List of Other semiconductors products
- classification：Other semiconductors
631～675 item / All 2423 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
200mm diameter, 40mm height round LED heat sink
- Other semiconductors
Efficient heat dissipation is possible with a W66mm x H66mm hollow-type heat sink and an axial fan.
- Other semiconductors
Axial flow heat sink with axial flow fan for AC230V
- Other semiconductors
Heat sink for DIP IC (14, 16 contacts)
- Other semiconductors
High-performance heat sink for forced air cooling (hollow type) W400mm x H88mm, 31 fins
- Other semiconductors
With a pressing force of 55N, the transistor in the TO-220 and TO-3P packages can be reliably brought into contact with the heat sink.
- Other semiconductors
With a pressing force of 59N, it is possible to ensure that transistors in TO-248 and TO-218 packages make reliable contact with the heat sink.
- Other semiconductors
A pressing force of 20N can reliably ensure that the TO-220 package transistor makes contact with the heat sink.
- Other semiconductors
One-stop solution from design to manufacturing of power semiconductors!
- Other semiconductors
Nikkankogyo Shimbun - Award-winning products of the Excellent New Technology and New Products Award! Eliminated the need for external shielding.
- Other semiconductors
You can download and view the latest flyers and catalog data distributed at the exhibition held in November 2024!
- Memory
- Other semiconductors
We offer semiconductor products primarily featuring Toshiba semiconductors, as well as LCDs and electronic components!
- Other semiconductors
Achieving a product pitch of ±0.03mm tailored to the specifications of the automatic assembly line! *Samples available upon request.
- Other semiconductors
Achieved a product pitch of ±0.03mm tailored to the specifications of the automatic assembly line!
- Other semiconductors
Achieves low RDS(on) to maximize the effective use of package space.
- Other semiconductors
Introducing our unique package and DioMOS technology fusion module!
- Other semiconductors
The adoption of a unique gate structure chip achieves high tolerance against lightning surges and other disturbances!
- Other semiconductors
Insulation withstand voltage 2500V! A module that uses IGBTs specialized for high-speed performance.
- Other semiconductors
Compact, high-reliability SOT-227 standard package! Direct mounting to heat sinks is possible.
- Other semiconductors
A report analyzing industry and market trends, focusing on materials and devices expanding for AI data center applications that can handle the rapidly increasing AI processing.
- Other semiconductors
- Database
- EAI/ETL/WEB application server
A new style heat sink with lower thermal resistance than the popular FK244 series.
- Other semiconductors
By directly soldering SMT power devices to the circuit board, a heat dissipation effect can be achieved.
- Other semiconductors
Here is an amazing thermal solution with exceptionally excellent thermal conductivity in the thickness direction of the TIM sheet!
- Composite Materials
- Other semiconductors
- Generators and transmission motors
We will exhibit at the 2nd Power Device & Module EXPO!
We will be exhibiting at the 39th NePCON Japan (2nd Power Device & Module EXPO). We propose the vertically oriented high thermal conductivity TIM "Zebro." Just applying pressure (surface pressure) brings astonishing thermal management! It has high durability and does not suffer from characteristic degradation due to pump-out or dry-out phenomena. It can be used for a long time with stable low thermal resistance, making it a highly reliable heat dissipation material. For those looking for TIM with good thermal conductivity, or for those struggling with insufficient cooling from conventional heat dissipation materials, we provide thermal management solutions tailored to your needs. We sincerely look forward to your visit!
Heat sink for PCB mounting, 35.3 mm wide x 35 mm high.
- Other semiconductors
Pursuing extremes with rich achievements and advanced technology! Establishing a processing capability system positioned among the world's top class.
- Other semiconductors
- Wafer processing/polishing equipment
![[Problem Solving Case] Pitch Conver...](https://image.mono.ipros.com/public/product/image/4cc/2001503929/IPROS78349843531622306344.png?w=280&h=280){kind=small}
An example of connecting different pitches through a pitch conversion adapter linked by a pattern!
- Other semiconductors
![[Problem Solving Case] SMT Conversi...](https://image.mono.ipros.com/public/product/image/413/2001503932/IPROS39276812336088411411.png?w=280&h=280){kind=small}
An adapter composed of a substrate material (CEM-3) that is resistant to high-temperature reflow and pin terminals for SMT implementation!
- Other semiconductors
![[Problem Solving Case] Stacking Pin...](https://image.mono.ipros.com/public/product/image/532/2001503934/IPROS57835443135270624340.png?w=280&h=280){kind=small}
A pin header composed of electrical connection pins and positioning and stacking pins, with a case where the spacer tube has been eliminated.
- Other semiconductors
![[Problem Solving Case] Metal Substr...](https://image.mono.ipros.com/public/product/image/c00/2001503936/IPROS88977109937493638786.png?w=280&h=280){kind=small}
A case where the pin header terminals were shaped in a wave pattern to relieve stress on the solder joint!
- Other semiconductors
![[Problem Solving Example] Connectio...](https://image.mono.ipros.com/public/product/image/7bf/2001503940/IPROS70468532715064542247.png?w=280&h=280){kind=small}
Attach a horn-shaped hollow terminal to the FPC, solder a lead wire to the hollow terminal, and increase the solder connection area to ensure strength.
- Other semiconductors
![[Problem Solving Case] Reduction of...](https://image.mono.ipros.com/public/product/image/d94/2001503941/IPROS18645158648223924469.png?w=280&h=280){kind=small}
A case where installation man-hours were reduced with a pin header consolidated into a single base!
- Other semiconductors
![[Problem Solving Case] Terminals fo...](https://image.mono.ipros.com/public/product/image/3fb/2001503943/IPROS40703930758582890534.png?w=280&h=280){kind=small}
An example of wire bonding a metal substrate and pin flat part, followed by soldering the metal module substrate to the motherboard.
- Other semiconductors
![[Problem Solving Case] Reduction of...](https://image.mono.ipros.com/public/product/image/d65/2001503949/IPROS52565932286896864440.png?w=280&h=280){kind=small}
A case where terminal components were directly and automatically inserted onto the circuit board using an insertion machine, reducing labor hours!
- Other semiconductors
![[Problem Solving Case] Conversion A...](https://image.mono.ipros.com/public/product/image/918/2001503950/IPROS92696088421676517031.png?w=280&h=280){kind=small}
Solved with a conversion adapter! Here are some products that contributed to solving customer problems.
- Other semiconductors
![[Problem Solving Example] Only the ...](https://image.mono.ipros.com/public/product/image/ab2/2001503955/IPROS88625087893079940690.png?w=280&h=280){kind=small}
By implementing plate terminals on pads that require gold plating, we can reduce extra costs during circuit board manufacturing!
- Other semiconductors
![[Problem Solving Case] PCB Level Co...](https://image.mono.ipros.com/public/product/image/823/2001503957/IPROS93003875297794627196.png?w=280&h=280){kind=small}
Connect the circuit boards using a pin header with spring characteristics designed for card edge with pin terminals!
- Other semiconductors
![[Problem-Solving Case] Reflow Heat ...](https://image.mono.ipros.com/public/product/image/6d7/2001503927/IPROS29173269770606501274.png?w=280&h=280){kind=small}
A case where a custom socket was mounted on the circuit board, and after reflow, components were attached to the socket!
- Other semiconductors
![[Problem Solving Case] Board-to-Boa...](https://image.mono.ipros.com/public/product/image/8c4/2001503938/IPROS40604732200448737640.png?w=280&h=280){kind=small}
A relay board with terminals that eliminates the wire soldering process by connecting the terminals to the module board and the relay board to the connector.
- Other semiconductors
![[Case Study] Heat Dissipation of Me...](https://image.mono.ipros.com/public/product/image/b52/2001503946/IPROS00694419965055911874.png?w=280&h=280){kind=small}
Place block-shaped copper terminals around the heat source! Transfer heat to the aluminum plate through thermally conductive silicone for heat dissipation.
- Other semiconductors
![[Problem Solving Case] Daughterboar...](https://image.mono.ipros.com/public/product/image/27e/2001503953/IPROS95910517399822186989.png?w=280&h=280){kind=small}
A pin header with a spring action on one side to hold the daughterboard!
- Other semiconductors
![[Problem Solving Case] Base Shape N...](https://image.mono.ipros.com/public/product/image/de9/2001503931/IPROS28320549847222015401.png?w=280&h=280){kind=small}
A pin header with a circular arc-shaped base that ensures an effective area and reduces the size of the substrate!
- Other semiconductors
![[Problem Solving Case] Breakaway Pi...](https://image.mono.ipros.com/public/product/image/05d/2001503959/IPROS87733959945932962429.png?w=280&h=280){kind=small}
An example where a pin header with a break-off section was soldered to a circuit board, leaving only the break-off terminals after removing the base.
- Other semiconductors
![[Problem Solving Case] Stress Reduc...](https://image.mono.ipros.com/public/product/image/36a/2001503961/IPROS10309697965413181013.png?w=280&h=280){kind=small}
A case where stress was reduced and challenges were solved with a wave pin header!
- Other semiconductors
As of April 1, 2016, the old product name YUPIMORE(R) has been changed to SEPLAS SA.
- Other semiconductors
A lineup of 5 types of grain sizes.
- Other semiconductors