List of Measurement and Analysis products
- classification：Measurement and Analysis
9586～9630 item / All 55280 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Ideal for micro-machining! Achieves deburring of holes and double-sided machining in one pass, which was difficult with conventional tools!
- Other machine tools
We will be exhibiting at Mecatronics Tech Japan 2021 from October 20 (Wednesday) to October 23 (Saturday)!
Our company will exhibit at "Mechatrotech Japan 2021," which will be held at Portmesse Nagoya from Wednesday, October 20 to Saturday, October 23, 2021. We will introduce our tools, including the 'Bar Off Tool' capable of chamfering and deburring from a diameter of 0.8 mm, and the 'FEM' tool breakage detection device that reliably detects breakage. We look forward to your visit. (Booth number: 2B12)
Ultrasonic microscope observation of transistors! It is possible to check the peeling conditions at various locations even with the same focus.
- Contract Analysis
- Analysis Services
- Contract Analysis
Ultrasonic microscope observation of semiconductor packages
This is an introduction to the ultrasonic microscope observation of semiconductor packages conducted by our company. Due to storage conditions and mounting conditions, delamination may occur between the metal parts (die pad) and the package resin in semiconductor packages. Delamination inside the package is a defect that significantly affects product quality, but it cannot be detected through visual inspection. By using an ultrasonic microscope, we can clearly capture the internal structure of the package, contributing to reliability evaluation.
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If it is something that ultrasonic waves can penetrate, you can check internal information that cannot be confirmed from the appearance!
- Contract Analysis
- Analysis Services
- Contract Analysis
Observation of adhesive conditions through a metal plate using an ultrasonic microscope.
Here is an introduction to a case where the adhesive condition was observed through a metal plate using an ultrasonic microscope. The ultrasonic microscope can reveal internal information that cannot be confirmed from the appearance, as long as the ultrasonic waves can pass through the material. After reliability testing, we observed the condition of the adhesive remaining on the metal plate from the metal side in a sample where the chip had come off. Please refer to the PDF document for details and results of the observations.
[Web demo in progress] Measurement procedure is a simple 4-step process that allows for PIV (velocity distribution measurement).
- Other embedded systems (software and hardware)
- Fluid analysis contract
- Spectroscopic Analysis Equipment
Biodegradable testing equipment that contributes to food quality preservation.
- Testing Equipment and Devices
Measuring the biodegradability of packaging materials such as bioplastics.
- Testing Equipment and Devices
We measure the biodegradability of wood and promote its sustainable use.
- Testing Equipment and Devices
[Product introduction video now available] We evaluate the biodegradability of fishing gear and contribute to reducing environmental impact.
- Testing Equipment and Devices
Measure the biodegradability of cosmetic ingredients and consider the environment.
- Testing Equipment and Devices
Measuring the biodegradability of a wide range of materials, including bioplastics.
- Testing Equipment and Devices
We measure the biodegradability of soil amendments to support sustainable agriculture.
- Testing Equipment and Devices
Measuring the biodegradability of a wide range of materials, including bioplastics.
- Testing Equipment and Devices
Measuring the biodegradability of coatings to support sustainable product development.
- Testing Equipment and Devices
Testing equipment for measuring the biodegradability of bioplastics and other materials.
- Testing Equipment and Devices
Improve the layering accuracy of 3D printers! Easy measurement with digital display.
- Distance measuring device
Digitize the alignment of printed materials! Improve work efficiency and accuracy.
- Distance measuring device
Digitalizing thread feed measurement! Contributing to improved productivity and stable quality.
- Distance measuring device
Supports precise operation of medical devices. Achieves accurate position measurement without contact.
- Distance measuring device
Contributing to the efficiency of packaging engineering! Achieving accurate sealing with digital displays.
- Distance measuring device
Contributing to the improvement of precision in food filling engineering! Non-contact, hygienic, and digital display.
- Distance measuring device
Digitalizing thread feeding measurement! Contributing to improved productivity and stable quality.
- Distance measuring device
Digitize the alignment of printed materials! Improve work efficiency and accuracy.
- Distance measuring device
Improving the layer accuracy of 3D printers! Achieving precise position measurement without contact.
- Distance measuring device
Digitizing measurement tasks! Improving efficiency with a linear encoder with a display.
- Distance measuring device
You can achieve diverse inspection requirements for various tasks by combining different functions!
- Other image-related equipment
- Visual Inspection Equipment
Simultaneous inspection of front and back possible! A wafer and chip appearance inspection machine that can perform both macro and micro inspections with one unit. Suitable for LED and semiconductor c...
- Visual Inspection Equipment
Notice of Participation in SEMICON Japan 2018 (December 12-14, 2018)
Hubbrain Inc. will be exhibiting at SEMICON Japan 2018, which will be held at Tokyo Big Sight from December 12 (Wednesday) to 14 (Friday). This exhibition is an international trade show for the electronics manufacturing supply chain, covering all processes from the front-end to the back-end of semiconductor manufacturing, as well as SMART applications such as automotive and IoT devices. We will be showcasing compact inspection machines that enable diverse inspections with simple settings, as well as inspection equipment that utilizes a 2-megapixel color camera. <Exhibited Products> ■ Free-Angle Appearance Inspection Machine ■ Upper-Type Simple Inspection Machine ■ Wafer and Chip Appearance Inspection Equipment, etc. <Booth Number> ■ East 2 #2332 We sincerely look forward to your visit.
Achieving a high-speed, high-resolution 3D inspection system!
- Image Processing Equipment
- 3D measuring device
- Visual Inspection Equipment
We will detect black dots and stains on a continuously flowing plain sheet using image inspection!
- Visual Inspection Equipment
- Other image-related equipment
Introduction of case studies! Specializing in simulations of low-pressure plasma or low-temperature plasma.
- Other analyses
- Magnetic field analysis/electromagnetic wave analysis
- Contract Analysis
Pellet and powder foreign matter inspection device *Compatible with clean rooms and can be installed in factories, capable of detecting 9µm!
- Visual Inspection Equipment
- Semiconductor inspection/test equipment
It is possible to inspect appearance defects occurring in the wafer process and dicing process quickly and with high precision.
- Semiconductor inspection/test equipment
- Visual Inspection Equipment
Green Sheet Appearance Inspection Machine - Parallel Processing Type
- Image Processing Board
- Visual Inspection Equipment
Ideal for large volume work counting! High-speed, high-precision counting machine with space-saving design.
- Counting Machine
- counter
Detect foreign substances and discoloration in pellets and powders with our independently developed inspection mechanism!
- Visual Inspection Equipment
- Semiconductor inspection/test equipment
For inspecting electronic components like SMDs! It is possible to inspect individually for products that cannot use a parts feeder!
- Image Processing Equipment
- Visual Inspection Equipment
Newly developed! Capable of detecting fine scratches and surface defects on six sides (front and back + four sides) as well as measuring dimensions!
- Image Processing Equipment
- Visual Inspection Equipment
Detecting foreign substances and discoloration in pellets and powders with our independently developed inspection mechanism!
- Visual Inspection Equipment
- Semiconductor inspection/test equipment
Thanks to our unique technology, we can cancel out polycrystalline patterns and detect fine defects!
- Visual Inspection Equipment
- Semiconductor inspection/test equipment
A group of engineers full of personality! We are always striving for a higher level of engineering expertise.
- Visual Inspection Equipment
- Other image-related equipment
Tabletop robot specifications! A low-cost, high-functionality tabletop appearance inspection machine.
- Other inspection equipment and devices
- Visual Inspection Equipment
Notice of Participation in SEMICON Japan 2018 (December 12-14, 2018)
Hubbrain Inc. will be exhibiting at SEMICON Japan 2018, which will be held at Tokyo Big Sight from December 12 (Wednesday) to 14 (Friday). This exhibition is an international trade show for the electronics manufacturing supply chain, covering all processes from the front-end to the back-end of semiconductor manufacturing, as well as SMART applications such as automotive and IoT devices. We will be showcasing compact inspection machines that enable diverse inspections with simple settings, as well as inspection equipment that utilizes a 2-megapixel color camera. <Exhibited Products> ■ Free-Angle Appearance Inspection Machine ■ Upper-Type Simple Inspection Machine ■ Wafer and Chip Appearance Inspection Equipment, etc. <Booth Number> ■ East 2 #2332 We sincerely look forward to your visit.
Equipped with a 2-axis rotating robot! An appearance inspection device close to visual inspection is realized at a low price!
- Visual Inspection Equipment
- Other inspection equipment and devices
Notice of Participation in SEMICON Japan 2018 (December 12-14, 2018)
Hubbrain Inc. will be exhibiting at SEMICON Japan 2018, which will be held at Tokyo Big Sight from December 12 (Wednesday) to 14 (Friday). This exhibition is an international trade show for the electronics manufacturing supply chain, covering all processes from the front-end to the back-end of semiconductor manufacturing, as well as SMART applications such as automotive and IoT devices. We will be showcasing compact inspection machines that enable diverse inspections with simple settings, as well as inspection equipment that utilizes a 2-megapixel color camera. <Exhibited Products> ■ Free-Angle Appearance Inspection Machine ■ Upper-Type Simple Inspection Machine ■ Wafer and Chip Appearance Inspection Equipment, etc. <Booth Number> ■ East 2 #2332 We sincerely look forward to your visit.
Compatible with cover glass! Image inspection equipment with numerous achievements in the smartphone and FPD industry.
- Visual Inspection Equipment
- Defect Inspection Equipment
Rose supply available!
- Other inspection equipment and devices
High-speed parts transfer machine
This device is a high-speed transfer machine that receives small electronic components and high-function modules from a supply unit, aligns and stores them in trays, and then retrieves them. It achieves high-quality component transfer and high productivity through a high-speed, high-precision transfer unit with 16 nozzles arranged in a rotary configuration.