List of Semiconductors and ICs products
- classification:Semiconductors and ICs
3241~3285 item / All 4311 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
Liquid flow controller for quantitative discharge management of acids, organic chemical solutions, and other substances.
- Other semiconductors
We provide appropriate products and services across a wide range of fields, starting with automotive equipment and industrial sectors.
- Other electronic parts
- Other semiconductors
- Contract manufacturing
A wide range of product development tailored to customer needs!
- Ceramics
- Other electronic parts
- Other semiconductors
We would like to provide information about test wafers supplied to semiconductor material manufacturers and equipment manufacturers.
- Other semiconductors
- Wafer
Basic Knowledge of Test Wafers: What is a Test Wafer?
A test wafer is a wafer used for the evaluation of devices and materials necessary for next-generation semiconductor process development. Semiconductor manufacturers are tirelessly developing new process technologies, striving to enrich people's lives. Supporting this effort are material manufacturers and semiconductor equipment manufacturers, who conduct experiments and research daily to develop next-generation technologies. In this process, data collection using actual wafers is essential to improve the uniformity of processes on the wafer. Our company manufactures and sells test wafers for next-generation semiconductor development in a "custom-made" format that meets our customers' needs. Among the test wafers, we supply wafers that incorporate advanced technologies necessary for research and development in film formation, CMP, cleaning, etching, and TSV.
Semiconductor device fixed fixture
- Other semiconductors
By using a copper core ball, deformation of the ball is minimized, enabling 3D implementation and narrow pitch implementation.
- Other semiconductors
- Prototype Services
- Memory
Supports ELO (epitaxial lateral overgrowth) as well!
- Wafer
- Wafer processing/polishing equipment
- Piezoelectric Devices
Semiconductor device fixed fixture
- Other semiconductors
A new and flexible IGBT platform for high-power applications.
- Other electronic parts
- Other semiconductors
Start accepting orders for reverse current prevention diode module (3000V withstand voltage).
- diode
600V High Voltage Super Junction MOSFET
- Other electronic parts
- Other semiconductors
High-efficiency, high-voltage GaN switch reduces the effort and time required for research and development.
- Other semiconductors
High-efficiency Gallium Nitride (GaN) HEMT optimal for switching power supplies (SMPS)
- Other electronic parts
- Other semiconductors
Semiconductor device timer mounting bracket
- Other semiconductors
Bubbles-free application possible! Non-contact type for patterned surfaces can also be produced.
- Wafer
- Wafer processing/polishing equipment
Adopts motor drive! Dust-free and suitable for clean rooms.
- Wafer
- Wafer processing/polishing equipment
Analysis of the expanding COF market for OLED/smartphones, including an analysis of new Chinese manufacturers entering the market.
- Organic EL
- LCD display
- Dedicated IC
Due to the high joining temperature, it is suitable for air cooling applications! Thermal interface materials (TIM) are also available.
- Other electronic parts
- Other semiconductors
microSD card compatible ultra-fast programming & ultra-fast FPGA configuration module
- ASIC
- Memory
Achieving 10Gbps UDP communication functionality with pure hardware logic without CPU!
- ASIC
High-performance, high-reliability IP core proven by NASA (National Aeronautics and Space Administration).
- ASIC
M.2-FMC conversion adapter board compatible with Intel/Xilinx FPGA evaluation boards. Supports connection of up to 2 M.2 NVMe SSDs.
- ASIC
- Board to Board Connectors
Thickness from 0.1mm to 3.0mm, can be cut up to 8 inches in size!
- Processing Contract
- Circuit board design and manufacturing
- Other semiconductors
It is possible to achieve several times the speed and sensitivity of conventional technologies from other companies. Our unique structure allows us to form electromagnetic shielding on the photodiode.
- Other semiconductors
- Other measurement, recording and measuring instruments
We will transform into a trading company that proposes total solutions.
- Other electronic parts
- Other semiconductors
- Circuit board design and manufacturing
Achieving 40 times speed 10GbE TCP/IP communication functionality with pure hardware logic without CPU!
- ASIC
Meeting the demands for higher flatness, damage-free, and free from heavy metal contamination with a complete mirror finish!
- Other semiconductors
- others
15 years of trust and experience in memory module production. Production capacity is 340,000 units per month.
- Other semiconductors
- Contract manufacturing
- Memory
From one piece to mass production, we respond with short lead times! Feel free to leave special modifications (jumpers) to us!
- Other semiconductors
- Contract manufacturing
- Circuit board design and manufacturing
MCP combining LPDDR2 and Flash! For compacting ECU systems.
- Other semiconductors
- Other electronic parts
It is possible to grasp 6-inch and 8-inch wafers with the same non-contact tweezers.
- Wafer
- Etching Equipment
- Industrial Furnace
Back grinding protective tape for semiconductor wafers
- Wafer
- Other polymer materials
- Adhesive tape
Tape (UV-curable) for protecting and securing wafers during the semiconductor dicing process.
- Wafer
- Other polymer materials
- Adhesive tape
Leave it to us for labor-saving devices.
- Other semiconductor manufacturing equipment
- Other semiconductors
- Contract manufacturing