testing to failure analysis. This allows us to confirm whether the samples meet the specifications, as well as to identify and observe the defective areas of failed samples. We propose and implement tests and analyses tailored to our customers' requests and objectives, assisting from cause investigation to problem resolution. Please feel free to contact us when you need our services. 【Analysis Flow】 ■ Specification confirmation of semiconductor devices through reliability testing ■ Identification of defective areas and observation of failure locations using TEM ・ Identification of defective areas through EMS/OBIRCH analysis ・ Observation of failure locations using TEM
The reason why it broke, such as plastic or metal, is left on the fracture surface.
- Contract Analysis
- Contract measurement
- Contract Inspection
If the surface of the gold-plated terminals of connectors, etc., has discolored or has foreign substances attached, there is a possibility that the gold plating is corroded.
- Other contract services
- Contract Analysis
- Contract Inspection
Same-day report at the shortest! The lowest price in the industry! For asbestos analysis, choose Vester!!
- Contract Analysis
This is a list of devices used for analysis, evaluation, and testing services at AITES.
- Contract Analysis
Reverse bias test of power devices (up to 2000V)
At Aites Co., Ltd., high-temperature reverse bias testing (HTRB) for evaluating the oxide film and junction of power devices can be applied up to a maximum of 2000V. By monitoring the leakage current during the test, the degradation status of the device can be grasped in real-time. Since the power supply is independent, if one device fails during the test, it will not affect the other devices. Additionally, it is possible to set a failure criterion (current value) and to cut off the power supply to the device deemed faulty at the time of failure judgment. 【Specifications and Service Details】 ■ Test Voltage: Up to a maximum of DC 2000V ■ Applied Current: Up to a maximum of 14mA ■ Number of Test Devices: Up to a maximum of 8 (independent power supply) ■ Compatible Modules: TO-247, TO-220, etc. (other packages require consultation regarding connection methods) ■ Measurement Content: Monitoring of leakage current ■ Temperature Range: Up to a maximum of 200°C (85°C/85% in high temperature and high humidity conditions)
TEM (Transmission Electron Microscope) meets a wide range of requirements for observing failure sites of electronic components, length measurements, elemental analysis, crystal structure analysis, and...
- Contract Analysis
- Other semiconductors
- Other contract services
Announcement of the introduction of Talos F200E
Our company will introduce the FEI "Talos F200E" transmission electron microscope system. Compared to conventional models, the resolution for TEM and STEM has improved, and performance has been significantly enhanced, allowing for EDS analysis with four detectors. Additionally, it is equipped with features such as drift-corrected frame integration (DCFI), which accumulates multiple frames while correcting for drift.
Sample 1, including comparison with Ref! Summarize and conduct candidate analytical methods.
- Contract Analysis
Analysis of organic-inorganic composite materials using FT-IR and EDX.
We will introduce an example of analyzing organic-inorganic composite materials using FT-IR and SEM-EDX. FT-IR measurements were conducted on the glossy and non-glossy areas of a PET bottle label, and the IR spectra differed between the glossy and non-glossy areas. Since the non-glossy area resembles the spectrum of acrylic resin, it is considered that the main component is acrylic resin. Additionally, SEM-EDX measurements were performed on both the glossy and non-glossy areas, and EDX spectra and backscattered electron images were obtained, revealing that the non-glossy area contained sulfur (S) and barium (Ba), which were not detected in the glossy area.
We provide quick and accurate solutions based on technology and experience for quality initiatives that consider performance, reliability, disposal, and recycling from the product planning stage.
- Contract Analysis
- Contract Inspection
- Analytical Equipment and Devices
Evaluation of various implementation substrates
At Aites Co., Ltd., we provide a wide range of technical services for evaluation tests of printed circuit boards (mounted boards) equipped with electronic components. We conduct reliability tests, solder joint observations, whisker observations, and cross-sectional observations. We have IPC-A-610 certified IPC specialists on staff who can assist with observations in accordance with international standards, consultations, and various observation-related concerns. Additionally, we offer services such as X-ray observations, appearance inspections, and shape measurements, so please feel free to consult with us when needed.
We will identify and observe the defective areas of power devices such as diodes, MOS-FETs, and IGBTs.
- Contract Analysis
- Transistor
- Analytical Equipment and Devices
Announcement of the introduction of Talos F200E
Our company will introduce the FEI "Talos F200E" transmission electron microscope system. Compared to conventional models, the resolution for TEM and STEM has improved, and performance has been significantly enhanced, allowing for EDS analysis with four detectors. Additionally, it is equipped with features such as drift-corrected frame integration (DCFI), which accumulates multiple frames while correcting for drift.
By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.
- Contract Analysis
- Other contract services
- Contract measurement
Confirmation of chiplet package structure by mechanical polishing.
Regarding the chip mounted on the main circuit board of the VR goggles manufactured by Company A, upon visual observation, it was inferred that it has a chiplet structure with multiple chips integrated. To examine the structure in more detail, we created a cross-section using X-ray CT observation and mechanical polishing, and we will introduce the structural confirmation results. *For more details, please download the PDF or feel free to contact us.*
It is possible to observe cross-sections while observing FIB processing in real time.
- Contract Analysis
- Other contract services
- Electron microscope
Power device failure location / Slice & View three-dimensional reconstruction
I will introduce the three-dimensional reconstruction of failure locations using the Slice & View function of FIB-SEM. Continuous SEM images of the structure are obtained, and the resulting images are corrected for positional misalignment between the SEM images and visualized in three dimensions using 3D construction software (Avizo). By combining the position identification technique for cross-sectioning the failure location with the Slice & View function, it is possible to obtain continuous SEM images that retain the defective state and include information before and after the abnormal area.
If it is 5 micrometers or larger, foreign object IR data can be obtained.
- Contract Analysis
- Analytical Equipment and Devices
- Other contract services
Micro FT-IR imaging measurement
We would like to introduce the "Microscopic FT-IR Imaging Measurement" that we conduct. It allows for the visualization of the distribution of substances as a two-dimensional image within a specified plane. It becomes possible to evaluate changes in the distribution of substances that are difficult to assess with regular point measurements through visual images.
We will report rapid analysis results using various sampling techniques regarding foreign substances that significantly impact the yield of electronics products.
- Contract Analysis
- Analytical Equipment and Devices
- Other contract services
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.