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Carrier Product List and Ranking from 14 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Carrier Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. サンリュウ Saitama//Printing Industry
  2. マイクロ・テック Chiba//Industrial Machinery
  3. Eddyfi Technologies ジャパンオフィス Osaka//Industrial Electrical Equipment
  4. 4 アド機械設計 Nagano//Industrial Machinery
  5. 5 シンアペックス Nagano//Industrial Electrical Equipment
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Carrier Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. A3 printer with white toner 'OKI Pro 8432 WT' サンリュウ
  2. Maskless solder ball-equipped machine "Solder Bouncer" マイクロ・テック
  3. Eddyfi GEKKO - Equipped with ATFM! PAUT & TFM device Eddyfi Technologies ジャパンオフィス
  4. 4 Handball mounting device アド機械設計
  5. 5 Desktop High Precision Device "AAS-1000" アクテス京三 技術センター

Carrier Product List

1～15 item / All 18 items

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Maskless solder ball-equipped machine "Solder Bouncer"

Maskless solder ball-equipped machine "Solder Bouncer"

Device equipped with solder balls using vibration technology! Capable of mounting balls as small as φ80μm! For research and development, and small quantity sample production!

The "Solder Bouncer," a maskless solder ball mounting machine, utilizes vibration technology and is capable of mounting balls as small as φ80μm. It is suitable for research and development as well as small-scale sample production. 【Features】 ■ Takes up less space compared to printing machines ■ No need for regular mask replacement due to its maskless design ■ Utilizes steady-state wave vibration for solder ball launching *For more details, please contact us or refer to the PDF data.

  • Soldering Equipment

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[Test Reception Open] Automatic Solder Ball Mounting Line

[Test Reception Open] Automatic Solder Ball Mounting Line

【Exhibition Participation】Recommended for the semiconductor backend, organic packaging, and assembly industries! Automatically and evenly attaches solder balls.

The "Solder Bouncer Line" is an automatic ball mounting line for flip chip solder bumps, which eliminates the need for a mask during ball mounting thanks to our patented technology that utilizes vibration. Image inspection tailored to the purpose is installed inline. Our unique vibration transfer technology allows for testing with various shapes and sizes. We are currently accepting tests with great enthusiasm. 【Features】 ■ Can evenly attach solder balls to flux ■ Enables maskless solder ball mounting ■ Easy to switch between varieties and user-friendly ■ Contributes to improved yield Additionally, we will be exhibiting at "SEMICON JAPAN 2024" held at Tokyo Big Sight (Hall 2, Booth 2655). We sincerely look forward to your visit. *For more details, please download the PDF or feel free to contact us.

  • Other mounting machines

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Industrial equipment and devices, automatic mounting machine for electronic components.

Industrial equipment and devices, automatic mounting machine for electronic components.

The quality and efficiency of assembly work for component mounting equipment have improved! We meet your needs across a wide range of fields.

At Nippon Spring Probe Co., Ltd., we handle industrial equipment and devices such as automatic electronic component mounting machines. By utilizing new equipment and high technical capabilities, we improve the quality and efficiency of assembly tasks for component mounting equipment with various labor-saving machinery. We will respond to your needs across a wide range of fields. 【Lineup】 ■ FPC Bonding Equipment ■ Micro Oil Quantitative Injection Equipment *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines

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Easy to use, immediately effective, yet low-priced.

Easy to use, immediately effective, yet low-priced.

We offer a total package for the three processes of printing, mounting, and heating for those looking for low-cost, space-saving implementation solutions.

Printing: Manual cream solder printer ST-310F Equipped with: Ultra-compact simple chip mounting machine MR-250 Heating: Non-contact point reflow APR-20A Total for all three: An astonishing 3,903,000 yen (excluding tax)

  • Mounter

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Ultra-compact simple chip-equipped device

Ultra-compact simple chip-equipped device

High precision at this size! This accuracy at this price!!

By adopting a cast body, XY accuracy of ±50μm is achieved, and it can accommodate components from 0201 chip parts to 15mm square SOP*. It has an ultra-compact size of 460mm in width, 760mm in depth, and 1270mm in height. In addition to the standard coating and mounting functions characteristic of the MR series, it now also supports automatic image processing as standard, with a price below 6 million yen. It features a well-regarded interactive software that allows for more intuitive operation.

  • Mounter

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Product Preview "Dashboard Mounted"

Product Preview "Dashboard Mounted"

Install the instrument panel sub-assembly into the vehicle. (There is also a track record for the rear seat.)

When installing an instrument panel (hereinafter referred to as IP) in a vehicle, it is necessary to accurately mount the unitized IP assembly weighing approximately 40kg to 80kg in a narrow gap. Shintec Co., Ltd. has made it possible to use not only the conventional scalar-type arm but also a linear-type arm. 【Specifications】 ○ Load capacity: 80kg (workpiece weight) ○ Air pressure: 0.5 to 0.7 MPa ○ Compatible work types: 4 vehicle models For more details, please contact us or download the catalog.

  • Other conveying machines

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Handball mounting device

Handball mounting device

Customizable upon request! Introducing a solder ball mounting device with an accuracy of ±0.05mm.

Our company handles "solder ball mounting devices." The ceramic substrate mounted on the transport carrier is removed, followed by solder paste printing, solder ball mounting, and quality inspection through image processing. After that, it is mounted on a pallet for reflow and discharged for reflow. Additionally, we can customize according to your requests. Please contact us when you need assistance. 【Specifications】 ■ Ceramic substrate size: 19mm × 12mm × 0.8mm ■ Mounted solder ball: diameter 0.65mm ■ Number of solder balls mounted: 112 pieces ■ Mounting accuracy: ±0.05mm ■ Cycle time: 24 seconds (2 boards) 12 seconds/1 board *For more details, please refer to the PDF document or feel free to contact us.

  • Mounter
  • Assembly Machine
  • Other conveying machines

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Desktop High Precision Device "AAS-1000"

Desktop High Precision Device "AAS-1000"

A desktop high-precision device that achieves space-saving, resource-saving, and cost-saving.

The "AAS-1000" is a desktop high-precision mounting device that achieves high-precision assembly through the adoption of a highly rigid and well-established manipulator frame. It features an ultra-compact design that incorporates a 12-axis driver and controller into the automatic mounting mechanism with a manipulator hand. Additionally, the development of a floating manipulator hand allows for handling of small and fragile workpieces. 【Features】 ■ Achieves high-precision assembly through the adoption of a highly rigid and well-established manipulator frame ■ Capable of handling small and fragile workpieces with the development of a floating manipulator hand ■ Realizes exceptional cost-effectiveness and compactness through the use of in-house developed small stages ■ Equipped with high-precision automatic alignment functionality through high-speed image processing ■ Achieves space-saving, resource-saving, and cost-saving benefits *For more details, please refer to the PDF materials or feel free to contact us.

  • Other machine elements

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Single-board compatible microball-equipped machine 'BM-3500SI'

Single-board compatible microball-equipped machine 'BM-3500SI'

A new microball system that meets individual piece needs! Reduces ball consumption.

We would like to introduce the 'BM-3500SI', a micro ball mounting machine compatible with individual substrates, manufactured by Athlete FA. This product, designed for individual substrates, has been completed with optimized ball dispensing brushes to reduce ball consumption. By configuring flux printing and ball mounting with multiple units and implementing a two-step inspection and repair process, we have achieved a 1.5 times increase in UPH compared to the previous model. 【Features】 ■ Achieves compatibility with individual substrates ■ Configured with multiple units for flux printing and ball mounting, and a two-step inspection and repair process, achieving 1.5 times UPH compared to the previous model ■ Reduces ball consumption through optimized ball dispensing brushes ■ Delivers high performance *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board processing machine

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Tabletop Chip Alignment Device CAJ-11

Tabletop Chip Alignment Device CAJ-11

Automatic alignment of chips equipped with image processing, compatible with COG/COF.

The image processing system recognizes the alignment marks and automatically aligns the chips. It is a simple yet highly precise tabletop machine.

  • Mounter

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Ultra-compact simple chip-equipped device

Ultra-compact simple chip-equipped device

Despite its ultra-compact size equivalent to two beer cases weighing 25kg, it is compatible with conveyors and demonstrates its power as a production line.

Features - Achieves low-cost automation of simple tasks. - Portable mobile size - Intuitive and easy operation - Budget-friendly chip mounter - Various additional options such as automatic image processing, conveyor specifications, and heating functions.

  • Mounter

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Eddyfi GEKKO - Equipped with ATFM! PAUT & TFM device

Eddyfi GEKKO - Equipped with ATFM! PAUT & TFM device

A phased array ultrasonic flaw detector equipped with TFM and the latest adaptive ATFM features, prioritizing the voice of the user!

The Gekko is designed with robust and compact housing, incorporating all basic functions and advanced UT capabilities for on-site use. It comes standard with all beam-forming phased array UT technologies and encoders (3-axis) for conventional UT, TOFD, single beam, and multi-group inspections, enabling it to handle challenging inspections. The Gekko also supports real-time TFM/FMC (Full Matrix Capture). The bumpers and connectors are designed with durability and accessory versatility in mind. The touch panel can be used under harsh outdoor conditions. It is equipped with two hot-swappable batteries, allowing for up to 6 hours of operation. It can connect up to 128 channels of probes, providing excellent signal and TFM resolution, enhancing detection performance and reliability. It achieves fast scan speeds and productivity. With connection methods such as USB 3.0 and Gigabit Ethernet output, data transfer speeds are accelerated, allowing for remote control of inspections even in difficult situations. Additionally, it features a 256GB SSD, enabling unlimited data file sizes, making the operator's work more comfortable and reducing on-site working time.

  • Flaw detection testing
  • Other inspection equipment and devices
  • Image Processing Equipment

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Solution "Device Self-Monitoring Function (WDT)"

Solution "Device Self-Monitoring Function (WDT)"

Streamlining equipment maintenance operations is possible! Introducing the solutions of the 'ST Series products.'

The "Device Self-Monitoring Function (WDT)" is a feature that monitors whether the main devices inside the equipment are operating normally. If an anomaly is detected, the device is automatically reset to recover from the abnormal state. The device self-monitoring function is designed with a fail-safe mechanism that can detect anomalies even when the CPU has stopped. Minor system anomalies that occur in unmanned equipment, such as roadside cameras, are automatically recovered, allowing for labor-saving in equipment maintenance tasks. 【Target Devices】 ■ST13528M ■ST13512M ■ST13520 ■ST13116M ■ST13512PW・ST13518PW ■ST13908M ■ST12500M *For more details, please refer to the PDF document or feel free to contact us.

  • Routers, Switches, and Hubs
  • Other network tools
  • Other security

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Solder Ball Mount STM-II Single Shot Desktop Type

Solder Ball Mount STM-II Single Shot Desktop Type

Ideal for applications such as prototype BGA packages and reballing! This is a space-saving, tabletop solder ball machine.

No metal mask required, single-shot method solder ball mounting machine. Since balls are mounted one by one, there is no wasteful consumption of balls. Various ball mounting patterns can be easily set on the touch panel, and the process from flux application to solder ball mounting is done automatically. There is no need to create a metal mask for each pattern, which reduces running costs and makes management easier, allowing for quick responses to needs such as prototyping BGA packages, automating BGA reballing, and partial ball mounting.

  • Other mounting machines

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Desktop high-precision equipped machine

Desktop high-precision equipped machine

Desktop high-precision equipped machine

World's smallest class micron precision automatic assembly device. A practical level desktop factory that achieves space-saving, resource-saving, and cost-saving. - Ultra-compact design that integrates all 12-axis drivers and controllers into an automatic mounting mechanism with a manipulator hand. - High precision assembly achieved by adopting a highly rigid manipulator frame known for its reliability. - Development of a floating manipulator hand to accommodate small and fragile workpieces (patent pending). - Adoption of in-house developed compact stages to achieve unprecedented cost and compactness (patent pending). - Equipped with high-precision automatic alignment functionality through high-speed image processing. - Optimal for assembling MEMS devices by combining micro hands and spot heating methods (ideal for multi-type chip integration).

  • Assembly Machine
  • Bonding Equipment

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