Cleaning agents Product List and Ranking from 425 Manufacturers, Suppliers and Companies

Last Updated：Dec 03, 2025 Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

Cleaning agents Manufacturer, Suppliers and Company Rankings

Last Updated：Dec 03, 2025 Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

中部 Aichi//Trading company/Wholesale
アマダ（アマダグループ） Kanagawa//Industrial Machinery
null/null
4 ゼストロンジャパン Kanagawa//Chemical
5 NCH Japan（日本エヌ・シー・エイチ株式会社） Tokyo//Other manufacturing

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Cleaning agents Product ranking

Last Updated：Dec 03, 2025 Aggregation Period:Nov 05, 2025～Dec 02, 2025
This ranking is based on the number of page views on our site.

Technical Documentation: A Textbook on "Alternatives to Organic Solvents" That You Can't Ask About Now 中部
70% reduction in work without using thinner. Degreasing and cleaning online seminar. アマダ（アマダグループ）
Fluorine-based cleaning agent "AMOLEA AS-300"
4 Water-soluble degreasing cleaner "ND-165" NCH Japan（日本エヌ・シー・エイチ株式会社）
5 An environmentally friendly cleaning agent 'Aero Rinse' as an alternative to IPA and others! 中部

Cleaning agents Product List

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New Challenges in Cleaning: Optimization of Cleaning Methods [Materials]

The evolution of flux cleaning technology is also being questioned! We will publish what issues are at stake.

This document explains flux cleaning in high-performance products. When attempting to establish a cleaning process, we will introduce the issues that arise, taking into account the historical background. We have included images, diagrams, and detailed explanations regarding the ability to handle insoluble substances and the future of soldering cleaning, so please take a moment to read it. 【Contents (partial)】 ■ Introduction ■ Awareness of "Cleaning": Japan's Unique Environment ■ The Rise of Insoluble Substances ■ Ability to Handle Insoluble Substances (MPC Cleaning Agents) ■ The Future of Soldering Cleaning *For more details, please refer to the PDF document or feel free to contact us.

Company：ゼストロンジャパン
Price：Other

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What is flux residue? Diversification and analysis methods of flux residue.

Cleaning methods and post-cleaning analysis are recent challenges! We will introduce examples of issues caused by flux residues.

Flux residue refers to the residue derived from flux that remains on the workpiece after soldering (contamination), and its components include ions, metal salts, and organic substances. Cleaning paste is formulated with the premise of cleaning, so if left as is, the likelihood of insulation failure due to migration and corrosion increases. Depending on the application, this can also affect human life and infrastructure, making cleaning necessary in some cases. On the other hand, in the case of no-clean paste, the flux residue stabilizes, but the number of cases requiring cleaning for reliability assurance is also increasing. *For detailed content of the column, please refer to the related link. For more information, feel free to contact us.*

Company：ゼストロンジャパン
Price：Other

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Definition of Water-Based Cleaning Agents: The Nature and Challenges of Water-Based Cleaning Agents [Materials]

Polarization of cleaning demand and a new focus on water-based cleaning agents! Explanation of challenges, etc.

This document explains the definition of water-based cleaning agents and the technical challenges of solvent-based cleaning agents. From the perspective of the technical trends in solder and flux, it focuses on "ionic residues" and introduces the technical relevance to "water-based cleaning agents." This technical document is recommended for those who want to learn about water-based cleaning agents or the recent compositions of solder and flux. [Contents (partial)] ■ Introduction ■ Challenges during cleaning from the perspective of solder and flux composition ■ Why can water-based cleaning agents be considered effective for removing ionic residues? ■ Examples of cleaning agent classifications - Issues in Japan ■ Effects of moisture content differences and technical challenges *For more details, please refer to the PDF document or feel free to contact us.

Company：ゼストロンジャパン
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Other electronic parts

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Flux cleaner for printed circuit boards VIGON A 200

Ideal for cleaning low standoff components! Can be introduced into immersion tanks without explosion-proof specifications.

"VIGON A 200" is a water-based cleaning agent specially designed for use in high-pressure and medium-pressure spray equipment, such as inline and batch systems. Based on MPC technology, it is capable of removing various types of flux residues from electronic substrates, ceramic substrates, power modules, and lead frames. It meets high cleanliness requirements for subsequent processes such as wire bonding and coating. 【Features】 - Maintains high cleanliness for wire bonding and coating processes - Free of surfactants and excellent rinsability, leaving no residues on surfaces - Easily filterable, extending liquid life and reducing cleaning agent costs - No flash point, allowing for introduction into immersion tanks without explosion-proof specifications - Does not foam even in high-pressure spray applications - Halogen-free and low odor *For more details, please refer to the PDF document or feel free to contact us.

Company：ゼストロンジャパン
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Water-based flux cleaner for power semiconductors VIGON PE215N

No ignition point! Prevents re-oxidation of copper substrates with effective rinsing! Long-term protection of activated copper substrates.

"VIGON PE 215N" is a neutral water-based cleaning agent specifically designed for spray cleaning devices. Thanks to MPC technology, it can reliably remove flux residues from power electronics components, making it particularly suitable for cleaning power modules after die attachment and heat sink soldering. Additionally, it excels in material compatibility and the removal of copper oxide films, which enhances the subsequent processes of wire bonding/adhesive bonding and molding, as it is also effective in removing oxide films from copper substrates. 【Features】 ■ Excellent for cleaning flux from power electronics and power modules ■ Provides activated copper substrates for applications such as adhesive bonding ■ pH neutral, with excellent material compatibility with dies, and does not damage passivation ■ No flash point or foaming, making it suitable for spray cleaning machines without explosion-proof specifications *For more details, please refer to the PDF document or feel free to contact us.

Company：ゼストロンジャパン
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Water-based cleaning agent for metal masks VIGON TC 150

Water-based cleaning agent for conductive paste, also usable for removing silver sinter paste from metal masks and screen plates!

We would like to introduce our water-based cleaning agent for conductive paste, 'VIGON TC 150'. This product is specially designed to remove silicone-based and silicone-free conductive pastes, as well as silver and aluminum conductive pastes, from metal masks and screen plates. It can also be used for the removal of silver sintered paste. 【Features】 ■ Excellent cleaning performance for conductive pastes ■ Capable of removing silver sintered paste from metal masks and screen plates ■ A water-based cleaning agent that can replace traditional solvent-based cleaners ■ Improves health and safety for operators due to being water-based ■ Can be used in spray equipment without explosion-proof specifications as it has no flash point *For more details, please refer to the PDF document or feel free to contact us.

Company：ゼストロンジャパン
Price：Other

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Cleaning agent for co-solvent processes ZESTRON CO 150

Combined with HFE-based cleaning agents, it becomes a process that does not use water! Achieving quick drying without residues.

"ZESTRON CO 150" is a solvent-based cleaning agent specifically designed for ultrasonic immersion processes. It can be used for pre-cleaning in combination with HFE-based cleaning agents without dilution, or as a co-solvent. It is particularly suitable for cleaning flux residues from eutectic and lead-free no-clean solder on electronic components, power modules, and lead frame-based discrete components. 【Features】 ■ Excellent cleaning performance for eutectic and lead-free solder ■ Improved quality in wire bonding and molding ■ Provides a stable cleaning process due to its composition that is less prone to boiling ■ Allows for a wide range of concentration management in process control ■ Stabilizes the cooling process and contributes to minimizing HFE consumption ■ Since it does not use water, it is possible to keep ion contamination levels low *For more details, please refer to the PDF document or feel free to contact us.

Company：ゼストロンジャパン
Price：Other

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Dispenser Nozzle Cleaning Agent ZESTRON HC

With a removable dispenser nozzle for SMT bond removal, cleaning can be done easily!

"ZESTRON HC" is an improved alcohol-based cleaning agent developed for the removal of SMT adhesive from tools such as dispenser nozzles. It can also be used for the removal of solder particles and dust from mounter nozzles. To facilitate easy use for manual cleaning, it is provided in an aerosol can. 【Features】 ■ Effectively removes SMT adhesive from dispenser nozzles and tools ■ Quick-drying and leaves no residue ■ Halogen-free organic solvent ■ Capable of removing solder particles and dust from mounter nozzles *For more details, please refer to the PDF document or feel free to contact us.

Company：ゼストロンジャパン
Price：Other

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Cleaning agent for metal masks ZESTRON SD 100

Low odor, usable at room temperature! Cream solder cleaning agent for metal masks and screens.

"ZESTRON SD 100" is a solvent-based cleaning agent specially designed for removing cream solder from metal masks, using an explosion-proof spray-type cleaning machine. Depending on the type of flux, it can also be used on misprinted circuit boards. Furthermore, it can be used for back wiping in printing machines and for manual wiping cleaning. Additionally, this product has been approved for use by major manufacturers worldwide in metal mask printers. 【Features】 ■ High contamination retention, leading to long life and reduced maintenance time ■ Excellent drying properties, contributing to shorter cleaning times ■ Low odor, suitable for use at room temperature ■ Suitable for manual wiping cleaning of metal masks and back wiping in printing machines *For more details, please refer to the PDF document or feel free to contact us.

Company：ゼストロンジャパン
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Cleaning agent for metal masks ZESTRON SD 301

Due to its high contamination retention capability, it has a long lifespan and reduces cleaning costs!

"ZESTRON SD 301" is a solvent-based cleaning agent for removing cream solder, SMT adhesives, and thick film pastes using explosion-proof spray cleaning machines from metal masks and screens. It has quick-drying properties, allowing for a reduction in the cleaning process time. It is also effective for cleaning printed circuit boards with printing errors. Due to its high flash point, it can be used for hand wipe cleaning and backside wiping on printing machines. 【Features】 ■ Capable of removing flux residues ■ Long lifespan and reduced cleaning costs due to high contamination retention capability ■ Very fast drying time, enabling a reduction in the cleaning process ■ Usable at room temperature *For more details, please refer to the PDF document or feel free to contact us.

Company：ゼストロンジャパン
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Water-based cleaning agent for metal masks - HYDRON SC 300

Since the water-based cleaning agent has no flash point, explosion-proof specifications are not required for the cleaning equipment!

The "HYDRON SC 300" is a water-based cleaning agent developed for cleaning metal masks. It reliably removes cream solder and SMT adhesives at room temperature without leaving any residue on the surface of the metal mask. Additionally, it can be used in both the cleaning and rinsing processes, dries without leaving any cleaning agent residue, and can also be used for wiping the back of printing machines. 【Features】 ■ Exhibits excellent effectiveness in cleaning cream solder and adhesives, leaving no residue ■ Usable in both cleaning and rinsing processes ■ Dries without leaving residue on the metal mask ■ Does not foam even when using a spray cleaning machine ■ Contains less than 20% VOC, implementing environmental measures ■ Excellent material compatibility with metal masks *For more details, please refer to the PDF document or feel free to contact us.

Company：ゼストロンジャパン
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Pitfalls of Flux Cleaning with Solvent-Based Cleaners

Are you overlooking ion residues? An explanation of the pitfalls of flux cleaning.

Organic solvents, which are used in various fields, are currently an indispensable part of the chemical industry, and it is difficult to completely stop their use. In recent years, due to technological advancements and corporate efforts in various industries, the amount of organic solvents used and their atmospheric emissions have been significantly reduced. However, in the flux cleaning of electronic devices in Japan, cleaning agents primarily based on organic solvents are widely used. However, flux cleaning has essentially transformed into "complex residue cleaning," and while solvent-based cleaning agents are very effective against organic components such as rosin, they are almost unable to dissolve ionic substances or insoluble metal salts, making removal by "dissolution" methods difficult. *For more detailed information, please refer to the related links. For further details, please check the PDF materials or feel free to contact us.*

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Examples of technical challenges related to 5G

Behind the scenes of 5G development by the responsible company! Introducing cleaning know-how.

"5G," which has gained even more attention due to the new coronavirus. In Japan, commercial services started in the spring of 2020, and it is said to have an impact not only on mobile phones but also in various fields such as automobiles, industrial equipment, and healthcare. Since it is a technology that has evolved further from 4G, it is easy to imagine that there were many challenges in its development. Curious about the background, I spoke with companies involved in the development of 5G. *For more details, you can view the related links. Please refer to the PDF materials or feel free to contact us for more information.*

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Examples of technical challenges related to 5G [Joint Research]

We will introduce an example of how to actually solve the technical challenges associated with 5G!

On this page, we will discuss how to solve the technical challenges associated with 5G, providing an example of a solution. In the previous discussion, we learned that there are cases in 5G-related work where failure can occur if cleaning is not performed. Now, regarding "how to clean," there are important points to consider in the case of 5G work. *For detailed information, please refer to the related links. For more information, please check the PDF materials or feel free to contact us.*

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Relationship between implementation components and ion residues [Joint research with Mr. Hiroki]

By selecting cleaning solder paste and flux, you can ensure more reliable cleanliness!

The theme of this discussion is ions, which are essential for electronic devices. However, unintended ions can remain on the device surface, between electrodes, or in low stand-off areas, resulting in "ion residue." Moreover, since these residues can be supplied from various contamination pathways that include not only raw material factors but also environmental factors, achieving a residual amount of zero is technically very challenging. In this instance, we have collaborated with solder manufacturers to assess the ion residue levels for each implemented component. *For more detailed information, please refer to the related links. *The PDF document is a technical resource that explains the issues and analysis methods related to ion residue.