Takahashi Industrial's dicing frame cleaning device 'TFC Series'
A device that cleans and removes tape adhesive marks and fingerprints attached to the dicing frame using a unique jet nozzle with high cleaning capability!
The "TFC Series" uses jets to remove tape adhesive and fingerprints attached to the dicing frame used in the wafer cutting (dicing) process. Since there are no contact items like brushes, there is no degradation of cleaning performance due to secondary adhesion of adhesives. ■ Features - Non-contact cleaning mechanism that employs a unique jet nozzle with high cleaning performance → Since it does not use brush cleaning or cloths like wipes, there is no decrease in cleaning power due to clogging or re-adhesion. - Chemical cleaning method using organic solvents - High recovery rate of cleaning solution achieved through a vertical rotating mechanism - Compact size of 1,000mm × 1,500mm × 2,000mm - UV irradiation unit and tape removal unit can be installed (optional) *For more details, please refer to the PDF document or feel free to contact us.
- Company:JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
- Price:Other