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Cleaning agents Product List and Ranking from 428 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Dec 31, 2025～Jan 27, 2026
This ranking is based on the number of page views on our site.

Cleaning agents Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Dec 31, 2025～Jan 27, 2026
This ranking is based on the number of page views on our site.

  1. ゼストロンジャパン Kanagawa//Chemical
  2. NCH Japan（日本エヌ・シー・エイチ株式会社） Tokyo//Other manufacturing
  3. カネコ化学 Saitama//Chemical
  4. 4 中部 Aichi//Trading company/Wholesale
  5. 5 アルボース 東京支店　 Tokyo//Pharmaceuticals and Biotechnology
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Cleaning agents Product ranking

Last Updated： Aggregation Period:Dec 31, 2025～Jan 27, 2026
This ranking is based on the number of page views on our site.

  1. Disinfectant and cleaning agent "Albos Sanitizer EX" アルボース 東京支店　
  2. Water-soluble degreasing cleaner "ND-165" NCH Japan（日本エヌ・シー・エイチ株式会社）
  3. Chlorinated alkaline cleaner for forming in food factories "Topaz CL3" エコラボ フード＆ビバレッジ事業部
  4. 4 Fluorine-based cleaning agent "AMOLEA AS-300"
  5. 4 Cleaning agent 日本整備

Cleaning agents Product List

916～930 item / All 1654 items

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Zestron Japan Co., Ltd. Product Catalog

Zestron Japan Co., Ltd. Product Catalog

For cleaning flux on printed circuit boards! A variety of water-based and solvent-based cleaners are available.

This catalog introduces the product lineup of Zestron Japan Co., Ltd. It includes examples of products suitable for situations such as "printed circuit board cleaning" and "package and wafer cleaning," as well as applications and features. We also provide explanations of each product's technology and brand, along with the lineup. Please make use of this information when selecting products. [Contents (partial)] ■ Cleaning process introduction flow ■ Printed circuit board cleaning ■ Flux removal for power electronics ■ Package and wafer cleaning ■ Cleaning of metal masks, screens, and misprinted circuit boards *For more details, please refer to the PDF document or feel free to contact us.

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Transport chain inside the fraxer: Spray cleaner VIGON RC303

Transport chain inside the fraxer: Spray cleaner VIGON RC303

Ideal for cleaning areas that cannot be removed, thanks to its spray bottle design!

VIGON RC 303 is a spray bottle type water-based flux cleaner designed for non-removable areas (such as the fracas chain, around internal devices like transport claws, inside reflow/flow ovens (walls), and fracas boxes). By switching from a solvent to VIGON RC 303, the maintenance frequency has decreased from once a week to once a month, and the amount of maintenance work has been reduced to one-fourth. Additionally, being water-based, it is non-flammable and not subject to applicable regulations. Please feel free to consult us when needed. 【Features】 ■ High cleaning performance and long lifespan ■ Time-saving as it can be cleaned before the equipment cools down ■ Difficult to volatilize due to being water-based *For more details, please refer to the PDF document or feel free to contact us.

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Aiming for coexistence and mutual prosperity with ions: Issues and analytical methods of ion residues [Materials]

Aiming for coexistence and mutual prosperity with ions: Issues and analytical methods of ion residues [Materials]

The world of electronics at a crossroads! An explanation of the challenges and analysis methods of ion residues using specific examples!

This document explains the issues and analysis methods related to ion residues. Focusing on the complex theme of "ions," it introduces the current challenges that exist. It includes factors contributing to ion residues, the significance of flux cleaning, and specific examples, along with diagrams and detailed explanations, so please feel free to download and take a look. 【Contents (partial)】 ■ Introduction ■ What are ions? ■ Factors of ion residues ■ Significance of flux cleaning ■ Specific examples ■ Cleaning primarily using organic solvents *For more details, please refer to the PDF document or feel free to contact us.

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Evolution of Joining Techniques and Cleaning - Cleaning Technologies Required for Sintered Joining - [Materials]

Evolution of Joining Techniques and Cleaning - Cleaning Technologies Required for Sintered Joining - [Materials]

The evolution of power semiconductors continues! An explanation of the effects achieved through cleaning.

This document explains the relationship between sintering bonding and cleaning, as well as the effects of cleaning. It introduces "sintering," which is gaining attention as a new bonding technology in the power semiconductor field. It discusses how sintering bonding and cleaning are related and what effects can be achieved through cleaning. Please take a moment to read it. 【Contents (partial)】 ■ What is "sintering" ■ Methods of sintering bonding ■ Why "sintering" is needed ■ Challenges in sintering bonding ■ An era where new considerations for cleaning methods are necessary *For more details, please refer to the PDF document or feel free to contact us.

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New Challenges in Cleaning: Optimization of Cleaning Methods [Materials]

New Challenges in Cleaning: Optimization of Cleaning Methods [Materials]

The evolution of flux cleaning technology is also being questioned! We will publish what issues are at stake.

This document explains flux cleaning in high-performance products. When attempting to establish a cleaning process, we will introduce the issues that arise, taking into account the historical background. We have included images, diagrams, and detailed explanations regarding the ability to handle insoluble substances and the future of soldering cleaning, so please take a moment to read it. 【Contents (partial)】 ■ Introduction ■ Awareness of "Cleaning": Japan's Unique Environment ■ The Rise of Insoluble Substances ■ Ability to Handle Insoluble Substances (MPC Cleaning Agents) ■ The Future of Soldering Cleaning *For more details, please refer to the PDF document or feel free to contact us.

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What is flux residue? Diversification and analysis methods of flux residue.

What is flux residue? Diversification and analysis methods of flux residue.

Cleaning methods and post-cleaning analysis are recent challenges! We will introduce examples of issues caused by flux residues.

Flux residue refers to the residue derived from flux that remains on the workpiece after soldering (contamination), and its components include ions, metal salts, and organic substances. Cleaning paste is formulated with the premise of cleaning, so if left as is, the likelihood of insulation failure due to migration and corrosion increases. Depending on the application, this can also affect human life and infrastructure, making cleaning necessary in some cases. On the other hand, in the case of no-clean paste, the flux residue stabilizes, but the number of cases requiring cleaning for reliability assurance is also increasing. *For detailed content of the column, please refer to the related link. For more information, feel free to contact us.*

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Definition of Water-Based Cleaning Agents: The Nature and Challenges of Water-Based Cleaning Agents [Materials]

Definition of Water-Based Cleaning Agents: The Nature and Challenges of Water-Based Cleaning Agents [Materials]

Polarization of cleaning demand and a new focus on water-based cleaning agents! Explanation of challenges, etc.

This document explains the definition of water-based cleaning agents and the technical challenges of solvent-based cleaning agents. From the perspective of the technical trends in solder and flux, it focuses on "ionic residues" and introduces the technical relevance to "water-based cleaning agents." This technical document is recommended for those who want to learn about water-based cleaning agents or the recent compositions of solder and flux. [Contents (partial)] ■ Introduction ■ Challenges during cleaning from the perspective of solder and flux composition ■ Why can water-based cleaning agents be considered effective for removing ionic residues? ■ Examples of cleaning agent classifications - Issues in Japan ■ Effects of moisture content differences and technical challenges *For more details, please refer to the PDF document or feel free to contact us.

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Flux cleaner for printed circuit boards VIGON A 200

Flux cleaner for printed circuit boards VIGON A 200

Ideal for cleaning low standoff components! Can be introduced into immersion tanks without explosion-proof specifications.

"VIGON A 200" is a water-based cleaning agent specially designed for use in high-pressure and medium-pressure spray equipment, such as inline and batch systems. Based on MPC technology, it is capable of removing various types of flux residues from electronic substrates, ceramic substrates, power modules, and lead frames. It meets high cleanliness requirements for subsequent processes such as wire bonding and coating. 【Features】 - Maintains high cleanliness for wire bonding and coating processes - Free of surfactants and excellent rinsability, leaving no residues on surfaces - Easily filterable, extending liquid life and reducing cleaning agent costs - No flash point, allowing for introduction into immersion tanks without explosion-proof specifications - Does not foam even in high-pressure spray applications - Halogen-free and low odor *For more details, please refer to the PDF document or feel free to contact us.

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Water-based flux cleaner for power semiconductors VIGON PE215N

Water-based flux cleaner for power semiconductors VIGON PE215N

No ignition point! Prevents re-oxidation of copper substrates with effective rinsing! Long-term protection of activated copper substrates.

"VIGON PE 215N" is a neutral water-based cleaning agent specifically designed for spray cleaning devices. Thanks to MPC technology, it can reliably remove flux residues from power electronics components, making it particularly suitable for cleaning power modules after die attachment and heat sink soldering. Additionally, it excels in material compatibility and the removal of copper oxide films, which enhances the subsequent processes of wire bonding/adhesive bonding and molding, as it is also effective in removing oxide films from copper substrates. 【Features】 ■ Excellent for cleaning flux from power electronics and power modules ■ Provides activated copper substrates for applications such as adhesive bonding ■ pH neutral, with excellent material compatibility with dies, and does not damage passivation ■ No flash point or foaming, making it suitable for spray cleaning machines without explosion-proof specifications *For more details, please refer to the PDF document or feel free to contact us.

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Water-based cleaning agent for metal masks VIGON TC 150

Water-based cleaning agent for metal masks VIGON TC 150

Water-based cleaning agent for conductive paste, also usable for removing silver sinter paste from metal masks and screen plates!

We would like to introduce our water-based cleaning agent for conductive paste, 'VIGON TC 150'. This product is specially designed to remove silicone-based and silicone-free conductive pastes, as well as silver and aluminum conductive pastes, from metal masks and screen plates. It can also be used for the removal of silver sintered paste. 【Features】 ■ Excellent cleaning performance for conductive pastes ■ Capable of removing silver sintered paste from metal masks and screen plates ■ A water-based cleaning agent that can replace traditional solvent-based cleaners ■ Improves health and safety for operators due to being water-based ■ Can be used in spray equipment without explosion-proof specifications as it has no flash point *For more details, please refer to the PDF document or feel free to contact us.

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Cleaning agent for co-solvent processes ZESTRON CO 150

Cleaning agent for co-solvent processes ZESTRON CO 150

Combined with HFE-based cleaning agents, it becomes a process that does not use water! Achieving quick drying without residues.

"ZESTRON CO 150" is a solvent-based cleaning agent specifically designed for ultrasonic immersion processes. It can be used for pre-cleaning in combination with HFE-based cleaning agents without dilution, or as a co-solvent. It is particularly suitable for cleaning flux residues from eutectic and lead-free no-clean solder on electronic components, power modules, and lead frame-based discrete components. 【Features】 ■ Excellent cleaning performance for eutectic and lead-free solder ■ Improved quality in wire bonding and molding ■ Provides a stable cleaning process due to its composition that is less prone to boiling ■ Allows for a wide range of concentration management in process control ■ Stabilizes the cooling process and contributes to minimizing HFE consumption ■ Since it does not use water, it is possible to keep ion contamination levels low *For more details, please refer to the PDF document or feel free to contact us.

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Dispenser Nozzle Cleaning Agent ZESTRON HC

Dispenser Nozzle Cleaning Agent ZESTRON HC

With a removable dispenser nozzle for SMT bond removal, cleaning can be done easily!

"ZESTRON HC" is an improved alcohol-based cleaning agent developed for the removal of SMT adhesive from tools such as dispenser nozzles. It can also be used for the removal of solder particles and dust from mounter nozzles. To facilitate easy use for manual cleaning, it is provided in an aerosol can. 【Features】 ■ Effectively removes SMT adhesive from dispenser nozzles and tools ■ Quick-drying and leaves no residue ■ Halogen-free organic solvent ■ Capable of removing solder particles and dust from mounter nozzles *For more details, please refer to the PDF document or feel free to contact us.

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Cleaning agent for metal masks ZESTRON SD 100

Cleaning agent for metal masks ZESTRON SD 100

Low odor, usable at room temperature! Cream solder cleaning agent for metal masks and screens.

"ZESTRON SD 100" is a solvent-based cleaning agent specially designed for removing cream solder from metal masks, using an explosion-proof spray-type cleaning machine. Depending on the type of flux, it can also be used on misprinted circuit boards. Furthermore, it can be used for back wiping in printing machines and for manual wiping cleaning. Additionally, this product has been approved for use by major manufacturers worldwide in metal mask printers. 【Features】 ■ High contamination retention, leading to long life and reduced maintenance time ■ Excellent drying properties, contributing to shorter cleaning times ■ Low odor, suitable for use at room temperature ■ Suitable for manual wiping cleaning of metal masks and back wiping in printing machines *For more details, please refer to the PDF document or feel free to contact us.

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Cleaning agent for metal masks ZESTRON SD 301

Cleaning agent for metal masks ZESTRON SD 301

Due to its high contamination retention capability, it has a long lifespan and reduces cleaning costs!

"ZESTRON SD 301" is a solvent-based cleaning agent for removing cream solder, SMT adhesives, and thick film pastes using explosion-proof spray cleaning machines from metal masks and screens. It has quick-drying properties, allowing for a reduction in the cleaning process time. It is also effective for cleaning printed circuit boards with printing errors. Due to its high flash point, it can be used for hand wipe cleaning and backside wiping on printing machines. 【Features】 ■ Capable of removing flux residues ■ Long lifespan and reduced cleaning costs due to high contamination retention capability ■ Very fast drying time, enabling a reduction in the cleaning process ■ Usable at room temperature *For more details, please refer to the PDF document or feel free to contact us.

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Water-based cleaning agent for metal masks - HYDRON SC 300

Water-based cleaning agent for metal masks - HYDRON SC 300

Since the water-based cleaning agent has no flash point, explosion-proof specifications are not required for the cleaning equipment!

The "HYDRON SC 300" is a water-based cleaning agent developed for cleaning metal masks. It reliably removes cream solder and SMT adhesives at room temperature without leaving any residue on the surface of the metal mask. Additionally, it can be used in both the cleaning and rinsing processes, dries without leaving any cleaning agent residue, and can also be used for wiping the back of printing machines. 【Features】 ■ Exhibits excellent effectiveness in cleaning cream solder and adhesives, leaving no residue ■ Usable in both cleaning and rinsing processes ■ Dries without leaving residue on the metal mask ■ Does not foam even when using a spray cleaning machine ■ Contains less than 20% VOC, implementing environmental measures ■ Excellent material compatibility with metal masks *For more details, please refer to the PDF document or feel free to contact us.

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