List of Wafer processing/polishing equipment products
- classification：Wafer processing/polishing equipment
586～630 item / All 994 items
Heat resistant up to 1200℃. We will custom-make high-performance insulation covers that ensure safety in the working environment!
- Glass
One-stop service from repair to polishing! Polishing that makes it impossible to distinguish the repaired areas.
- Wafer processing/polishing equipment
- Processing Contract
- Other contract services
We polish everything from small items like chopstick rests to artificial bones used in medical applications!
- Wafer processing/polishing equipment
- Processing Contract
- Other contract services
Space-saving! No power supply needed, only two types of consumable parts! It is possible to reduce costs.
- Wafer processing/polishing equipment
- Other processing machines
Flawless mirror finish! Achieving Ra < 0.005μm with dedicated media.
- Wafer processing/polishing equipment
- Other processing machines
Achieve fast and clean finishes on all types of materials! A honing machine that enables stable processing.
- Wafer processing/polishing equipment
- Other machine tools
- Other processing machines
Supporting design and manufacturing from high-precision machining centers to CAD/CAM!
- Other machine tools
- Machining Center
- Wafer processing/polishing equipment
![[NC Lathe] Capable of processing di...](https://image.mono.ipros.com/public/product/image/4b8/2000554199/IPROS03465314320658038562.jpeg?w=280&h=280){kind=small}
The machining accuracy is partially achieved at 0.02 to 0.05! Additionally, we have 6 NC lathes and 3 robots. Please consult us for NC lathe machining!
- lathe
- Wafer processing/polishing equipment
- Processing Contract
It grips a micro 2.0mm IC wafer chip non-contact.
- Other industrial robots
- Wafer processing/polishing equipment
- Wafer
Achieve ultra-short grinding times! We offer horizontal centrifugal barrels and vertical centrifugal barrels.
- Wafer processing/polishing equipment
- Other abrasives
- Other processing machines
The vibrations and recoil during operation are minimal, allowing for a uniform and vivid polished surface.
- Other machine elements
- Wafer processing/polishing equipment
- Other processing machines
The dimensions of the height and width of processed stone can be easily set using a diagonal two-point setting method on a fully automatic side grinding machine.
- Other machine elements
- Wafer processing/polishing equipment
- Other processing machines
Compact and rechargeable! Introducing a polisher with excellent workability that makes a difference in polishing!
- Power tools
- Hand polishing and filing
- Wafer processing/polishing equipment
An automatic chip regrinding machine with improved safety and workability for shutter opening and closing!
- Wafer processing/polishing equipment
Supports φ10 to φ80 and up to 350L! This is the process performed after lathe machining to improve the outer diameter dimensions and surface roughness.
- Processing Contract
- others
- Wafer processing/polishing equipment
I want to polish like this. Please feel free to consult us about outer diameter polishing, inner diameter polishing, end face polishing, and more.
- Wafer processing/polishing equipment
- Surface treatment contract service
- Processing Contract
Introducing examples of processing rubber rolls made from general-purpose rubber as an alternative to whetstone grinding!
- Wafer processing/polishing equipment
- Surface treatment contract service
- Processing Contract
Introducing a case where processing time has been reduced to less than 1/4 as a substitute for whetstone grinding!
- Wafer processing/polishing equipment
- Surface treatment contract service
- Processing Contract
Introducing a case study of a machined tool holder for SCM415 as an alternative to whetstone grinding!
- Wafer processing/polishing equipment
- Surface treatment contract service
- Processing Contract
Introducing a processing example using a super finisher that achieved a measurement result of Ra0.035μm, replacing whetstone grinding!
- Wafer processing/polishing equipment
- Surface treatment contract service
- Processing Contract
Flexible multi-stage, diverse, high-efficiency polishing of cylindrical shapes! Film cylindrical super finishing machine with lift and carry transport device included.
- Wafer processing/polishing equipment
The world of ultra-fine polishing of the difficult inner surfaces and end faces of cylinders has expanded thanks to the internal unit!
- Wafer processing/polishing equipment
Achieving ultra-fine finishing grinding of the outer diameter in recessed areas of the workpiece using a 3D motion W-cross guide method!
- Wafer processing/polishing equipment
Film polishing always uses a method of continuously feeding in new film! It flexibly accommodates a variety of roll materials!
- Wafer processing/polishing equipment
Powerful performance when mounted on compact general-purpose machines! Unit-type super finisher.
- Wafer processing/polishing equipment
Introduction of a film super finishing device with backup roller diameter and width of φ58×50mm!
- Grinding Machine
- Wafer processing/polishing equipment
Introduction of a film super finishing device with backup roller diameter and width of φ58×100mm!
- Grinding Machine
- Wafer processing/polishing equipment
A 2-way machine for the final polishing process with excellent cost performance.
- Wafer processing/polishing equipment
No nests, achieving uniform organization and hardness, can be produced from 3B to 32B!
- Wafer processing/polishing equipment
Scan speed increased! Conventional alignment speed improved by over 3 seconds! Furthermore, low prices achieved for Si wafers only! [Free demo available now]
- Wafer processing/polishing equipment
Stable support for the vibration unit! The replacement of the buff can be easily carried out by one person.
- Wafer processing/polishing equipment
Introducing a versatile barrel polishing machine that meets various needs at a low cost.
- Wafer processing/polishing equipment
- Other abrasives
- Other processing machines
Ideal for deburring and smoothing finishes of small to large parts! The layout of auxiliary equipment is easy to arrange.
- Wafer processing/polishing equipment
- Other abrasives
- Other processing machines
A fulfilling lineup! Ideal for removing burrs and edges from workpieces, as well as for R-attachment and heavy cutting to finishing processes.
- Wafer processing/polishing equipment
- Other abrasives
- Other processing machines
Deburring with polishing stones for a glossy finish! Achieves a high level of finish without dents.
- Wafer processing/polishing equipment
Stable and uniform processing is possible! Supports everything from fine burr removal to cleaning!
- Wafer processing/polishing equipment
Stable pressure flow (patented) maximizes the power of the media!
- Wafer processing/polishing equipment
We will exhibit at the Kansai Mechanical Components Exhibition [Hall 3, Booth 12-1].
Kawashin Co., Ltd. will be exhibiting at the "Kansai Machine Elements Technology Exhibition" from October 7 (Wednesday) to October 9 (Friday). 【Exhibition Booth Location】 12-1 (Hall 3) 【Exhibition Contents】 - Multi-chamber hydrocarbon cleaning and drying machine - Hydrocarbon cleaning agents - Mirror finish processing blast equipment - Mirror finish processing barrel media "23rd Kansai Machine Elements Technology Exhibition" ______________________ <Organizer> Reed Exhibitions Japan Ltd. <Date> October 7 (Wednesday) to October 9 (Friday) <Venue> Intex Osaka https://www.japan-mfg-kansai.jp/ja-jp/about/mtech.html ____________________________________________________ We are taking sufficient infection control measures to ensure a safe experience. We look forward to your visit. Online consultations are also available. https://www.japan-mfg-kansai.jp/ja-jp/contents/online_kansai.html
The new concept of "tornado suction" completely overturns the conventional wisdom of blast processing!
- Wafer processing/polishing equipment
Reduction of electricity consumption and CO2 emissions! Blower blast capable of using a wide range of abrasives.
- Wafer processing/polishing equipment
Overwhelming ease of management compared to whetstone grinding! With condition settings, anyone can achieve the same finish.
- Other abrasives
- Wafer processing/polishing equipment
We will respond as your manufacturing partner with a one-stop (integrated production system) approach!
- Contract manufacturing
- Semiconductor inspection/test equipment
- Wafer processing/polishing equipment
Notice of Participation in Internepcon Japan 2021 Electronics Manufacturing and Assembly Exhibition
We will be exhibiting at "NEPCON Japan," where the latest manufacturing and implementation technologies that support the multifunctionality and high performance of electronic devices come together. "NEPCON Japan" has established itself as a venue for business negotiations with domestic and international manufacturers of electronic devices, semiconductors, electronic components, and automotive and electrical equipment. If you are facing various challenges such as complicated outsourcing management or improving equipment utilization rates, please stop by our booth. We will propose the optimal plan tailored to your situation. 【Booth Number: W1-54】 ● NEPCON Official Site: https://www.nepcon.jp/ja-jp.html ● NEPCON Company Site: https://jan2021.tems-system.com/exhiSearch/INW/jp/Details?id=%2FUqXsOFXpWM%3D&type=2&rel=undefinedl If you need an invitation ticket, please request the necessary number by writing to us through the "Contact" section. We look forward to your visit as we prepare new proposals.
Ensuring and maintaining productivity! We introduce economical, compact, and highly reliable products.
- Wafer processing/polishing equipment
- Other measurement, recording and measuring instruments
Realization of mechanization for the fitting work of hydraulic pumps.
- Wafer processing/polishing equipment
Are you having trouble with workpiece polishing? High-speed and high-pressure wrapping of difficult-to-cut materials with high precision!
- Wafer processing/polishing equipment
We will be exhibiting at "SEMICON JAPAN 2019."
Nihon Engis will be exhibiting at "SEMICON JAPAN 2019," which will be held from December 11 (Wednesday) to December 13 (Friday) at Tokyo Big Sight (Tokyo International Exhibition Center). At this exhibition, we will showcase our flagship product, the new model of our wrapping device, the "High-Speed & High-Pressure Polisher EJW-400HSP." We would be grateful if you could take a look at a part of our technological capabilities. On the day of the event, we will also be accepting inquiries about polishing (mainly flat polishing), so we would be happy if you could visit our booth. We sincerely look forward to welcoming many of you.