List of Other semiconductors products
- classification:Other semiconductors
991~1035 item / All 2686 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
It is the 'Smart LCDC', an LCD controller that is easy to understand and use, capable of displaying on an LCD via RS-232C.
- Other semiconductors
Standard type aluminum extruded heat sink with a width of 200mm and a height of 70mm.
- Other semiconductors
Clip-type heat sink that can be attached to TO-218 package transistors without screws.
- Other semiconductors
Width 35mm Height 30mm Heat sink for transistor clip
- Other semiconductors
We perform high-precision mass bonding of bare chips to flexible printed circuit boards (FPC). We can provide integrated support from film design and procurement to assembly and reel shipment.
- Other semiconductors
A clip that can fix two TO-220 and TO-247 series packages to a heat sink.
- Other semiconductors
Spring for fixing TO-220 package semiconductors to a heat sink.
- Other semiconductors
Raman spectroscopy, compact and high-performance laser suitable for interference applications! Single-frequency oscillation compact LD module.
- Other semiconductors
Adopted by global semiconductor manufacturers! Width 16.8mm, Height 26mm, heat sink for transistor clips.
- Other semiconductors
Faithfully reproducing the products that customers want to create. Responding to the diverse needs of the electronics industry.
- Processing Contract
- Wafer
- Other semiconductors
Standard type aluminum extruded heat sink with a width of 300mm and a height of 25mm.
- Other semiconductors
A new technology for active alignment of camera modules significantly improves the throughput of module manufacturing using 3D charts.
- Semiconductor inspection/test equipment
- Other semiconductor manufacturing equipment
- Other semiconductors
Exhibited at SEMICON Japan 2021 Hybrid.
Our company will be exhibiting at "SEMICON Japan 2021 Hybrid," which will be held at Tokyo Big Sight from December 15 (Wednesday) to December 17 (Friday), 2021. We are a semiconductor inspection equipment manufacturer headquartered in China. The company was established in 2008 in China, and we began full-scale sales activities in Japan in October 2020. This will be our first exhibition at SEMICON Japan. We look forward to your visit.
Extruded heat sink for PCB mounting with a width of 35.3mm, height of 35mm, and length of 50mm, compatible with transistor clips.
- Other semiconductors
Transistor spacer for TO-5 package 10 pins (height 1.5mm)
- Other semiconductors
Transistor spacer for TO-5 package 3 pins (height 2.5mm)
- Other semiconductors
Thermal pad for TO-5 package transistors
- Other semiconductors
Thermal pad for TO-247 and TO-218 package transistors.
- Other semiconductors
Fischer Elektronik manufactured high-performance heat sink for forced air cooling (hollow type) W200mm x H84mm
- Other semiconductors
Clip-type heatsink for TO-220 package semiconductors that can be mounted without screws.
- Other semiconductors
54mm diameter round LED heat sink
- Other semiconductors
Insulated clamp parts for TO-247 package power transistors
- Other semiconductors
Round Pin Heat Sink "ICK S R 140 x 70"
- Other semiconductors
Efficient heat dissipation is possible with a W129mm x H66mm hollow-type heat sink and axial fan.
- Other semiconductors
A clip that can securely make contact with a TO-220 package transistor and a heat sink.
- Other semiconductors
98 mm diameter x 50 mm height round pin fin heat sink (Al99.5)
- Other semiconductors
This is a black anodized heat sink for BGA with a width of 45 mm, a length of 42.5 mm, and a height of 6 mm.
- Other semiconductors
200mm diameter, 40mm height round LED heat sink
- Other semiconductors
Efficient heat dissipation is possible with a W66mm x H66mm hollow-type heat sink and an axial fan.
- Other semiconductors
Axial flow heat sink with axial flow fan for AC230V
- Other semiconductors
Heat sink for DIP IC (14, 16 contacts)
- Other semiconductors
High-performance heat sink for forced air cooling (hollow type) W400mm x H88mm, 31 fins
- Other semiconductors
With a pressing force of 55N, the transistor in the TO-220 and TO-3P packages can be reliably brought into contact with the heat sink.
- Other semiconductors
With a pressing force of 59N, it is possible to ensure that transistors in TO-248 and TO-218 packages make reliable contact with the heat sink.
- Other semiconductors
A pressing force of 20N can reliably ensure that the TO-220 package transistor makes contact with the heat sink.
- Other semiconductors
One-stop solution from design to manufacturing of power semiconductors!
- Other semiconductors
Nikkankogyo Shimbun - Award-winning products of the Excellent New Technology and New Products Award! Eliminated the need for external shielding.
- Other semiconductors
We offer semiconductor products primarily featuring Toshiba semiconductors, as well as LCDs and electronic components!
- Other semiconductors
Achieving a product pitch of ±0.03mm tailored to the specifications of the automatic assembly line! *Samples available upon request.
- Other semiconductors
Achieved a product pitch of ±0.03mm tailored to the specifications of the automatic assembly line!
- Other semiconductors
Achieves low RDS(on) to maximize the effective use of package space.
- Other semiconductors
Introducing our unique package and DioMOS technology fusion module!
- Other semiconductors
The adoption of a unique gate structure chip achieves high tolerance against lightning surges and other disturbances!
- Other semiconductors
Insulation withstand voltage 2500V! A module that uses IGBTs specialized for high-speed performance.
- Other semiconductors
Compact, high-reliability SOT-227 standard package! Direct mounting to heat sinks is possible.
- Other semiconductors
A report analyzing industry and market trends, focusing on materials and devices expanding for AI data center applications that can handle the rapidly increasing AI processing.
- Other semiconductors
- Database
- EAI/ETL/WEB application server
September 17 Webinar: "Next-Generation AI Infrastructure and Optoelectronic Integration Implementation"
■Title: "Next-Generation AI Infrastructure and Optoelectronic Fusion Implementation - Addressing Massive Information Processing, Decoding Optoelectronic Fusion -" In the context of the rapid increase in information volume due to AI and live video, this seminar explains optical fiber communication, high-speed wireless, and semiconductor technologies that support high-speed information transmission. Participants will systematically learn about the current status and challenges of "optoelectronic fusion implementation" aimed at introducing optical transmission between and within electronic devices. 【Knowledge Gained from the Seminar】 - Basics of high-speed information transmission technology and the essence of high-speed transmission - Factors influencing high-speed transmission such as transmission medium, transmission distance, and transmission loss - Transmission methods including wired/wireless, 4G/5G, Wi-Fi 6/7 - Development history of optical fiber communication, communication methods, and transceivers - Challenges in information transmission between and within electronic devices - Current status of optoelectronic signal conversion and optoelectronic fusion implementation - Basic technologies such as optical semiconductors, silicon photonics, processors, and memory 【Target Audience for the Seminar】 - Individuals interested in high-speed information transmission technology - Those dealing with large-capacity information such as AI and video - Individuals who want to learn the basics of semiconductor and transmission technology