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Additives×奥野製薬工業 - List of Manufacturers, Suppliers, Companies and Products

Additives Product List

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Copper sulfate plating additive for beer filling: Topruchina GAP

Copper sulfate plating additive for beer filling: Topruchina GAP

Copper sulfate plating additive for printed wiring boards (PWB) significantly improves via filling characteristics and uniformity of pattern plating thickness.

With the miniaturization and high performance of electronic devices, semiconductor devices are also becoming finer and more functional, and there is a growing demand for further miniaturization of wiring and reduction of via diameter in semiconductor package substrates that connect semiconductor devices to main substrates. Additionally, copper sulfate plating is required to have both high via filling capability and uniform plating thickness simultaneously. Okuno Pharmaceutical Industry has solved these challenges. Here’s what’s amazing! ◆ Copper sulfate plating additive for via filling: Topluchina GAP ◆ - Excellent uniformity of plating thickness in pattern plating - Reduces variation in plating thickness due to pattern density differences - Reduces variation in wiring width - Capable of filling large diameter blind via holes - Enables uniform electrowinning with excellent electric copper plating - Compatible with various via diameters - Excellent thermal shock resistance - Performs well across a wide current density (1.0 to 2.0 A/dm²) - Achieves high filling capability in baths with high sulfuric acid concentration - Allows for analysis of all additive components Our specialized sales representatives will propose the perfect chemicals and processes for you. Please feel free to consult us about anything.

  • Chemicals

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Hard anodizing (anodic oxidation) additive: Top Hardener AL

Hard anodizing (anodic oxidation) additive: Top Hardener AL

At a bath temperature of 20°C, hard anodizing is possible, achieving a hardness of HV400 or higher.

Typically, the hardness of anodized (anodic oxidation) coatings is between HV200 and 500. Among these, hard anodized coatings have a higher hardness and excellent wear resistance, making them widely used in vehicles and machine parts. However, while regular anodizing is performed in a liquid at around 20°C, hard anodizing requires a liquid at around 0°C, necessitating a cooling system. Okuno Pharmaceutical Industry has solved this problem. What's amazing about it! - By adding Top Hardener AL, cooling of the liquid becomes unnecessary. - Hard anodizing is possible at a bath temperature of 20°C. - It has low solubility, preventing the dissolution of pore walls. - Achieves hardness of HV400 or more. - Significantly reduces energy costs associated with cooling. Our specialized sales staff will propose the perfect chemicals and processes for our customers. Please feel free to consult us about anything.

  • aluminum
  • others
  • Non-ferrous metals

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Fine pattern large diameter copper sulfate plating additive for via filling.

Fine pattern large diameter copper sulfate plating additive for via filling.

Successfully achieved a balance between the uniformity of the plating film thickness and good via filling properties! It also accommodates plating for core layers that require through-hole filling.

Triggered by the outbreak of the novel coronavirus infection, digital transformation (DX) has progressed, leading to rapid growth in markets such as internet shopping, electronic payments, and video streaming services. Additionally, electronic devices, including smartphones, continue to evolve significantly, and as the performance and miniaturization of these devices improve, there is a strong demand for higher density and thinner printed circuit boards. Semiconductor package substrates are formed using a semi-additive method, with interlayer connections made through via filling plating. As the miniaturization of circuits advances, it has become increasingly difficult to achieve both uniformity in plating thickness and good via filling properties. To achieve further uniformity in pattern plating thickness and excellent via filling properties, our company has developed a new additive for electroplating copper (copper sulfate), called Topluchina GAP.

  • Chemicals

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High current compatible through-hole copper plating additive

High current compatible through-hole copper plating additive

Newly developed for through-hole plating of printed circuit boards, ideal for high multilayer boards equipped with IC substrates and semiconductor package boards.

With the miniaturization, high functionality, and high density of electronic devices, there is an increasing demand for high-performance through-hole plating for module substrates and high-layer printed wiring boards. Our company has developed a sulfuric acid copper plating additive, Topluchina MSD, specifically for through-holes that can handle high currents, primarily for module substrates and high-layer printed wiring boards. This product achieves high throwing power at high current densities and contributes to improved productivity by reducing maintenance through stable operation.

  • Chemicals

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High film thickness uniformity copper sulfate plating additive for via filling

High film thickness uniformity copper sulfate plating additive for via filling

Evolving stacked via technology to improve wiring flexibility! Newly developed additives for copper plating specialized in film thickness uniformity for fine circuit formation for high-speed transmission.

The COVID-19 pandemic has significantly changed our lifestyle, making remote work and online business the norm. The demand for information and communication devices in fields such as 5G smartphones, computers, data centers, and car electronics is further increasing, and there is a growing need for higher performance and higher density in the semiconductor package substrates used in these devices. Build-up methods are common for printed circuit boards used in smartphones and modules, and our electroplating additives for copper have a strong track record of adoption in this sector. Okuno Pharmaceutical Industry has evolved its stacked via technology to improve the wiring flexibility of circuits and has newly developed electroplating additives for copper that are specialized for uniform film thickness, intended for fine circuit formation used in high-speed transmission.

  • Chemicals

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High filling copper sulfate plating additive for horizontal conveying plating equipment.

High filling copper sulfate plating additive for horizontal conveying plating equipment.

A new copper sulfate plating additive has been developed specifically for horizontal conveyor roll-to-roll plating equipment, enabling via filling plating on flexible circuit boards.

In conventional horizontal transport Roll to Roll plating equipment, there was a problem where copper oxidized during the transfer of substrates, leading to a decrease in via filling performance. Our company has successfully developed an additive that incorporates components to control the weak current flowing during inter-cell movement, achieving both good filling properties and throwing power (patent obtained). The high-filling copper sulfate plating additive, Topruchina SVP, enables further densification and multilayering of flexible circuits, making it ideal for improving the efficiency of flexible circuit board manufacturing.

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Copper sulfate plating additive for semiconductor wafers - TORYZA LCN SP

Copper sulfate plating additive for semiconductor wafers - TORYZA LCN SP

TORYZA LCN SP, the optimal electroplating solution for forming copper pillars on semiconductor wafers and package substrates.

Solder balls have been widely used in semiconductor packaging. However, due to the increase in pin count (the number of terminals on the substrate), the increase in the number of chips being packaged, and the reduction in bonding area, solder bumps with a diameter of about 100µm are becoming insufficient for high-density packaging. As an alternative, attention is being drawn to a method that involves forming a redistribution layer (RDL) on the semiconductor and using copper pillars for bonding. Our company has developed the optimal additive for copper pillars, TORYZA LCN SP. TORYZA LCN SP can also be used to form ultra-fine electrodes on the build-up layer of the package substrate.

  • Chemicals

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Copper sulfate plating additive for semiconductor wafers - TORYZA LCN SD

Copper sulfate plating additive for semiconductor wafers - TORYZA LCN SD

Copper sulfate plating additive for semiconductor wafers, high heat dissipation and high current applications - TORYZA LCN SD.

Smartphones are widely used not only for calls but also for content viewing such as music and videos, online shopping, and in industries like automobiles, smart home appliances, and robotics. Mobile communication devices like cell phones and tablets have undergone significant evolution approximately every 10 years, with their maximum communication speeds increasing by about 1,000,000 times over the past 30 years. Additionally, semiconductors used in servers and high-performance computers are required to achieve even higher performance and multifunctionality. Our company has recently developed a new copper sulfate plating additive, TORYZA LCN SD, which is optimal for low aspect ratio via filling. TORYZA LCN SD can be widely applied to microbumps that join semiconductor chips and build-up wiring boards, as well as thermal vias used for heat dissipation in trench wiring on wafers and power semiconductors.

  • Chemicals

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Copper sulfate plating additive optimal for semiconductor package substrate implementation.

Copper sulfate plating additive optimal for semiconductor package substrate implementation.

Topluchina FRV, a copper sulfate plating additive that achieves both high filling capability and in-plane uniformity, is optimal for the implementation of semiconductor package substrates.

In the implementation of semiconductor package substrates, attention is being drawn to Fan-Out Wafer Level Packaging (FOWLP) technology. In the case of FOWLP, wiring (redistribution layer) is formed in the internal area of the semiconductor package substrate. In traditional bump connections, it was necessary to electrically connect the semiconductor chip and the terminals of the package substrate. Additionally, in wire bonding using fine wires of gold or aluminum, there was a problem where increasing the number of terminals made it difficult to achieve reliable electrical connections. Therefore, the practical application of fan-out packaging technology, which allows multiple chips to be mounted side by side (multi-chip) without limitations based on chip size, is rapidly advancing. Our company has newly developed a copper sulfate plating solution that enables high filling and in-plane uniformity for the formation of redistribution layers on semiconductor wafers.

  • Chemicals

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Copper plating additive for high aspect ratio substrates "Topluchina HLS"

Copper plating additive for high aspect ratio substrates "Topluchina HLS"

Copper sulfate plating additive for high aspect ratio substrates for package substrates "Topluchina HLS"

This is the latest plating technology for semiconductor package substrates (IC substrates). Currently, electronic devices such as smartphones, computers, and servers are becoming more high-performance, leading to a reduction in the diameter of through-holes that electrically connect the layers of printed circuit boards, as well as a decrease in pitch. As a result, there is an advancement in the high aspect ratio and high density of through-holes. We have newly developed a copper sulfate plating additive for high aspect ratio substrates that can accommodate both soluble and insoluble anodes, aimed at improving the productivity and quality stability of printed circuit board production. This product excels in depositability within through-holes and vias, achieving high throwing power across a wide range of current densities.

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Copper sulfate plating additive for semiconductor wafers - TORYZA LCN FRV

Copper sulfate plating additive for semiconductor wafers - TORYZA LCN FRV

FOWLP, FOPLP, and next-generation semiconductor package substrates, as well as ultra-fine wiring copper sulfate plating additives - TORYZA LCN FRV.

In recent years, semiconductor packaging technology has gained attention with FOWLP and FOPLP, which allow for an increase in the number of terminals relative to chip area by forming a redistribution layer on the wafer and expanding the terminals to the outside of the chip (Fan Out), in contrast to the conventional FC-BGA that is disadvantageous for thinness and cost reduction. Our company has developed a new copper sulfate plating additive for the formation of the redistribution layer in FOWLP and FOPLP. This product excels in film thickness uniformity and rectangularity of pattern shape, and it also accommodates filling of small-diameter vias. Additionally, to support the increase in the number of terminals on the chip side, the formation of ultra-fine wiring layers on the build-up layer of conventional FC-BGA is also being considered. This product is optimal for the formation of ultra-fine wiring in next-generation semiconductor package substrates.

  • Chemicals

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Copper sulfate plating additive for semiconductor wafers - TORYZA LCN SV

Copper sulfate plating additive for semiconductor wafers - TORYZA LCN SV

Supports high aspect ratio filling, copper sulfate plating additive for silicon interposers - TORYZA LCN SV.

With the advancement of semiconductor performance and functionality, packaging technologies related to chiplets that implement multiple chips with different functions on a single substrate and three-dimensional integration are gaining attention. Among these, silicon interposers with wiring formed on silicon are attracting interest because they can miniaturize the length and width of the wiring, thereby enhancing the transmission capability of high-frequency signals. Our company has developed TORYZA LCN SV as an additive for silicon interposers that supports high aspect ratio filling. TORYZA LCN SV excels in embedability into TSVs, achieving void-free and low film thickness high aspect ratio filling.

  • Chemicals

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Exhibiting with the theme of OKUNO's surface treatment technology contributing to the development of the semiconductor field.

Exhibiting with the theme of OKUNO's surface treatment technology contributing to the development of the semiconductor field.

Okuno Pharmaceutical Industry, a top-class company in surface treatment and plating chemicals, offers surface treatment chemicals and process technologies for wafers and package substrates!

■Exhibiting at SEMICON JAPAN 2023■ Okuno Pharmaceutical Industry will be exhibiting at SEMICON JAPAN 2023, which will be held at Tokyo Big Sight from December 13 (Wednesday) to December 15 (Friday), 2023. We will showcase a variety of new products, including plating technologies for wafers and semiconductor package substrates, as well as plating processes for power modules that contribute to device connection reliability. Please visit our booth at Tokyo Big Sight, East Hall 1, [1131]. Latest information about the exhibition and more can be found on our company website. Please check the related links. All of our employees look forward to your visit. *For more details, please download the PDF or contact us directly.

  • Surface treatment contract service
  • Other contract services

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Copper sulfate plating additive for high current fine patterns

Copper sulfate plating additive for high current fine patterns

Additives for electroplating copper that are optimal for forming fine wiring on semiconductor package substrates.

We have developed two new products, "Topluchina NSV ADV" and "Topluchina NSV LV," as plating additives for via filling with high current density fine patterns. Topluchina NSV ADV maintains excellent via filling performance while achieving high film thickness uniformity in fine wiring. Topluchina NSV LV is a copper sulfate plating additive compatible with fine patterns and large-diameter vias, enabling through-hole filling by plating copper inside the through holes.

  • Chemicals

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High-reliability granular copper plating additive that achieves high adhesion to sealing resin.

High-reliability granular copper plating additive that achieves high adhesion to sealing resin.

Granular copper plating film for lead frames that contributes to the improvement of adhesion strength with sealing resin.

Power semiconductors that can operate in high-load environments are used in various fields such as industrial equipment, solar power generation, electric vehicles, communication devices, and energy conversion equipment. In recent years, as high voltage and high current capabilities have advanced, there is a growing need for packaging technologies that offer higher connection reliability. If the lead frame, which connects the semiconductor device and circuit, experiences delamination at the interface of the substrate resin under thermal load, it can lead to short circuits or disconnections. Our company has newly developed an additive that forms a granular copper plating to achieve high adhesion between the frame, coating, and mold resin.

  • Chemicals

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