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Cleaning Machine Product List and Ranking from 725 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Jul 29, 2026～Aug 25, 2026
This ranking is based on the number of page views on our site.

Cleaning Machine Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jul 29, 2026～Aug 25, 2026
This ranking is based on the number of page views on our site.

  1. サニー産業 Tokyo//Trading company/Wholesale
  2. シンショー Hiroshima//Industrial Machinery
  3. 丸山製作所 産機営業部 Tokyo//Industrial Machinery
  4. 4 洲本整備機製作所 本社工場 Hyogo//Industrial Machinery
  5. 5 Authentec co., Ltd. Kanagawa//Industrial Machinery
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Cleaning Machine Product ranking

Last Updated： Aggregation Period:Jul 29, 2026～Aug 25, 2026
This ranking is based on the number of page views on our site.

  1. Automatic Bed Cleaning Machine "DRYFT" サニー産業
  2. Mower "MB Series / MBS Series" 丸山製作所 産機営業部
  3. Grease and dust removal! Cleaning machine AUDEBU Racoon1000 Authentec co., Ltd.
  4. 4 High-pressure washer "5ps・7.5ps Soundproof Type High-pressure Washer" シンショー
  5. 5 High-pressure washer "16.5ps・27ps Soundproof High-pressure Washer" シンショー

Cleaning Machine Product List

781～810 item / All 2714 items

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Exploring the Current State of Solder Cleaning - The Evolution of Solder and Cleaning - [Technical Document Download]

Exploring the Current State of Solder Cleaning - The Evolution of Solder and Cleaning - [Technical Document Download]

Why was cleaning considered essential? An explanation of the cleaning needs for no-clean solder and other related topics.

This document introduces the evolution of solder and cleaning. It explains why cleaning of products is necessary after soldering and discusses the challenges of cleaning no-clean solder. Additionally, it covers the metal composition of solder and the effectiveness of MPC cleaning agents on no-clean solder. We encourage you to read it. 【Contents (partial)】 ■ The trajectory of "solder," a key player in the development of civilization ■ Why was cleaning deemed essential? ■ The metal composition of solder ■ Why does the demand for cleaning no-clean solder arise? ■ Why is cleaning "no-clean solder" difficult? *For more details, please refer to the PDF document or feel free to contact us.

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Review of Cleaning Mechanisms - Limitations of Existing Cleaning Methods - [Technical Document]

Review of Cleaning Mechanisms - Limitations of Existing Cleaning Methods - [Technical Document]

Limitations of existing cleaning methods and challenges in difficult cleaning! An explanation of low standoff cleaning and more.

In this document, we propose our cleaning process as a solution to the increasingly challenging cleaning requirements, using "low stand-off" as an example. In recent times, with technological innovations occurring in various fields, electronics cleaning has progressed to a new stage and is becoming more "challenging." We provide explanations regarding the background and key points of cleaning demand, as well as the importance of cleaning methods, so please take a moment to read through it. 【Contents (partial)】 ■ Introduction – Changes in cleaning demand trends ■ The challenges of cleaning – High performance of products ■ Background and key points of cleaning demand for low stand-off ■ Ensuring wettability and cleaning performance for low stand-off cleaning ■ Benefits of cleaning using MPC *For more details, please refer to the PDF document or feel free to contact us.

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Embracing 5G - Evolution and Challenges of Power Devices - [Document]

Embracing 5G - Evolution and Challenges of Power Devices - [Document]

The digital society is reaching new heights! Featuring the characteristics of power semiconductors required under 5G and the importance of the cleaning process.

This document explains the challenges of flux cleaning in 5G. It highlights the promising outlook of 5G and introduces "power semiconductors," which are essential for the future world. It includes the characteristics of power semiconductors required under 5G, the importance of the "cleaning process," and efforts to address cleaning challenges. We encourage you to read it. 【Contents (partial)】 ■ Introduction ■ Outlook for 5G ■ Characteristics of power semiconductors required under 5G ■ Importance of the "cleaning process" for power semiconductors ■ Efforts to address cleaning challenges in power semiconductors *For more details, please refer to the PDF document or feel free to contact us.

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Is the cleaning effect proven? - Challenges in cleanliness evaluation - [Document]

Is the cleaning effect proven? - Challenges in cleanliness evaluation - [Document]

An era where post-cleaning evaluation is questioned! Publication of effective analytical methods other than visual inspection.

This document explains the evaluation methods for cleanliness after flux cleaning. As for existing mainstream evaluation methods, after passing reliability assessments, actual manufacturing processes determine product defects through appearance inspections using AOI. However, there is a growing trend of defects occurring after product inspections. We introduce the factors contributing to such occurrences and effective analytical methods other than appearance inspections, so please take a moment to read through it. [Contents] ■ An era where post-cleaning evaluation is questioned, just like cleaning technology ■ Diversification of flux residue components ■ Separation and analysis methods for complex components ■ Future prospects and added value of cleaning *For more details, please refer to the PDF document or feel free to contact us.

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Tips for Choosing Cleaning Methods: Types of Flux Cleaning Methods and How to Select Them

Tips for Choosing Cleaning Methods: Types of Flux Cleaning Methods and How to Select Them

The typical methods are spray (shower), ultrasonic, and jet! An explanation of flux cleaning.

In this column, we will introduce one of the key points to consider when examining flux cleaning methods: the types of "cleaning methods" and how to select them. Flux cleaning refers to the removal of flux residues (contaminants) while protecting components such as printed circuit boards, power modules, semiconductor packages, and lead frames. The presence of flux residues can lead to issues such as the occurrence of migration and poor adhesion in molding, making flux cleaning necessary in certain cases. *For more detailed information, please refer to the related links. Feel free to contact us for further inquiries.*

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What is substrate cleaning? An explanation from basic knowledge to the latest trends in cleaning challenges.

What is substrate cleaning? An explanation from basic knowledge to the latest trends in cleaning challenges.

We will explain the necessity of substrate cleaning, including the latest issues related to ion residues and the effects of metal salts, as well as the analytical methods.

What is substrate cleaning? Is substrate cleaning unnecessary? We provide a detailed explanation of areas where flux cleaning is necessary, among other topics. In Japan, many cases adopt no-clean paste, but to ensure high reliability, cleaning has become essential. We also address the latest cleaning challenges, such as the impact of ionic residues and metal salts on insulation resistance, in this column. Recommended for those who: * Want to investigate the causes of defects despite cleaning * Want to know the latest cleaning challenges and evaluation criteria * Want to explain and promote substrate cleaning within their company, etc. Please see the related links for more information. * You can view the detailed content of the column from the related links. For more information, feel free to contact us.

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Flux cleaner VIGON PE180 for power semiconductors and PCBs

Flux cleaner VIGON PE180 for power semiconductors and PCBs

No flash point! Neutral water-based cleaner is also excellent for removing oxide films from copper surfaces.

"VIGON PE 180" is a neutral water-based cleaning agent developed for the removal of flux from power electronics and printed circuit boards using spray equipment. It effectively removes flux and is a product with excellent material compatibility. It is used for flux removal from lead frames, discrete components, power modules, power LEDs, and printed circuit boards. Additionally, it excels in removing oxide films from copper surfaces to improve wire bonding/adhesive bonding in the next process and molding properties. 【Features】 ■ Exhibits excellent effectiveness in flux removal ■ Activates copper surfaces without staining ■ Shows excellent material compatibility due to its neutrality ■ Good rinsability due to MPC composition ■ Does not require explosion-proof equipment as it has no flash point *For more details, please refer to the PDF document or feel free to contact us.

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Neutral flux cleaner for semiconductors - HYDRON SE 220

Neutral flux cleaner for semiconductors - HYDRON SE 220

Excellent material compatibility! It is possible to remove flux residues generated during die attachment and finish the subsequent processes to an optimal surface condition.

"HYDRON SE 220" is a one-phase type water-based cleaning agent for immersion processes. It removes flux residues generated during die attach and other processes from various semiconductor packages such as lead frames, discrete components, power modules, power LEDs, flip chips, and CMOS. Due to its one-phase structure, it demonstrates excellent process manageability and good rinsability, allowing for a suitable surface condition for subsequent processes like wire bonding and molding. 【Features】 ■ Exhibits excellent performance in immersion processes ■ Good rinsability with ion-exchanged water, leaving no residues ■ No attack on chip passivation ■ Maintains activated surfaces for a certain period ■ No flash point and low odor, allowing for introduction into immersion cleaning tanks without explosion-proof specifications *For more details, please refer to the PDF document or feel free to contact us.

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Water-based flux cleaning agent VIGON A 201

Water-based flux cleaning agent VIGON A 201

High contamination tolerance! Long liquid life, low maintenance costs, reduced cost per cleaning part.

"VIGON A 201" is a flux cleaner that demonstrates excellent performance in spray cleaning in fine spaces such as under low stand-off components. This product, which is an MPC-based cleaner used at low concentrations, is particularly suitable for removing flux residues from no-clean solder that is eutectic and lead-free. It maintains a glossy solder joint surface without additives after cleaning. Additionally, it is suitable for removing tacky flux from flip chips and CMOS. 【Features】 ■ Cleans low stand-off components effectively ■ Particularly effective for lead-free no-clean solder ■ Maintains gloss on soldered areas of the substrate after cleaning ■ Long liquid life, low maintenance costs, and reduced cost per cleaned component ■ Easy rinsing, leaving no residues on the surface *For more details, please refer to the PDF document or feel free to contact us.

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Water-based flux cleaner for printed circuit boards VIGON N 640

Water-based flux cleaner for printed circuit boards VIGON N 640

A product suitable for use in immersion cleaning! It can reduce the number of rinses.

"VIGON N 640" is a specially designed neutral cleaning agent for the removal of flux from printed circuit boards. It is suitable for use in batch spray cleaning machines. It offers excellent cleaning performance against advanced cream solder and fluxes that are generally difficult to remove. Additionally, it has excellent material compatibility with highly sensitizing metals such as copper and nickel. 【Features】 ■ Suitable for use in batch spray cleaning machines ■ Excellent operability, maintaining a constant concentration between the tank and chamber ■ Effective against difficult-to-remove cream solder ■ Can be easily rinsed with ion-exchanged water ■ High material compatibility due to its neutral nature *For more details, please refer to the PDF document or feel free to contact us.

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Water-soluble neutral flux cleaner VIGON N 680

Water-soluble neutral flux cleaner VIGON N 680

For spray cleaning processes! It has excellent material compatibility with highly sensitizing metals such as copper and aluminum.

"VIGON N 680" is a neutral cleaning agent specially designed for water-based spray cleaning (inline and batch). It effectively removes various flux residues from electronic circuit boards and can penetrate and clean even low stand-off components very well. Additionally, it has excellent material compatibility with metals that are highly sensitizing, such as copper. Please feel free to contact us if you have any inquiries. 【Features】 ■ Particularly excellent for cleaning under low stand-off components ■ High rinsability provides a wide range of applications ■ Superior material compatibility with highly sensitizing metals like copper and aluminum ■ Sufficient effectiveness even at low concentrations depending on the process ■ Can be sent to wastewater treatment without neutralization *For more details, please refer to the PDF document or feel free to contact us.

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Cleaning agent for power semiconductors and printed circuit boards / VIGON PE 194A

Cleaning agent for power semiconductors and printed circuit boards / VIGON PE 194A

Weakly alkaline flux cleaner, excellent rinsing properties, does not foam, suitable for spray and immersion equipment!

"VIGON PE 194A" is a water-based weak alkaline cleaning agent specially designed for spray and immersion equipment. It has excellent material compatibility with highly sensitizing metals, especially with die materials, and can remove copper oxide films in a short time. Based on MPC technology, it reliably removes flux residues from power semiconductors, lead frames, discrete components, power LEDs, and printed circuit boards. 【Features】 - Effectively removes flux residues from power semiconductors and printed circuit boards - Weakly alkaline, with excellent material compatibility, especially for die and highly sensitizing metals - Prepares copper surfaces in a clean state, activating them for bonding connections - Does not have a flash point, eliminating the need for explosion-proof equipment - Usable with various types of spray equipment *For more details, please refer to the PDF document or feel free to contact us.

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Concentration Measurement Kit / ZESTRON Bath Analyzer 10

Concentration Measurement Kit / ZESTRON Bath Analyzer 10

Accurate measurement even with increased contaminant components! Simple and quick usage procedure.

The "ZESTRON Bath Analyzer 10" is a concentration measurement kit for alkaline cleaning solutions. It is simple and easy to use, and can accurately measure concentrations even in solutions containing contaminant components. It can be used with minimal equipment and requires only a small amount of space. Please feel free to contact us if you have any requests. 【Features】 ■ Accurate concentration measurement - Measures accurately even with increased contaminant components - Can be used accurately with both new solutions and those containing contaminant components ■ Indicates alkalinity through color change ■ Simple and quick usage procedure ■ Portable case for use anywhere *For more details, please refer to the PDF document or feel free to contact us.

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Low VOC water-based flux cleaner ATRON AC 205

Low VOC water-based flux cleaner ATRON AC 205

By removing the adhesive flux, you achieve a void-free underfill! Image resolution is also improved.

The "ATRON AC 205" is a cleaning agent designed with FAST technology to remove flux residues from circuit boards. This product offers shorter processing times and a longer lifespan. It is particularly suitable for high-pressure inline cleaning equipment that requires very short processing times. Additionally, it is effective on power LEDs, flip chip packages, CMOS, and BGA. 【Features】 ■ Quickly removes advanced lead-free and eutectic solder flux residues ■ Mild composition preserves the shine of solder joints and pads ■ Improves light conversion and lifespan of power LEDs, as well as the quality of wire bonding ■ Does not contain harmful substances such as ethanolamine ■ Very low VOC values *For more details, please refer to the PDF document or feel free to contact us.

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Water-based flux cleaning agent for semiconductors HYDRON SE 230A

Water-based flux cleaning agent for semiconductors HYDRON SE 230A

Low surface tension is a characteristic! It provides good cleaning results even in narrow spaces.

"HYDRON SE 230A" is a one-phase type water-based cleaning agent for immersion processes. It reliably removes flux residues generated during die attach from various semiconductors such as lead frames, discrete components, power modules, power LEDs, flip chips, and CMOS. Additionally, it excels in removing oxide films from copper substrates in post-processes such as wire bonding and molding. 【Features】 ■ Activates copper substrates without staining and maintains the activated surface for a certain period ■ Excellent material compatibility with highly sensitive materials ■ Superior flux removal after wafer bump formation ■ Easy process management due to its one-phase structure, demonstrating excellent performance in immersion processes ■ Good rinsing properties with ion-exchanged water, leaving no residues *For more details, please refer to the PDF document or feel free to contact us.

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Fully Automatic Cleaning Solution Concentration Measurement Management System ZESTRON EYE

Fully Automatic Cleaning Solution Concentration Measurement Management System ZESTRON EYE

Continuously accumulate data for the traceability of management process parameters!

The "ZESTRON EYE" is a digital monitoring system that allows for real-time measurement and management of cleaning solution concentration during the flux cleaning process, unaffected by flux contamination. It can be easily integrated regardless of the manufacturer or type of cleaning equipment commonly used. We provide automated process management, including data management and storage, for quality assurance. 【Features】 ■ Accurate automatic measurement of the concentration of new and used cleaning solutions ■ Quick response to cleaning agent concentration during operation, managing it in real-time ■ Easy to use with a touch panel interface ■ Integration with cleaning equipment PLCs and automatic replenishment systems ■ Reduction of operator burden through automatic measurement *Compatible only with Zestron cleaning agents. *For more details, please refer to the PDF document or feel free to contact us.

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Differences between aqueous, semi-aqueous, and solvent-based systems [Types and selection methods of flux cleaning agents]

Differences between aqueous, semi-aqueous, and solvent-based systems [Types and selection methods of flux cleaning agents]

Introduction to the types of cleaning agents (water-based cleaning agents/solvent-based cleaning agents) and selection methods!

Cleaning agents can be broadly classified into "water-based," "semi-water-based," and "solvent-based." Water-based cleaning agents have overwhelming safety considerations for the working environment. Solvent-based cleaning agents are available on the market either as single components for direct use or as blends with organic solvents and other substances. *For more details, please refer to the related links. For further information, please check the PDF materials or feel free to contact us.*

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Why is cleaning necessary for sintering bonding? [Cleaning issues in sintering bonding]

Why is cleaning necessary for sintering bonding? [Cleaning issues in sintering bonding]

Explaining why cleaning is necessary for sintering bonding! Introducing cleaning know-how.

The joining technology of silver sintering (silver sinter) has been attracting attention in recent years. With the increase in electrical capacity and the utilization of new materials, there is a need for "new joining technologies" that can withstand higher temperatures, higher voltages, and larger currents. The silver sintering process can form a high-density bonding layer through pressing and sintering, resulting in high bonding strength. *For more details, you can view the related links. Please refer to the PDF materials or feel free to contact us for more information.*

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Points to confirm for metal mask cleaning: How to choose cleaning agents and cleaning methods.

Points to confirm for metal mask cleaning: How to choose cleaning agents and cleaning methods.

It is possible to carry out cleaning with consideration for the environment! Introducing cleaning know-how.

This page provides an explanation of the key points to consider in metal mask cleaning. By selecting the appropriate cleaning agents and methods, it is possible to improve cleaning efficiency and work productivity, as well as reduce running costs, ensure worker safety, and implement environmentally considerate cleaning practices. Please check again. *For more details, you can view them through the related links. For further information, please refer to the PDF materials or feel free to contact us.

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The necessity of cleaning in 5G: Why is flux cleaning necessary?

The necessity of cleaning in 5G: Why is flux cleaning necessary?

A detailed explanation of why flux residue must be cleaned!

Last time, we introduced solutions to the technical challenges associated with 5G. We recommended using a spray method and water-based cleaning agents, but a question arose: is cleaning really necessary if coating is applied? Taking the above into consideration, I will explain why it is necessary to clean flux residues. *For more details, you can view the related links. Please refer to the PDF materials or feel free to contact us for more information.*

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Verification of cleaning properties of solder paste for fine bonding in joint research with Nippon Superior Co., Ltd.

Verification of cleaning properties of solder paste for fine bonding in joint research with Nippon Superior Co., Ltd.

A fundamental transformation is required for cleaning methods and cleaning agents! Introducing cleaning know-how.

Advanced electronic devices, such as 5G-compatible communication equipment and control units for electric vehicles, are becoming smaller and thinner. Consequently, the development of solder paste for fine bonding is becoming increasingly active. These electronic devices require long-term high reliability, and there is a growing trend for the need for flux cleaning. Due to high-density mounting and the diversification of components, there is an increase in electronic devices with low stand-off. *For more details, please refer to the related links. *The PDF document is a technical resource that explains the cleaning technology required for sintering bonding.

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Zero defects and half the cleaning time [Improvement case]

Zero defects and half the cleaning time [Improvement case]

About the flux cleaning of high-performance control boards! Introducing cleaning know-how.

In the flux cleaning of high-performance control boards, we adopted an organic solvent-based cleaning agent combined with a jet flow method. While this method was able to clean the exposed surfaces of the boards, it could not completely clean the underside of components with a standoff of less than 20μm, resulting in defects where the required performance was not achieved. This page introduces the method that solved this issue. *For more details, please refer to the related links. *The PDF document is a technical material that explains cleaning technology for advanced electronic components.

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Compliance with regulations and safety measures for cleaning agents! A step-by-step explanation of purchasing, using, and storing.

Compliance with regulations and safety measures for cleaning agents! A step-by-step explanation of purchasing, using, and storing.

Introducing regulations related to cleaning agents, taking into account efforts overseas!

In recent years, from the perspective of environmental conservation and human protection, countries have been strengthening regulations regarding the handling of chemical substances, and there is a global trend towards initiatives related to the SDGs (Sustainable Development Goals). In Japan, the Industrial Safety and Health Act will be revised in April 2024, strengthening the handling of chemical substances. To reduce health risks for workers and environmental burdens, some companies are moving to avoid procuring materials that have a significant environmental impact, and cleaning agents are no exception. Taking into account initiatives overseas, we will introduce regulations related to cleaning agents. *For detailed information, please refer to the related links. For further inquiries, feel free to contact us.*

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Ion Residues on Electronic Substrates and Their Analytical Methods [Free Download]

Ion Residues on Electronic Substrates and Their Analytical Methods [Free Download]

Examples of the analysis of the cleaning properties of surfactants are also included! We will also introduce ions and flux.

This document explains the analysis of ionic residues on electronic substrates that our company, as a cleaning agent manufacturer, has been working on. It includes explanations about ions and flux, as well as discussions on ion contamination measurement, ion chromatography, and scanning electron microscopy with energy dispersive X-ray spectroscopy. Additionally, it features case studies on the cleaning efficacy of surfactants. We encourage you to download it and read through it. 【Contents】 ■ Introduction ■ What are ionic residues? ■ Analysis of ionic residues remaining on electronic substrates ■ Case study - Cleaning efficacy of surfactants - ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

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Metal mask cleaning agent "ZESTRON SW" *Can be used without vacuum drying.

Metal mask cleaning agent "ZESTRON SW" *Can be used without vacuum drying.

Due to its wide applicability, it reliably removes cream solder from the back of the metal mask!

"ZESTRON SW" is a solvent-based cleaning agent with a high flash point, developed in collaboration with major SMT printer manufacturers, and can be used without vacuum drying. It excels in the reproducibility of cleaning results and improves the reliability of the printing process as it leaves no residue after drying. Unlike isopropanol (IPA, flash point: 12°C), this product (flash point: 67°C) significantly enhances safety during the operation of metal mask printers. 【Features】 ■ Dries quickly on the metal mask after wiping with a dry non-woven cloth, leaving no residue ■ Leads to good printing stability and a reduction in solder balls ■ Reduces the frequency of cleaning cycles ■ Biodegradable ■ Approved for use in SMT printers by major manufacturers worldwide *For more details, please refer to the PDF document or feel free to contact us.

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Three Key Points of Technological Evolution in Electronics Implementation and Cleaning

Three Key Points of Technological Evolution in Electronics Implementation and Cleaning

Trends in flux cleaning due to miniaturization! Introducing technical points in fine bonding products.

Electronics assembly refers to the technology of mounting electronic components onto a substrate. Specifically, it involves the process of joining components such as semiconductors, resistors, and capacitors to a printed circuit board to form an electrical circuit. The sizes of these components tend to become smaller in response to the demands for higher performance and space-saving in products, and accordingly, fine joining technologies are also evolving. This has a significant impact on the cleaning processes as well. We will explain the evolution of joining technologies and cleaning in fine joining. *For detailed content of the article, you can view it through the related links. For more information, please download the PDF or feel free to contact us.*

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Cleaning technology required for sintered joint devices [Technical Document]

Cleaning technology required for sintered joint devices [Technical Document]

Introduction to the specific sintering cleaning process! Discussion of the differences from flux cleaning, etc.

This document explains the cleaning techniques required for sintered joining devices. It discusses the background for the need for cleaning in sintered joining devices and the differences from flux cleaning, as well as introducing specific cleaning processes. It also includes information on the selection of cleaning agents and methods, as well as cleanliness analysis after cleaning. We encourage you to read it. 【Contents】 ■ Introduction ■ The formation of contamination and the effects of residues in sintered joining devices ■ Selection of cleaning agents and methods ■ Cleanliness analysis after cleaning ■ Cleaning case studies ■ Conclusion *For more details, please download the PDF or feel free to contact us.

  • Cleaning agents
  • Cleaning Machine

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SDGs in Electronic Device Cleaners [Free Technical Document Download]

SDGs in Electronic Device Cleaners [Free Technical Document Download]

Balancing cleanliness and safety! A must-read for reviewing electronic device cleaning agents.

This document explains the requirements for electronic devices to achieve the SDGs and how cleaning of electronic devices should be approached from the perspective of the SDGs. It is recommended for those who are concerned about wanting to achieve "cleaning that balances low-risk performance and cleaning performance" or wanting to know "the cleaning technologies required for electronic devices." We have included content on "Cleaning of electronic devices and the SDGs" and "The need for low-risk cleaning agents for electronic devices," so please take a moment to read it. 【Contents (partial)】 ■ Introduction ■ Cleaning of electronic devices and the SDGs ■ The need for low-risk cleaning agents for electronic devices ■ Cleaning performance required for electronic device cleaning agents ■ "Chemical analysis" to ensure more reliable cleaning *For more details, please refer to the PDF document or feel free to contact us.

  • Cleaning agents
  • Cleaning Machine

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What is an SDS (Safety Data Sheet)?

What is an SDS (Safety Data Sheet)?

Explanation of essential knowledge for evaluating, purchasing, and storing flux cleaning agents!

An SDS (Safety Data Sheet) is a document that contains important information regarding the handling of chemical substances, relevant regulations, disposal and transportation methods, as well as hazards and toxicity. The applicable regulations for flux cleaning agents, whether they have a flash point, precautions for use, the necessity of protective equipment, and disposal methods are detailed over more than 10 pages. In this article, we will explain important points that we particularly want you to pay attention to, as well as frequently asked questions. *For more detailed information, please refer to the related links. Feel free to contact us for further inquiries.*

  • Technical and Reference Books
  • Cleaning Machine

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Acrylic plate cleaner

Acrylic plate cleaner

We also accept orders for laboratory equipment and such.

Acrylic mirror finish processing, adhesive processing, and hole drilling (drilled in three stages at φ3.0, φ1.5, and φ0.3 to increase water pressure).

  • Other cleaning machines
  • Cleaning Machine

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